Invention Grant
- Patent Title: Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
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Application No.: US14855848Application Date: 2015-09-16
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Publication No.: US09478516B2Publication Date: 2016-10-25
- Inventor: Matthew B. Wasserman , Michael P. Schmidt-Lange , Thomas J. Colosimo, Jr.
- Applicant: Kulicke and Soffa Industries, Inc.
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agency: Stradley Ronon Stevens & Young, LLP
- Main IPC: B23K37/00
- IPC: B23K37/00 ; H01L23/00 ; B23K1/00 ; B23K31/12 ; H01L21/66 ; B23K3/00 ; H05K3/34 ; H01L21/00 ; B23K3/04 ; B23K3/08
Abstract:
A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
Public/Granted literature
- US20160005709A1 METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES Public/Granted day:2016-01-07
Information query
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