Abstract:
Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.
Abstract:
There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.
Abstract:
There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.
Abstract:
Disclosed herein is an ultrasonic sensor including: a cylindrical case; a piezoelectric element disposed on a bottom surface of an inner portion of the case; first and second terminals to which each of positive and negative voltages is applied from the outside; a connection member including a conductive member having a first area to which the first terminal is connected and a second area to which the second terminal is connected and a support member adhered to a lower surface of the conductive member; and a temperature compensation element penetrating between the first and second areas of the conductive member and being then inserted into the support member.
Abstract:
Disclosed herein are a case for an ultrasonic sensor and an ultrasonic sensor using the same. The case for an ultrasonic sensor has a cylindrical shape and includes a disposition area of a piezoelectric element and a first groove formed in an inner side bottom surface thereof, wherein the first groove is formed along an edge of the disposition area of the piezoelectric element.
Abstract:
Disclosed herein is an ultrasonic sensor, including: a conductive case having a groove disposed at a bottom surface thereof; a piezoelectric element inserted into the groove and fixed to the groove by a conductive adhesive; a temperature compensation capacitor disposed on a top of the piezoelectric element, electrically connected to the piezoelectric element, and fixed to the case by a non-conductive adhesive; a first lead wire led-in from an outside of the case and electrically connected to one surface of the temperature compensation capacitor and the case; and a second lead wire lead-in from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor, whereby the piezoelectric element which is easily damaged can be protected by the temperature compensation capacitor, without using the separate substrate for fixing the temperature compensation capacitor.
Abstract:
There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.
Abstract:
Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.
Abstract:
There are provided a method of manufacturing a ceramic laminated substrate in which the ceramic laminated substrate, with a cavity formed therein, can be manufactured by constrained sintering without undergoing deformation of the cavity, and a ceramic laminated substrate manufactured using the same.
Abstract:
Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, O≦d≦10, and O≦e≦10, respectively.
Abstract translation:提供一种玻璃组合物,电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。 多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结,同时显示高介电常数。 玻璃组合物包括由组成式表示的Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成成分,其中a + b + c + d + e = 100,a,b,c,d和e分别为40 < = a <= 89,10 <= b <= 50,1 <= c <= 20,O <= d <= 10,O <= e <= 10。