公开(公告)号：US20100101701A1

公开(公告)日：2010-04-29

申请号：US12476216

申请日：2009-06-01

Applicant: Beom Joon CHO ,  Eun Tae PARK ,  Hyoung Ho KIM

Inventor： Beom Joon CHO ,  Eun Tae PARK ,  Hyoung Ho KIM

IPC: H01B13/00

CPC classification number: H05K3/4611 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1366 ,  H05K2203/308 ,  H01L2924/00

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract translation: 公开了一种制造非闪烁多层陶瓷基板的方法。 该方法包括在多个陶瓷生片中的至少一个中形成至少一个导电通孔和电极图案，层压陶瓷生片以形成陶瓷层压体，选择性地形成耐烧结粉末的收缩抑制薄膜 在陶瓷层叠体的两个表面的至少一个表面中包括导电通孔及其周边的区域，使用气溶胶沉积，设置用于抑制陶瓷层压体在陶瓷层压体的两个表面中的至少一个上的收缩的收缩抑制生片 包括用于形成非烧结多层陶瓷衬底的收缩抑制薄膜，以及烧结非烧结多层陶瓷衬底。

公开(公告)号：US20130026884A1

公开(公告)日：2013-01-31

申请号：US13544362

申请日：2012-07-09

Applicant: Boum Seock KIM ,  Eun Tae PARK

Inventor： Boum Seock KIM ,  Eun Tae PARK

IPC: H01L41/053 ,  H01L41/113

CPC classification number: H01L41/1132 ,  G01H11/08 ,  H01L41/04 ,  H01L41/053

Abstract: Disclosed herein is an ultrasonic sensor including: a case including an inner space formed therein; a substrate seated on a bottom surface of the case in the inner space thereof and including a plurality of piezoelectric elements and temperature compensation capacitors mounted in a row therein; and a sound absorbing material mounted on an upper portion of the substrate.

Abstract translation: 本文公开了一种超声波传感器，包括：壳体，其包括形成在其中的内部空间; 位于其内部空间中的壳体的底面上的基板，包括多个压电元件和安装在其中的温度补偿电容器; 以及安装在基板的上部的吸音材料。

公开(公告)号：US20110034606A1

公开(公告)日：2011-02-10

申请号：US12906540

申请日：2010-10-18

Applicant: Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

Inventor： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

IPC: C08K3/22

CPC classification number: H05K1/162 ,  H01G4/206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H01L2924/00

Abstract: Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.

Abstract translation: 本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化 与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。 特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。 本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

公开(公告)号：US20130049537A1

公开(公告)日：2013-02-28

申请号：US13326073

申请日：2011-12-14

Applicant: Boum Seock KIM ,  Eun Tae PARK

Inventor： Boum Seock KIM ,  Eun Tae PARK

IPC: H01L41/053

CPC classification number: G10K11/004 ,  H01L41/1132

Abstract: Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.

Abstract translation: 本发明公开了一种超声波传感器，其包括：环氧树脂成型部：堆叠在环氧树脂成形部的上部的压电陶瓷， 吸音材料与压电陶瓷的两侧接触并与压电陶瓷的上部隔开，从而包围压电陶瓷并吸收振动; 与吸声材料的侧面和下表面间隔开的壳体，从而包围吸声材料，并且具有包括其上堆积的环氧树脂成型部件的底面向上突出的形状; 以及填充在吸音材料的上表面和吸音材料的侧面与下表面之间的模制材料和壳体。

公开(公告)号：US20120139851A1

公开(公告)日：2012-06-07

申请号：US13153995

申请日：2011-06-06

Applicant: Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

Inventor： Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

IPC: G08B6/00 ,  G06F3/041 ,  H01L41/053 ,  G09G5/00

CPC classification number: G06F3/016 ,  H01L41/0933

Abstract: There are provided a haptic driving assembly capable of providing stronger and more accurate vibration feedback, and an electronic device using the same. The haptic driving assembly includes: a support plate having a plate shape; and at least one actuator having one end thereof coupled to the support plate in order that the other end thereof is spaced apart from an upper surface of the support plate by a predetermined interval.

Abstract translation: 提供了能够提供更强和更准确的振动反馈的触觉驱动组件，以及使用其的电子设备。 触觉驱动组件包括：具有板形状的支撑板; 以及至少一个致动器，其一端连接到所述支撑板，以使其另一端与所述支撑板的上表面隔开预定间隔。

公开(公告)号：US20120139850A1

公开(公告)日：2012-06-07

申请号：US13153896

申请日：2011-06-06

Applicant: Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

Inventor： Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

IPC: G08B6/00 ,  H01L41/04 ,  G06F3/041

CPC classification number: G06F3/016 ,  H01L41/0933

Abstract: There is provided a haptic driving assembly capable of providing more uniform haptic feedback, and an electronic device using the same. The haptic driving assembly includes: at least one actuator; and a vibration transferring part disposed to contact at least one surface of the actuator and transferring vibrations generated in the actuator to the outside through a liquid phase medium.

Abstract translation: 提供了能够提供更均匀的触觉反馈的触觉驱动组件，以及使用其的电子设备。 触觉驱动组件包括：至少一个致动器; 以及振动传递部，其设置成接触致动器的至少一个表面，并且通过液相介质将致动器中产生的振动传递到外部。

公开(公告)号：US20120112607A1

公开(公告)日：2012-05-10

申请号：US13191006

申请日：2011-07-26

Applicant: Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

Inventor： Boum Seock KIM ,  Seung Gyo JEONG ,  Eun Tae PARK

IPC: H01L41/187 ,  H01L41/047 ,  H01L41/22 ,  C04B35/626

CPC classification number: C04B35/493 ,  C04B35/6261 ,  C04B35/62645 ,  C04B2235/3251 ,  C04B2235/3255 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/6567 ,  C04B2235/77 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/43 ,  Y10T29/42

Abstract: Disclosed are a ceramic composition for a piezoelectric actuator and a piezoelectric actuator including the same. The ceramic composition for a piezoelectric actuator includes piezoelectric ceramic powder expressed by a chemical formula, (1−x)Pb(Zr(1-y)Tiy)O3-xPb(Ni1/3Nb2/3)O3, where, x ranges from 0.25 to 0.4, and y ranges from 0.4 to 0.7. The ceramic composition for a piezoelectric actuator permits low-temperature firing while implementing superior piezoelectric properties.

Abstract translation: 公开了一种用于压电致动器和包括该陶瓷组合物的压电致动器的陶瓷组合物。 用于压电致动器的陶瓷组合物包括由化学式（1-x）Pb（Zr（1-y）Tiy）O3-xPb（Ni1 / 3Nb2 / 3）O3表示的压电陶瓷粉末，其中x为0.25 至0.4，y在0.4至0.7的范围内。 用于压电致动器的陶瓷组合物允许低温烧制同时实现优异的压电性能。