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1.发明授权Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements 有权用于确定和调整与半导体元件的结合有关的并行度水平的系统和方法公开(公告)号：US09136243B2
公开(公告)日：2015-09-15
申请号：US14553782
申请日：2014-11-25
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Michael P. Schmidt-Lange , Matthew B. Wasserman , Christopher W. Braun
CPC classification number: H01L24/75 , B23K1/0016 , B23K31/12 , B23K37/04 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/75001 , H01L2224/7501 , H01L2224/75252 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/7901 , H01L2224/81011 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
Abstract translation: 一种用于接合半导体元件的接合机，所述接合机包括：支撑结构，其构造成支撑基板; 接合头组件，所述接合头组件包括被配置为将多个半导体元件结合到所述衬底的接合工具; 以及校准工具，其包括被配置为定位在所述接合工具和所述支撑结构之间的接触部分，所述接触部分构造成在校准操作期间同时与所述接合工具和所述支撑结构中的每一个接触。
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公开(公告)号：US09425163B2
公开(公告)日：2016-08-23
申请号：US14821312
申请日：2015-08-07
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Michael P. Schmidt-Lange , Matthew B. Wasserman , Christopher W. Braun
CPC classification number: H01L24/75 , B23K1/0016 , B23K31/12 , B23K37/04 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/75001 , H01L2224/7501 , H01L2224/75252 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/7901 , H01L2224/81011 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
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3.发明申请公开(公告)号：US20160005709A1
公开(公告)日：2016-01-07
申请号：US14855848
申请日：2015-09-16
Applicant: Kulicke and Soffa Industries, Inc.
CPC classification number: H01L24/75 , B23K1/0016 , B23K3/00 , B23K3/04 , B23K3/08 , B23K31/12 , H01L21/00 , H01L22/10 , H01L24/13 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/75001 , H01L2224/75252 , H01L2224/75301 , H01L2224/75702 , H01L2224/75841 , H01L2224/75842 , H01L2224/75901 , H01L2224/7592 , H01L2224/81121 , H01L2224/81201 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81986 , H05K3/34 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
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4.发明授权Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same 有权用于热压接合器的粘结头，热压接合器及其操作方法公开(公告)号：US09093549B2
公开(公告)日：2015-07-28
申请号：US14314149
申请日：2014-06-25
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Matthew B. Wasserman , Michael P. Schmidt-Lange
CPC classification number: H01L24/75 , B23K1/0016 , B23K1/008 , B23K3/02 , B23K3/08 , B23K3/085 , B23K37/003 , B23K2101/42 , H01L24/81 , H01L2224/75252 , H01L2224/75301 , H01L2224/755 , H01L2224/7565 , H01L2224/81203
Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
Abstract translation: 提供了一种用于热压接头的粘结头。 结合头包括构造成保持要接合的工件的工具，被配置为加热待粘合的工件的加热器和靠近加热器的室。 腔室被配置为接收用于冷却加热器的冷却流体。
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公开(公告)号：US20150155254A1
公开(公告)日：2015-06-04
申请号：US14553782
申请日：2014-11-25
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Michael P. Schmidt-Lange , Matthew B. Wasserman , Christopher W. Braun
IPC: H01L23/00
CPC classification number: H01L24/75 , B23K1/0016 , B23K31/12 , B23K37/04 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/75001 , H01L2224/7501 , H01L2224/75252 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/7901 , H01L2224/81011 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
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Patent Agency Ranking
公开(公告)号：US09731378B2
公开(公告)日：2017-08-15
申请号：US15156738
申请日：2016-05-17
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Thomas J. Colosimo, Jr. , Michael P. Schmidt-Lange , Horst Clauberg , Matthew B. Wasserman
CPC classification number: B23K20/023 , B23K1/0016 , B23K3/00 , H01L2224/11
Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).
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7.发明授权公开(公告)号：US09478516B2
公开(公告)日：2016-10-25
申请号：US14855848
申请日：2015-09-16
Applicant: Kulicke and Soffa Industries, Inc.
IPC: B23K37/00 , H01L23/00 , B23K1/00 , B23K31/12 , H01L21/66 , B23K3/00 , H05K3/34 , H01L21/00 , B23K3/04 , B23K3/08
CPC classification number: H01L24/75 , B23K1/0016 , B23K3/00 , B23K3/04 , B23K3/08 , B23K31/12 , H01L21/00 , H01L22/10 , H01L24/13 , H01L24/81 , H01L2224/131 , H01L2224/13147 , H01L2224/75001 , H01L2224/75252 , H01L2224/75301 , H01L2224/75702 , H01L2224/75841 , H01L2224/75842 , H01L2224/75901 , H01L2224/7592 , H01L2224/81121 , H01L2224/81201 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81986 , H05K3/34 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
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公开(公告)号：US09425162B2
公开(公告)日：2016-08-23
申请号：US14746065
申请日：2015-06-22
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Matthew B. Wasserman , Michael P. Schmidt-Lange
CPC classification number: H01L24/75 , B23K1/0016 , B23K1/008 , B23K3/02 , B23K3/08 , B23K3/085 , B23K37/003 , B23K2101/42 , H01L24/81 , H01L2224/75252 , H01L2224/75301 , H01L2224/755 , H01L2224/7565 , H01L2224/81203
Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
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公开(公告)号：US20150287693A1
公开(公告)日：2015-10-08
申请号：US14746065
申请日：2015-06-22
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Matthew B. Wasserman , Michael P. Schmidt-Lange
CPC classification number: H01L24/75 , B23K1/0016 , B23K1/008 , B23K3/02 , B23K3/08 , B23K3/085 , B23K37/003 , B23K2101/42 , H01L24/81 , H01L2224/75252 , H01L2224/75301 , H01L2224/755 , H01L2224/7565 , H01L2224/81203
Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
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10.发明申请BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME 有权用于热变形粘合剂的粘合头，热塑性粘合剂及其操作方法公开(公告)号：US20150008254A1
公开(公告)日：2015-01-08
申请号：US14314149
申请日：2014-06-25
Applicant: Kulicke and Soffa Industries, Inc.
Inventor： Matthew B. Wasserman , Michael P. Schmidt-Lange
CPC classification number: H01L24/75 , B23K1/0016 , B23K1/008 , B23K3/02 , B23K3/08 , B23K3/085 , B23K37/003 , B23K2101/42 , H01L24/81 , H01L2224/75252 , H01L2224/75301 , H01L2224/755 , H01L2224/7565 , H01L2224/81203
Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.
Abstract translation: 提供了一种用于热压接头的粘结头。 结合头包括构造成保持要接合的工件的工具，被配置为加热待粘合的工件的加热器和靠近加热器的室。 腔室被配置为接收用于冷却加热器的冷却流体。
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