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公开(公告)号：US20230314503A1
公开(公告)日：2023-10-05
申请号：US17709630
申请日：2022-03-31
Applicant: Intel Corporation
Inventor： Gregorio Roberto Murtagian , Karumbu Nathan Meyyappan
CPC classification number: G01R31/2889 , G01R31/2853 , G01R1/0483 , G01R31/2896 , H01L27/0886
Abstract: Technologies for testing integrated circuit components with liquid metal interconnects are disclosed. In the illustrative embodiment, a bed of nails adapter can mate with an integrated circuit component with liquid metal interconnects. The nails pierce a sealing cap layer that seals the liquid metal interconnects, electrically coupling the nails to the liquid metal interconnects. An underside of the bed of nails adapter has an array of pads that are coupled to the nails. The array of pads may be used to mate the bed of nails adapter and integrated circuit component with several land grid array sockets for testing of the integrated circuit component. As the bed of nails adapter does not need to be removed as the integrated circuit component is moved to a new land grid array socket, the number of times the sealing cap layer is pierced by nails during testing is reduced.
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2.发明公开
公开(公告)号：US20230213554A1
公开(公告)日：2023-07-06
申请号：US17884661
申请日：2022-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwangkyu BANG , Kiljoong YUN , Yun CHANG , Jaegyu CHOI
CPC classification number: G01R1/0466 , G01R1/0483 , G01R31/2863 , G01R31/2884
Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.
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公开(公告)号：US10128592B1
公开(公告)日：2018-11-13
申请号：US15593689
申请日：2017-05-12
Applicant: Aaron Ashley Hathaway , Robert Miller , Erica Anne Sanker
Inventor： Aaron Ashley Hathaway , Robert Miller , Erica Anne Sanker
CPC classification number: H01R12/7076 , G01R1/0483 , G01R3/00 , H01R12/7047 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/144 , H05K7/10
Abstract: One example includes a device that is comprised of a plurality of printed circuit boards, a plurality of vias, and a plurality of castellations. The plurality of printed circuit boards are laminated together, at least some of the plurality of printed circuit boards including a dielectric panel and a plurality of conductor pads. The plurality of vias, through the plurality of conductor pads, include a conductive material to respectively electrically couple the plurality of conductor pads with each other. The plurality of castellations, on at least one side of the plurality of printed circuit boards, to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads.
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公开(公告)号：US10037933B2
公开(公告)日：2018-07-31
申请号：US14743879
申请日：2015-06-18
Applicant: XCERRA CORPORATION
Inventor： Valts Treibergs , Mitchell Nelson , Jason Mroczkowski
IPC: G01R31/00 , H01L23/495 , G01R1/04 , H05K5/04 , H05K7/10
CPC classification number: H01L23/49517 , G01R1/0466 , G01R1/0483 , H01L2924/0002 , H05K5/04 , H05K7/10 , H01L2924/00
Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.
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公开(公告)号：US09905482B2
公开(公告)日：2018-02-27
申请号：US15672547
申请日：2017-08-09
Applicant: Renesas Electronics Corporation
Inventor： Toshitsugu Ishii , Naohiro Makihira , Hidekazu Iwasaki , Jun Matsuhashi
CPC classification number: H01L22/14 , G01R1/0466 , G01R1/0483 , G01R1/06738 , G01R31/2874 , G01R31/40 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/97 , H01L25/50 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
Abstract: Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJ1 and a projecting portion PJ2 are provided in an end portion PU of a socket terminal STE1. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJ1 and by a contact using the projecting portion PJ2, for example. As a result, the current flowing from the socket terminal STE1 to the lead flows by being dispersed into a path flowing in the projecting portion PJ1 and a path flowing in the projecting portion PJ2. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STE1 and the lead even in a case where the large current is caused to flow between the socket terminal STE1 and the lead.
