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公开(公告)号：US20240131673A1
公开(公告)日：2024-04-25
申请号：US17847582
申请日：2022-06-22
Applicant: MAKITA CORPORATION
Inventor： Isao MIYASHITA , Hiroto SHIMOMAE , Hideki MATSUSHIMA
CPC classification number: B25C1/047 , C23C14/04 , C23C14/0641 , C23C14/34
Abstract: A base material is subjected to a low-temperature tempering treatment at a temperature equal to or less than 300° C. After the tempering treatment, a coating is applied to the base material by a sputtering method.
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公开(公告)号：US11920233B2
公开(公告)日：2024-03-05
申请号：US18173688
申请日：2023-02-23
Applicant: Samsung Display Co., Ltd.
Inventor： Choong-Ho Lee , Jung-Min Lee
CPC classification number: C23C14/04 , C23C14/24 , C23C14/243 , C23C16/042 , C23C16/04 , Y10T29/49826 , Y10T29/49828
Abstract: A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus includes a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; and a barrier wall assembly including a plurality of barrier walls arranged in the first direction so as to partition a space between the first nozzle and the second nozzle.
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公开(公告)号：US20240052474A1
公开(公告)日：2024-02-15
申请号：US18228892
申请日：2023-08-01
Applicant: Universal Display Corporation
Inventor： William E. QUINN , Gregory MCGRAW , Craig Anthony OUTTEN , Roman KOROTKOV , Seckin GOKALTUN
IPC: C23C14/04
CPC classification number: C23C14/04 , H10K71/135
Abstract: Devices suitable for use in OVJP and similar deposition techniques are provided that include multiple delivery apertures that are uncoupled from one another, allowing for more plateau-like deposition profiles. Fabrication techniques for such devices are also provided in which multiple wafers are etched and laminated to one another to form a monolithic depositor block.
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公开(公告)号：US11851750B2
公开(公告)日：2023-12-26
申请号：US17384058
申请日：2021-07-23
Applicant: TOKYO ELECTRON LIMITED
Inventor： Masato Shinada , Einstein Noel Abarra , Hiroyuki Toshima , Shota Ishibashi
CPC classification number: C23C14/354 , C23C14/04 , H01J37/3447 , G02B27/30
Abstract: An apparatus for performing a sputtering process on a substrate is provided. The apparatus includes a processing chamber having a substrate support on which the substrate is placed, a target for emitting target particles to be adhered to the substrate by plasma formed in the processing chamber, a magnet, provided on a rear surface of the target, for adjusting a state of the plasma on the surface of the target, and a magnet moving mechanism for repeatedly moving the magnet between a position on one side and a position on the other side set across a center portion on the rear surface of the target. The apparatus further includes a collimator having two regulating plates for limiting an incident angle of the target particles to the substrate, and an arrangement position adjustment mechanism adjusting positions of the two regulating plates according to the movement of the magnet.
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公开(公告)号：US11843104B2
公开(公告)日：2023-12-12
申请号：US16464564
申请日：2018-04-26
Applicant: LG CHEM, LTD.
Inventor： Ohbyong Chae , Yoonah Kang , Junhyuk Song , Eun Kyung Kim , Sangwook Woo
IPC: H01M4/48 , H01M4/04 , H01M4/134 , H01M4/1395 , H01M4/38 , H01M4/66 , H01M10/052 , B05D1/32 , C23C14/04 , C23C16/04 , H01M10/04 , H01M10/058 , H01M4/02
CPC classification number: H01M4/0421 , B05D1/32 , C23C14/04 , C23C16/04 , H01M4/134 , H01M4/1395 , H01M4/382 , H01M4/661 , H01M10/04 , H01M10/052 , H01M10/058 , H01M2004/021 , H01M2004/027
Abstract: A method for manufacturing a negative electrode for a lithium secondary battery including a patterned lithium metal that homogenizes the electron distribution in the lithium electrode and prevents the growth of the lithium dendrites when driving the lithium secondary battery.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20230220535A1
公开(公告)日：2023-07-13
申请号：US18122644
申请日：2023-03-16
Applicant: Samsung Display Co, Ltd.
