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公开(公告)号：US20190247943A1
公开(公告)日：2019-08-15
申请号：US16392415
申请日：2019-04-23
发明人： Mark E. Tuttle
CPC分类号： B23K1/018 , B23K1/0016 , B23K3/029 , B23K3/03 , B23K3/08 , B23K2101/40 , B23K2101/42 , H01L22/32 , H01L24/799 , H01L24/98 , H01L2224/7999 , H01L2224/98
摘要： A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
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公开(公告)号：US20180069148A1
公开(公告)日：2018-03-08
申请号：US15559778
申请日：2015-09-09
申请人： Goertek.Inc
发明人： Quanbo ZOU , Zhe WANG
CPC分类号： H01L33/0095 , H01L24/03 , H01L25/0753 , H01L25/13 , H01L33/483 , H01L33/62 , H01L2224/83 , H01L2224/98 , H01L2924/0105 , H01L2924/01079 , H01L2933/0066
摘要： The present invention discloses a repairing method, manufacturing method, device and electronics apparatus of micro-LED. The method for repairing a micro-LED comprises: bringing a known-good micro-LED on a conductive pick-up head into contact with a first pad on an defective position of a receiving substrate, wherein the conductive pick-up head and the known-good micro-LED are bonded via a conductive adhesive; locally joule heating a first bonding layer through the conductive pick-up head, to melt the first bonding layer, wherein the first bonding layer is provided between the known-good micro-LED and the first pad; and lifting up the conductive pick-up head after the first bonding layer is cooled, leaving the known-good micro-LED on the receiving substrate.
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公开(公告)号：US09806001B2
公开(公告)日：2017-10-31
申请号：US14753514
申请日：2015-06-29
发明人： Mihalis Michael , Ilija Jergovic
IPC分类号： H01L23/367 , H01L23/31 , H01L23/42 , H01L21/56 , H01L23/00
CPC分类号： H01L23/3675 , H01L21/56 , H01L23/3107 , H01L23/3114 , H01L23/367 , H01L23/3672 , H01L23/42 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/13082 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2731 , H01L2224/32245 , H01L2224/73253 , H01L2224/75745 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/83855 , H01L2224/83862 , H01L2224/83874 , H01L2224/92242 , H01L2224/97 , H01L2224/98 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1426 , H01L2924/181 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configured to cover the second die surface and the packaging surface and can be attached thereto by a layer of adhesive positioned between the heat spreader and the semiconductor die. A semiconductor package array can include an array of semiconductor dies and a heat spreader configured to cover each semiconductor die. A conductive lead can be electrically connected to the integrated circuit in a semiconductor die and can extend from the first die surface. Manufacturing a semiconductor package can include applying thermally conductive adhesive to the heat spreader and placing the heat spreader proximate the semiconductor die.
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4.发明授权Method for depackaging prepackaged integrated circuit die and a product from the method 有权用于从包装方法包装预包装的集成电路芯片和产品的方法公开(公告)号：US08586407B2
公开(公告)日：2013-11-19
申请号：US13230369
申请日：2011-09-12
申请人： Peter Lieu , W. Eric Boyd
发明人： Peter Lieu , W. Eric Boyd
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/98 , H01L2221/68327 , H01L2224/21 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/98 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H01L2224/48 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.
摘要翻译： 提供了一种用于从具有诸如球栅阵列（BGA）封装中的具有表面翘曲的预先封装的集成电路管芯提供具有增强的平面性的已知的良好集成电路管芯的方法。 部分拆封的集成电路封装被固定到具有间隔元件的衬底上，使得部分去封装的集成电路管芯内的管芯的有效表面稍微向上弯曲以限定凸面。 然后，将所安装的部分封装的集成电路封装的现在凸形的表面上的暴露的密封剂重叠或磨去预定的深度，从而提供具有增强的平面性和表面均匀性的集成电路管芯。
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5.发明申请Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method 有权从封装方法中预先封装的集成电路芯片和产品的方法公开(公告)号：US20120068341A1
公开(公告)日：2012-03-22
申请号：US13230369
申请日：2011-09-12
申请人： Peter Lieu , W. Eric Boyd
发明人： Peter Lieu , W. Eric Boyd
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L21/56 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/98 , H01L2221/68327 , H01L2224/21 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/98 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H01L2224/48 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.