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公开(公告)号：US20170295661A1
公开(公告)日：2017-10-12
申请号：US15506540
申请日：2015-08-27
Applicant: ENPLAS CORPORATION
Inventor： Shin KOBAYASHI
IPC: H05K7/10 , H01R13/10 , H01R13/652 , H01R13/24 , H01R12/57 , H01R13/635 , H01R12/50 , H01R13/627
CPC classification number: H05K7/2049 , G01R1/0458 , G01R1/0466 , G01R1/0483 , H01L23/34 , H01L23/367 , H01L23/4093 , H01R4/5066 , H01R12/57 , H01R13/10 , H01R13/2407 , H01R13/6278 , H01R13/635 , H01R13/652 , H01R23/6806 , H01R33/76 , H05K7/10
Abstract: A socket for an electric component includes a socket body in which a contact pin is provided in a housing part and a cover member provided so as to be rotatable with respect to the socket body. The cover member has a cover member body and a heat slug in contact with an electric component. The heat slug is configured so as to move downward and press the electric component by being pressed from above by a cooling head in a state in which the cover member is closed. In a state in which the electric component is housed in the housing part, a restricting mechanism allows the downward movement of the heat slug, whereas in a state in which the electric component is not housed in the housing part, the restricting mechanism prevents the downward movement of the heat slug.
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公开(公告)号：US09759742B2
公开(公告)日：2017-09-12
申请号：US14406882
申请日：2013-06-18
Applicant: ISC CO., LTD.
Inventor： Jae Hak Lee
CPC classification number: G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/07378 , H01R13/2414 , H01R2201/20
Abstract: The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction units that are arranged at positions corresponding to the terminal of the blood test device and show conductivity in a thickness direction have: conduction units that are arranged in such a manner that multiple conductive particles are arranged in the thickness direction in an elastic insulating material; and an insulating support unit that supports and insulates each of the conduction units. The conductive particles are provided with through-holes bored through one surface and another surface other than the one surface, and the through-holes are filled with the elastic insulating material.
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公开(公告)号：US20170176493A1
公开(公告)日：2017-06-22
申请号：US15381435
申请日：2016-12-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunguen IY
CPC classification number: G01R1/0483 , H01L22/30
Abstract: A test socket includes a base to receive a semiconductor package, an actuator in the base, the actuator including a through-hole, and a socket pin in the through-hole of the actuator, the socket pin contacting a terminal of the semiconductor package, wherein the socket pin includes a pin body, a pin head to contact the terminal of the semiconductor package, and an inclined portion inclined with respect to a longitudinal direction of at least an upper portion of the pin body, the pin head being connected to a top end of the inclined portion, and the pin body being connected to a bottom end of the inclined portion, wherein the inclined portion contacts at least a portion of an inner sidewall of the through-hole.
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公开(公告)号：US09686895B2
公开(公告)日：2017-06-20
申请号：US14017311
申请日：2013-09-04
Applicant: International Business Machines Corporation
Inventor： Martin Eckert , Otto Torreiter , Quintino L. Trianni
CPC classification number: H01L24/75 , G01R1/0466 , G01R1/0483 , H01L21/4853 , H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/75316 , H01L2224/75501 , H01L2224/757 , H01L2224/75754 , H01L2224/75756 , H01L2224/759 , H01L2224/81121 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/81908 , H05K13/0413 , Y10T29/53178 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.
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公开(公告)号：US09645173B2
公开(公告)日：2017-05-09
申请号：US14405054
申请日：2013-05-27
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura
CPC classification number: G01R1/0441 , G01R1/0483 , G01R31/26
Abstract: A test carrier includes a base member and a cover member. The base member includes a multi-layer board including a wiring line that is electrically connected to a die and a base film that supports the multi-layer board. The cover member includes a frame-shaped cover frame having an opening formed therein. The size of the multi-layer board is larger than the size of the die and is smaller than the size of the opening in a direction along a surface that is opposite to the die.