Inventor： Jae Suk MOON , Young Eun RYU , Soo Hyun MIN , Taek Kyo KANG , Min Ju KIM
CPC classification number: C23C14/042 , H10K71/00 , C23C14/24 , C23C14/04 , H10K71/166
Abstract: A mask assembly includes: a mask frame; a mask supported by the mask frame, the mask including a plurality of pattern holes; and a magnetic part disposed on one surface of the mask. The magnetic part provides a magnetic force between the mask and a target substrate and improves an adhesion between the mask and the target substrate to prevent deposition defects.
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公开(公告)号：US20190218655A1
公开(公告)日：2019-07-18
申请号：US16324703
申请日：2017-07-28
Applicant: Universal Display Corporation
Inventor： Gregory MCGRAW , William E. QUINN , William T. MAYWEATHER, III , Gregg KOTTAS , Xin XU
CPC classification number: C23C14/228 , C23C14/04 , C23C14/12 , H01L51/001 , H01L51/004 , H01L51/56
Abstract: OVJP depositors having an exhaust aperture incorporated into the center of a flow retarder (510) are provided. Multiple flow retarders may be used to increase uniformity for applications such as OLED lighting that require larger features. Flow retarders may transect a delivery aperture completely or may extend part way through its length.
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公开(公告)号：US20190203338A1
公开(公告)日：2019-07-04
申请号：US16302302
申请日：2017-05-23
Applicant: Dai Nippon Printing Co. Ltd.
Inventor： Hiroshi KAWASAKI , Toshihiko TAKEDA
CPC classification number: C23C14/042 , C23C14/04 , C23C14/24 , H01L51/0011 , H01L51/50 , H01L51/5012 , H05B33/10
Abstract: There is provided a vapor deposition mask including: a resin mask including a plurality of resin mask openings corresponding to a pattern to be produced by vapor deposition; and a metal mask including a metal mask opening, the resin mask and the metal mask being stacked such that the resin mask openings overlap with the metal mask opening, wherein the metal mask includes one or a plurality of rigidity adjustment parts that partially reduce rigidity of the metal mask at a position not overlapping with the resin mask openings of the resin mask.
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公开(公告)号：US20190189964A1
公开(公告)日：2019-06-20
申请号：US16285126
申请日：2019-02-25
Inventor： Jiangjiang Jin , Hsianglun Hsu
CPC classification number: H01L51/5256 , C23C14/04 , H01L51/56
Abstract: An OLED package structure includes a first outer bound confinement layer formed on an OLED device, a first outer bound confinement layer arranged on the first inorganic layer and enclosing and delimiting a confinement space, a first organic layer formed on the first inorganic layer in the confinement space, and a second inorganic layer arranged on the first organic layer and the first outer bound confinement layer, such that a peripheral portion of the second inorganic layer is positioned on and supported by the first outer bound confinement layer and a central portion of the second inorganic layer is partly received in the confinement space to have a bottom of the second inorganic layer positioned on and contacting a top of the first organic layer.
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公开(公告)号：US20180119267A1
公开(公告)日：2018-05-03
申请号：US15857365
申请日：2017-12-28
Applicant: Samsung Display Co., Ltd.
Inventor： Choong-Ho Lee , Jung-Min Lee
CPC classification number: C23C14/04 , C23C14/24 , C23C14/243 , C23C16/04 , C23C16/042 , Y10T29/49826 , Y10T29/49828
Abstract: A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus includes a deposition source; a first nozzle disposed at a side of the deposition source and including a plurality of first slits arranged in a first direction; a second nozzle disposed opposite to the first nozzle and including a plurality of second slits arranged in the first direction; and a barrier wall assembly including a plurality of barrier walls arranged in the first direction so as to partition a space between the first nozzle and the second nozzle.
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