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公开(公告)号：US20240351124A1
公开(公告)日：2024-10-24
申请号：US18574865
申请日：2022-07-19
Applicant: Apex Brands, Inc.
Inventor： Steve Batsa , John Fiumefreddo
CPC classification number: B23K3/027 , B23K3/0346 , B23K3/085
Abstract: A soldering station or a soldering station system including a soldering station and a soldering iron includes a control console and an iron holder operably coupled to the control console for supporting a soldering iron. The iron holder comprises a handle support portion and a base portion operably coupling the handle support portion to the control console. The handle support portion is oriented with respect to the base portion to define an axis. The axis forms an angle of between about 10 degrees to about 40 degrees relative to a horizontal surface supporting the soldering station. The handle support portion is shaped to receive the soldering iron in a tip-up orientation. The soldering iron may include a handle, a transition portion, a shaft portion, a tip, and a longitudinal centerline.
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公开(公告)号：US12091729B2
公开(公告)日：2024-09-17
申请号：US16981766
申请日：2019-02-27
Applicant: ACR II GLASS AMERICA INC.
Inventor： Olivier Farreyrol
IPC: B23K1/00 , B22F1/06 , B23K3/02 , B23K35/26 , B23K35/30 , C03C27/04 , C22C13/00 , H01Q1/12 , H01R4/02 , H01R43/02 , H05B3/84 , B23K101/00 , B23K103/00
CPC classification number: C22C13/00 , B22F1/06 , B23K1/00 , B23K1/0008 , B23K1/0016 , B23K3/02 , B23K35/262 , B23K35/3006 , B23K35/302 , C03C27/04 , H01Q1/1278 , H01R4/024 , H01R43/02 , H05B3/84 , B23K1/0004 , B23K2101/006 , B23K2103/54 , H01R2201/02 , H05B2203/01 , B22F2999/00 , B22F7/062 , B22F1/06 , C22C1/0466
Abstract: A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.
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公开(公告)号：US20240165726A1
公开(公告)日：2024-05-23
申请号：US17469736
申请日：2021-09-08
Applicant: Hakko Corporation
Inventor： Kenji Matsuzaki , Hitoshi Takeuchi , Kenta Nakamura
CPC classification number: B23K3/033 , B23K1/018 , B23K3/028 , B23K3/0346 , G06F13/4282
Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
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公开(公告)号：US20230339033A1
公开(公告)日：2023-10-26
申请号：US18037449
申请日：2021-11-08
Applicant: ERSA GmbH
Inventor： Yannik Goldhammer , Elmar Müller
CPC classification number: B23K3/027 , B23K3/026 , B23K3/0361
Abstract: The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.
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公开(公告)号：US20230321741A1
公开(公告)日：2023-10-12
申请号：US18297480
申请日：2023-04-07
Applicant: Pipeline Design & Engineering, LLC
Inventor： Aaron Robison , Benjamin Mark Sandoval , John Bradley Martell , Craig Ovans , Pedro Rafael Tula del Moral Testai
CPC classification number: B23K3/027 , B23K3/0369 , B23K3/0346
Abstract: The disclosure includes a heat-staking device comprising a base, an upright arm coupled to the base, and a head vertically movable along the upright arm. In some embodiments, the head includes a main head unit, a quill coupled to the main head unit, an insulating tip holder coupled to the quill and configured to removably retain a thermal-installation tip, and a handle configured to cause vertical motion of the insulating tip holder. The quill may also include a soldering iron configured to heat the thermal-installation tip. In some embodiments, the heat-staking device is configured to swap out thermal-installation tips while the thermal-installation tips are still hot.
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Patent Agency Ranking
公开(公告)号：US11745281B2
公开(公告)日：2023-09-05
申请号：US17307253
申请日：2021-05-04
Applicant: Micron Technology, Inc.
Inventor： Mark E. Tuttle
IPC: B23K1/00 , B23K1/018 , H01L23/00 , H01L21/66 , B23K3/02 , B23K3/03 , B23K3/08 , B23K101/40 , B23K101/42
CPC classification number: B23K1/018 , B23K1/0016 , B23K3/029 , B23K3/03 , B23K3/08 , H01L22/32 , H01L24/799 , H01L24/98 , B23K2101/40 , B23K2101/42 , H01L24/13 , H01L2224/13101 , H01L2224/7999 , H01L2224/98 , H01L2224/13101 , H01L2924/014 , H01L2924/00014
Abstract: A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
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公开(公告)号：US11691210B2
公开(公告)日：2023-07-04
申请号：US16345163
申请日：2017-10-24
Applicant: AND Co., Ltd.
Inventor： Mitsuo Ebisawa
CPC classification number: B23K3/08 , B23K1/0016 , B23K3/025 , B23K3/03 , B23K3/047 , B23K3/0615 , H05K3/34 , H05K3/341 , B23K2101/42
Abstract: By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.
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公开(公告)号：US11517971B2
公开(公告)日：2022-12-06
申请号：US15930279
申请日：2020-05-12
Applicant: Hakko Corporation
Inventor： Yoshitomo Teraoka , Hisao Nemoto
Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
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公开(公告)号：US11491631B2
公开(公告)日：2022-11-08
申请号：US16610138
申请日：2018-05-08
Inventor： John Joseph Storey
Abstract: A gas powered tool (70) comprising a housing (73) and a soldering tool element (72) releasably coupled to the housing (73). A latching element (105) pivotally mounted on a pivot pin (106) in the housing (73) is retained in a non-latching state (FIG. 26) by an abutment element (102) which is urgeable into the housing (73) by the soldering tool element (72) when the soldering tool element (72) is coupled to the housing (73). The latching element (105) is spring biased in the direction of the arrow E from the non-latching state to a latching state (FIG. 27) for latching a switching element (89) in a first state to in turn retain an isolating valve (86), which supplies fuel gas from a reservoir (78) in the housing (73) to the soldering tool element (72), in the isolating state. On decoupling of the soldering tool element (72) from the housing (73), the abutment element (102) is spring urged outwardly and disengages the latching element (105). The latching element (105) pivots about the pivot pin from the non-latching state to the latching state engaging the switching element (89) in the first state, thereby retaining the isolating valve (86) in the isolating state isolating the soldering tool element (72) from the fuel gas in the fuel gas reservoir (78) in the housing (73).
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公开(公告)号：US20220143727A1
公开(公告)日：2022-05-12
申请号：US17438028
申请日：2020-03-10
Applicant: SHORITSU ELECTRIC INDUSTRY CO., LTD.
Inventor： Kosuke NAKAJIMA , Shinobu YAMAMOTO , Takeshi MIMURA
Abstract: The present invention is to provide a mechanism that does not cause a situation such as corrosion of the iron tip with an air nozzle due to blowing off solder from the iron tip of the soldering iron, and a mechanism capable of coping with various shapes of iron tips. In order to achieve the object of the present invention, an iron tip cleaner device for a soldering iron includes a cleaner chamber including a wall surface and an air jetting holes that is provided in the wall surface and jets air for blowing off solder on an iron tip. The solder on the iron tip is blown off by convection air generated when the air jetted from the air jetting holes collides with the wall surface.
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