公开(公告)号：US20090148710A1

公开(公告)日：2009-06-11

申请号：US12314206

申请日：2008-12-05

申请人： Beom Joon Cho ,  Jong Myeon Lee

发明人： Beom Joon Cho ,  Jong Myeon Lee

IPC分类号： B32B17/06

CPC分类号： H01L23/49833 ,  H01L23/055 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2924/30107 ,  Y10S428/901 ,  Y10T428/24926 ,  Y10T428/24942 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.

摘要翻译： 提供层压陶瓷包装。 层压陶瓷封装包括其中具有导电图案的层叠陶瓷基板，层叠陶瓷基板上的第一陶瓷层和第一陶瓷层上的第二陶瓷层。 第一陶瓷层的烧制面积收缩率为约1％以下。 第二陶瓷层具有从第一陶瓷层接收电子部件的空腔和不同的烧制收缩率。

公开(公告)号：US20090130473A1

公开(公告)日：2009-05-21

申请号：US12271378

申请日：2008-11-14

申请人： Beom Joon CHO ,  Jong Myeon LEE ,  Soo Hyun LYOO ,  Ho Sung CHOO

发明人： Beom Joon CHO ,  Jong Myeon LEE ,  Soo Hyun LYOO ,  Ho Sung CHOO

IPC分类号： B32B27/00 ,  B05D3/00

CPC分类号： B28B1/30 ,  B28B5/027 ,  C04B35/62218 ,  C04B2235/96 ,  C04B2235/9615 ,  H01G4/129 ,  H01G4/308 ,  H01G13/00 ,  Y10T428/31786 ,  Y10T428/31971

摘要： Provided is a carrier film for forming a ceramic green sheet. The carrier film includes a film-type base material for fabricating the ceramic green sheet, a binder layer disposed on the film-type base material, the binder layer being formed of a binder resin, and a delamination layer disposed on a bottom surface of the carrier film, the delamination layer being formed of a resin having a releasing property. Also, provided is a method for fabricating a ceramic green sheet. The method includes preparing a carrier film for forming the ceramic green sheet including a binder layer, coating a ceramic slurry onto the carrier film, and drying the coated ceramic slurry to form the ceramic green sheet.

摘要翻译： 提供一种用于形成陶瓷生片的载体膜。 载体膜包括用于制造陶瓷生片的膜型基材，设置在膜型基材上的粘合剂层，粘合剂层由粘合剂树脂形成，以及分层层，设置在所述粘合剂层的底表面上 载体膜，剥离层由具有剥离性的树脂形成。 另外，提供一种陶瓷生片的制造方法。 该方法包括制备用于形成包含粘合剂层的陶瓷生片的载体膜，在载体膜上涂覆陶瓷浆料，并干燥涂覆的陶瓷浆料以形成陶瓷生片。

公开(公告)号：US08753462B2

公开(公告)日：2014-06-17

申请号：US12476216

申请日：2009-06-01

申请人： Beom Joon Cho ,  Eun Tae Park ,  Hyoung Ho Kim

发明人： Beom Joon Cho ,  Eun Tae Park ,  Hyoung Ho Kim

IPC分类号： C03B29/00

CPC分类号： H05K3/4611 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1366 ,  H05K2203/308 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

摘要翻译： 公开了一种制造非闪烁多层陶瓷基板的方法。 该方法包括在多个陶瓷生片中的至少一个中形成至少一个导电通孔和电极图案，层压陶瓷生片以形成陶瓷层压体，选择性地形成耐烧结粉末的收缩抑制薄膜 在陶瓷层叠体的两个表面的至少一个表面中包括导电通孔及其周边的区域，使用气溶胶沉积，设置用于抑制陶瓷层压体在陶瓷层压体的两个表面中的至少一个上的收缩的收缩抑制生片 包括用于形成非烧结多层陶瓷衬底的收缩抑制薄膜，以及烧结非烧结多层陶瓷衬底。

公开(公告)号：US20120199270A1

公开(公告)日：2012-08-09

申请号：US13448259

申请日：2012-04-16

申请人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

发明人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC分类号： B32B37/06 ,  B32B38/10

CPC分类号： H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

摘要： Provided are a method of manufacturing a multi-layer ceramic substrate. The method includes preparing a non-sintered ceramic laminated structure formed of a plurality of ceramic green sheets; preparing one or more constraining green sheets comprising a first constraining layer formed of a first inorganic powder having a first particle diameter and a second constraining layer formed of a second inorganic powder having a second particle diameter larger than the first particle diameter; disposing the constraining green sheets on the top and the bottom of the ceramic laminated structure; and firing the ceramic laminated structure at a predetermined firing temperature.

摘要翻译： 提供一种制造多层陶瓷基板的方法。 该方法包括制备由多个陶瓷生片形成的非烧结陶瓷层压结构; 制备一个或多个约束生片，其包括由具有第一粒径的第一无机粉末和由具有大于第一粒径的第二粒径的第二无机粉末形成的第二约束层形成的第一约束层; 将约束生片设置在陶瓷层叠结构的顶部和底部; 并在预定的烧制温度下烧制陶瓷层叠结构。

公开(公告)号：US07951446B2

公开(公告)日：2011-05-31

申请号：US12265561

申请日：2008-11-05

申请人： Beom Joon Cho ,  Jong Myeon Lee ,  Myung Whun Chang

发明人： Beom Joon Cho ,  Jong Myeon Lee ,  Myung Whun Chang

IPC分类号： B32B18/00 ,  B32B5/16 ,  C04B35/00

CPC分类号： B32B18/00 ,  C04B35/638 ,  C04B2235/3217 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/562 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252

摘要： There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.

