公开(公告)号：US10056278B2

公开(公告)日：2018-08-21

申请号：US15243640

申请日：2016-08-22

Applicant: ASM Technology Singapore Pte Ltd

Inventor： Chi Wah Cheng ,  Kai Fung Lau

IPC: G06F7/00 ,  H05K3/30 ,  H01L21/677

CPC classification number: H01L21/67706 ,  H01L21/67144 ,  H01L21/67721 ,  H01L21/67736 ,  H01L24/75 ,  H01L2224/7565

Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

公开(公告)号：US10052705B2

公开(公告)日：2018-08-21

申请号：US14413121

申请日：2013-08-29

Applicant: UNIVERSAL INSTRUMENTS CORPORATION

Inventor： Koenraad Alexander Gieskes

IPC: B23K1/00 ,  B23K3/08 ,  H01L23/00 ,  H01L25/00 ,  B23K3/04 ,  H01L25/065

CPC classification number: B23K3/087 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/04 ,  B23K2035/008 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/75272 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81005 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/81

Abstract: Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.

公开(公告)号：US20180158796A1

公开(公告)日：2018-06-07

申请号：US15822364

申请日：2017-11-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  B32B37/10 ,  B32B41/00 ,  B32B37/00

CPC classification number: H01L24/75 ,  B32B15/01 ,  B32B37/0046 ,  B32B37/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68 ,  H01L21/6838 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/75302 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75901 ,  H01L2224/75981 ,  H01L2224/75986 ,  H01L2224/80009 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83009 ,  H01L2224/83201 ,  H01L2224/83894 ,  H01L2224/83908

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20180076170A1

公开(公告)日：2018-03-15

申请号：US15815777

申请日：2017-11-17

Applicant: International Business Machines Corporation

Inventor： Wei Lin ,  Spyridon Skordas

IPC: H01L23/00 ,  H01L21/78

CPC classification number: H01L24/83 ,  H01L21/02057 ,  H01L21/561 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67271 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27002 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/75981 ,  H01L2224/83005 ,  H01L2224/83193 ,  H01L2224/83896 ,  H01L2224/95001 ,  H01L2224/951 ,  H01L2225/06541

Abstract: A method and structure for forming a 3D chip stack using a vacuum chuck. The method may include: forming a first bonding layer on a first wafer and first chips, where the first chips are on a first substrate; forming a second bonding layer on a second wafer and second chips, where the second chips are on a second substrate; separating the second chips from the second wafer, wherein a portion of the second bonding layer remains on the second chips; moving the separated second chips to a cleaning chamber using a vacuum chuck; cleaning the separated second chips in the cleaning chamber; and bonding the second bonding layer on the separated second chips to the first bonding layer on the first chips.

公开(公告)号：US20180068974A1

公开(公告)日：2018-03-08

申请号：US15815769

申请日：2017-11-17

Applicant: International Business Machines Corporation

Inventor： Wei Lin ,  Spyridon Skordas

IPC: H01L23/00 ,  H01L21/78

CPC classification number: H01L24/83 ,  H01L21/02057 ,  H01L21/561 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67271 ,  H01L21/67742 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27002 ,  H01L2224/7501 ,  H01L2224/7565 ,  H01L2224/75981 ,  H01L2224/83005 ,  H01L2224/83193 ,  H01L2224/83896 ,  H01L2224/95001 ,  H01L2224/951 ,  H01L2225/06541

Abstract: A method and structure for forming a 3D chip stack using a vacuum chuck. The method may include: forming a first bonding layer on a first wafer and first chips, where the first chips are on a first substrate; forming a second bonding layer on a second wafer and second chips, where the second chips are on a second substrate; separating the second chips from the second wafer, wherein a portion of the second bonding layer remains on the second chips; moving the separated second chips to a cleaning chamber using a vacuum chuck; cleaning the separated second chips in the cleaning chamber; and bonding the second bonding layer on the separated second chips to the first bonding layer on the first chips.

公开(公告)号：US09896277B2

公开(公告)日：2018-02-20

申请号：US14438462

申请日：2012-10-29

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Toshinori Shimizu ,  Hiroyasu Ohashi ,  Toshihiko Yamasaki ,  Masaki Murai

IPC: H01L21/677 ,  B65G47/06 ,  H05K13/02 ,  H05K13/04 ,  H01L23/00

CPC classification number: B65G47/06 ,  H01L21/67721 ,  H01L21/67724 ,  H01L21/67775 ,  H01L24/75 ,  H01L2224/7565 ,  H05K13/021 ,  H05K13/0434

Abstract: A component supply device is arranged adjacent to a mounter which mounts components on a board and supplies components to the mounter. This component supply device includes a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged on a base material, and a conveyance section which conveys a component carrying member housed in the magazine and which is equipped with side surface number one to which the replenishment section is attached and side surface number two which is arranged adjacent to the mounter. The replenishment section is slidably attached with respect to side surface number one of the conveyance section.

公开(公告)号：US20180019226A1

公开(公告)日：2018-01-18

申请号：US15644379

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Yasutaka SOMA ,  Takashi KOGA ,  Shogo HARA ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC: H01L23/00 ,  B32B37/00 ,  B32B41/00

CPC classification number: H01L24/83 ,  B32B37/025 ,  B32B41/00 ,  B32B2457/14 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75743 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75901 ,  H01L2224/80009 ,  H01L2224/80013 ,  H01L2224/8002 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83031 ,  H01L2224/83122 ,  H01L2224/83896 ,  H01L2224/94 ,  H01L2224/80 ,  H01L2924/00012

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

公开(公告)号：US20170372925A1

公开(公告)日：2017-12-28

申请号：US15680706

申请日：2017-08-18

Applicant: SUSS MicroTec Lithography GmbH

Inventor： Hale Johnson ,  Gregory George ,  Aaron Loomis

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67092 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68771 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75703 ,  H01L2224/75743 ,  H01L2224/75754 ,  H01L2224/80203 ,  H01L2224/80907 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned within a processing system using the aligned substrate transport device, optionally under robotic control. The centered semiconductor substrate pairs may be bonded together without the presence of the aligned substrate transport device in the bonding device. The bonding device may include a second spacer assembly which operates in concert with that of the aligned substrate transport device to perform a spacer hand-off between the substrates. A pin apparatus may be used to stake the substrates during the hand-off.

公开(公告)号：US09698117B2

公开(公告)日：2017-07-04

申请号：US14600324

申请日：2015-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongdae Ha ,  Jaeryoung Lee ,  Chulmin Kim ,  Yisung Hwang ,  Teaseog Um ,  Yongjin Jung

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

公开(公告)号：US09640418B2

公开(公告)日：2017-05-02

申请号：US15150856

申请日：2016-05-10

Applicant: SUSS MicroTec Lithography GmbH

Inventor： Hale Johnson ,  Gregory George

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/67742 ,  H01L21/67092 ,  H01L21/6719 ,  H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75703 ,  H01L2224/75743 ,  H01L2224/75754 ,  H01L2224/80203 ,  H01L2224/80907 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.