摘要翻译： 提供了一种用于从具有诸如球栅阵列（BGA）封装中的具有表面翘曲的预先封装的集成电路管芯提供具有增强的平面性的已知的良好集成电路管芯的方法。 部分拆封的集成电路封装被固定到具有间隔元件的衬底上，使得部分去封装的集成电路管芯内的管芯的有效表面稍微向上弯曲以限定凸面。 然后，将所安装的部分封装的集成电路封装的现在凸形的表面上的暴露的密封剂重叠或磨去预定的深度，从而提供具有增强的平面性和表面均匀性的集成电路管芯。
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6.发明授权
公开(公告)号：US5961026A
公开(公告)日：1999-10-05
申请号：US977521
申请日：1997-11-24
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
摘要翻译： 提供了用于在两个表面之间分离诸如焊料连接的电连接的装置和方法，其中电连接相对较弱并因此可以容易地分离。 所公开的方法和装置的优选应用是其在器件经过老化测试之后将半导体器件与其器件载体分离的用途。 独特的过程和设备允许多种用途的设备载体进行测试和/或烧录设备。
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公开(公告)号：US5738267A
公开(公告)日：1998-04-14
申请号：US733585
申请日：1996-10-18
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
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8.发明授权
公开(公告)号：US5636781A
公开(公告)日：1997-06-10
申请号：US462369
申请日：1995-06-05
CPC分类号： H05K13/0486 , B23K1/018 , G01R1/0483 , G01R31/2867 , H01L24/799 , H01L24/98 , B23K2201/36 , B23K2201/40 , H01L2224/131 , H01L2224/75703 , H01L2224/7999 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , Y10T156/19
摘要： Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
摘要翻译： 提供了用于在两个表面之间分离诸如焊料连接的电连接的装置和方法，其中电连接相对较弱并因此可以容易地分离。 所公开的方法和装置的优选应用是其在器件经过老化测试之后将半导体器件与其器件载体分离的用途。 独特的过程和设备允许多种用途的设备载体进行测试和/或烧录设备。
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公开(公告)号：US5154793A
公开(公告)日：1992-10-13
申请号：US644716
申请日：1991-01-23
IPC分类号： B29C63/00 , H01L21/60 , H01L21/683 , H05K13/04
CPC分类号： H01L24/81 , B29C63/0013 , H01L21/6838 , H01L24/98 , H05K13/0486 , H01L2224/75 , H01L2224/7999 , H01L2224/81801 , H01L2224/98 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T156/1153 , Y10T156/1911
摘要： A method of removing components bonded to a substrate without damaging either the component-to-be-removed or adjacent components involves bonding a lifting member to an exposed surface of a component-to-be-removed with a bonding layer whose yielding temperature is above the yielding temperature of the bonding layer which bonds the component-to-be-removed to the substrate and then pulling the lifting member under conditions which cause the bond between the component and the substrate to yield. This component removal process enables post removal failure analysis to be performed on a faulty component and also allows a removed good component to be reused by preventing damage to the component being removed.
摘要翻译： 去除与基底结合的组分而不损坏要除去的组分或相邻组分的方法包括将提升构件与屈服温度高于粘合层的待除去组分的暴露表面结合 接合层的接合层的接合温度，其将待除去的组分接合到基底，然后在引起部件和基底之间的结合的条件下拉动提升部件。 该部件去除过程使得能够对故障部件执行后移除故障分析，并且还允许通过防止损坏被去除的部件来重新使用去除的良好部件。
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公开(公告)号：US12057527B2
公开(公告)日：2024-08-06
申请号：US17504534
申请日：2021-10-19
发明人： Chia-Hui Pai , Wen-Hsien Tseng
IPC分类号： H01L33/44 , H01L23/00 , H01L33/38 , H01L33/62 , H01L25/075
CPC分类号： H01L33/44 , H01L24/95 , H01L24/98 , H01L33/38 , H01L33/62 , H01L24/29 , H01L24/83 , H01L25/0753 , H01L2224/2957 , H01L2224/83005 , H01L2224/95001 , H01L2224/98
摘要： A light emitting diode includes a first semiconductor layer, a second semiconductor layer, a first pad, a second pad, and a protection bump. The first semiconductor layer and the second semiconductor layer are overlapping with each other. An area of a first surface of the first semiconductor layer is larger than an area of a second surface of the second semiconductor layer. The first surface faces the second surface. The first pad is electrically connected to the first semiconductor layer. The second pad is electrically connected to the second semiconductor layer. The protection bump is located between the first pad and the second pad.
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