摘要翻译： 提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。 所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层 在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粉末; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状形状的第二无机粉末，所述第二约束层的粉末堆积密度低于所述第一约束层的密度。

公开(公告)号：US20100101701A1

公开(公告)日：2010-04-29

申请号：US12476216

申请日：2009-06-01

申请人： Beom Joon CHO ,  Eun Tae PARK ,  Hyoung Ho KIM

发明人： Beom Joon CHO ,  Eun Tae PARK ,  Hyoung Ho KIM

IPC分类号： H01B13/00

CPC分类号： H05K3/4611 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1366 ,  H05K2203/308 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

摘要翻译： 公开了一种制造非闪烁多层陶瓷基板的方法。 该方法包括在多个陶瓷生片中的至少一个中形成至少一个导电通孔和电极图案，层压陶瓷生片以形成陶瓷层压体，选择性地形成耐烧结粉末的收缩抑制薄膜 在陶瓷层叠体的两个表面的至少一个表面中包括导电通孔及其周边的区域，使用气溶胶沉积，设置用于抑制陶瓷层压体在陶瓷层压体的两个表面中的至少一个上的收缩的收缩抑制生片 包括用于形成非烧结多层陶瓷衬底的收缩抑制薄膜，以及烧结非烧结多层陶瓷衬底。

公开(公告)号：US20090133806A1

公开(公告)日：2009-05-28

申请号：US12324964

申请日：2008-11-28

申请人： Ho Sung CHOO ,  Soo Hyun LYOO ,  Myung Whun CHANG ,  Beom Joon CHO

发明人： Ho Sung CHOO ,  Soo Hyun LYOO ,  Myung Whun CHANG ,  Beom Joon CHO

IPC分类号： H05K3/10 ,  B32B37/06

CPC分类号： H05K3/1258 ,  H05K1/0306 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/1216 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0108

摘要： There is provided a method of manufacturing a dielectric sheet and a multilayer ceramic substrate. A method of manufacturing a dielectric sheet according to an aspect of the invention may include: forming an embossed pattern formed of a thermoplastic material on a carrier film; forming a dielectric sheet by casting dielectric slurry onto the carrier film to cover the embossed pattern; removing the carrier film and the embossed pattern to leave an intaglio pattern having the shape corresponding to the embossed pattern on the dielectric sheet; and filling the intaglio pattern of the dielectric sheet with a conductive material.According to an aspect of the invention, a method of manufacturing a dielectric sheet and a multilayer ceramic substrate that can prevent the generation of irregularities when a dielectric sheet having an intaglio electrode pattern printed thereon is laminated to a multilayer substrate can be provided.

摘要翻译： 提供了制造电介质片和多层陶瓷衬底的方法。 根据本发明的一个方面的制造电介质片的方法可以包括：在载体膜上形成由热塑性材料形成的压花图案; 通过将介电浆料浇铸到载体膜上以覆盖压花图案来形成电介质片材; 去除载体膜和压花图案以在电介质片上留下具有与压花图案相对应的形状的凹版图案; 并用导电材料填充电介质片的凹版图案。 根据本发明的一个方面，可以提供一种制造电介质片和多层陶瓷基片的方法，该方法可以防止在其上印有凹版电极图案的电介质片层压到多层基片上时产生凹凸。

公开(公告)号：US08178193B2

公开(公告)日：2012-05-15

申请号：US12260042

申请日：2008-10-28

申请人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

发明人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC分类号： B32B7/02 ,  B32B37/06 ,  B32B9/04

CPC分类号： H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

摘要： Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. The second constraining layer is equal to or lower than the first constraining layer in terms of powder packing density. A shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders having different density and particle diameter.

摘要翻译： 本发明提供约束生片和多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并且由具有大于第一粒径的第二粒径的第二无机粉末形成。 关于粉末填充密度，第二约束层等于或低于第一约束层。 通过使用由具有不同密度和粒径的无机粉末形成的约束生片，可以在陶瓷层压结构的烧制过程中确保收缩抑制率，并且可以确保去粘合剂通道。

公开(公告)号：US08093172B2

公开(公告)日：2012-01-10

申请号：US12271386

申请日：2008-11-14

申请人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

发明人： Ho Sung Choo ,  Jong Myeon Lee ,  Eun Tae Park ,  Myung Whun Chang ,  Soo Hyun Lyoo ,  Beom Joon Cho

IPC分类号： C04B35/468

CPC分类号： H01G4/1227 ,  C03C3/064 ,  C03C8/02 ,  C04B35/4682 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5445 ,  H01G4/129 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, 0≦d≦10, and 0≦e≦10, respectively.

摘要翻译： 提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。 该玻璃组合物包含由Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成式表示的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e为40＆ a＆nlE; 89，10＆nlE; b＆nlE; 50,1＆nlE; c＆nlE; 20,0＆nlE; d＆nlE; 10和0＆nlE; e＆nlE; 10。

公开(公告)号：US20090110893A1

公开(公告)日：2009-04-30

申请号：US12260042

申请日：2008-10-28

申请人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

发明人： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC分类号： B32B7/02 ,  B32B9/04 ,  B32B37/06

CPC分类号： H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

摘要： Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate using the same. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on the top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. Thus, a shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders that are different in terms of density and particle diameter.

摘要翻译： 本发明提供约束生片和使用其的多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并由具有大于第一粒径的第二粒径的第二无机粉末形成。 因此，通过使用由密度和粒径不同的无机粉末形成的约束生片，可以在陶瓷层叠结构的烧成工序中确保收缩抑制率，并且可以确保脱粘合剂通道。