公开(公告)号：US08939784B2

公开(公告)日：2015-01-27

申请号：US13829081

申请日：2013-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangki Lee ,  Insik Kim ,  Teaseog Um ,  Suklae Kim ,  Yoonoh Han

IPC: H01R13/62 ,  H01R12/50 ,  G01R1/04

CPC classification number: H01R23/70 ,  G01R1/0466 ,  G01R1/0483

Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

Abstract translation: 半导体芯片封装测试插座可以包括插座壳体; 插座壳体中的多个探针; 探针上的导电垫; 浮动引导件，其构造成覆盖所述导电焊盘的边缘并且被配置为在所述导电焊盘上提供半导体芯片封装; 和/或固定在插座壳体上的夹具。 夹具可以将浮动导向件与插座壳体组合。

公开(公告)号：US09698117B2

公开(公告)日：2017-07-04

申请号：US14600324

申请日：2015-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongdae Ha ,  Jaeryoung Lee ,  Chulmin Kim ,  Yisung Hwang ,  Teaseog Um ,  Yongjin Jung

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L24/75 ,  H01L21/67144 ,  H01L21/6838 ,  H01L2221/68363 ,  H01L2224/7555 ,  H01L2224/7565 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.