公开(公告)号：US12129144B2

公开(公告)日：2024-10-29

申请号：US17783353

申请日：2021-09-16

Applicant: WON KWANG S&T CO., LTD.

Inventor： Sang Hun Lee ,  Jun Kee Kim ,  Tae Eun Lee ,  Cheong Min Noh

IPC: B32B43/00 ,  B09B3/00 ,  B29B17/02 ,  B65H41/00

CPC classification number: B65H41/00 ,  B09B3/00 ,  B29B17/02 ,  B32B43/006 ,  Y10S156/922 ,  Y10S156/937 ,  Y10T156/1153 ,  Y10T156/1174 ,  Y10T156/1184 ,  Y10T156/1911 ,  Y10T156/195 ,  Y10T156/1956 ,  Y10T156/1967

Abstract: A solar panel cutting unit may include a frame, a transport roller unit provided at the frame to transport, in a first direction, a solar panel having a glass plate, an adhesive layer, a solar cell layer, and a backsheet layer stacked sequentially, a heating unit to heat the solar panel, a pair of pressurization roller units to pressurize and transport the solar panel, a trimmer unit that moves in a second direction perpendicular to the first direction and removes the backsheet layer, the solar cell layer, and the adhesive layer, a peeling unit that inserts a blade into the adhesive layer of the solar panel passing by the trimmer unit and removes a flexible film to which the solar cell layer and the backsheet layer is adhered, and a collection roller that collects the flexible film peeled by the peeling unit.

公开(公告)号：US20190099921A1

公开(公告)日：2019-04-04

申请号：US16126122

申请日：2018-09-10

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Akira KANO ,  Daisuke SAKUMA ,  Keisuke ISOMURA

IPC: B29B17/02

CPC classification number: B29B17/02 ,  B29B2017/0203 ,  B29B2017/0293 ,  B29K2105/12 ,  B32B38/10 ,  B32B43/006 ,  C08J11/08 ,  C08J11/16 ,  C08K7/06 ,  D01F9/12 ,  Y10T156/1116 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1961

Abstract: A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

公开(公告)号：US20180319149A1

公开(公告)日：2018-11-08

申请号：US16036610

申请日：2018-07-16

Applicant: Euna Park

Inventor： Euna Park

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  B32B2038/0076 ,  B32B2309/027 ,  B32B2457/208 ,  Y10S156/93 ,  Y10T156/1153 ,  Y10T156/1911

Abstract: A technique for protecting a portion of a screen panel during a process for disassembling and servicing a display screen device is provided. A first part of the display screen device is separated from a screen panel part of the display screen device, where the screen panel part includes a main screen portion and a circuit of flexible printable circuit board (FPCB) portion. An encapsulant is applied onto a break protectable layer (BPL) of the circuit of flexible printable circuit board (FPCB) portion. The screen panel part is washed, with a solvent to remove residue from the main screen portion.

公开(公告)号：US10072187B2

公开(公告)日：2018-09-11

申请号：US12921032

申请日：2009-03-12

Applicant: Seiji Umemoto ,  Masakuni Fujita

Inventor： Seiji Umemoto ,  Masakuni Fujita

IPC: C09J133/08 ,  C09J133/02 ,  C09J11/06 ,  C09J7/38

CPC classification number: C09J133/02 ,  C09J7/38 ,  C09J11/06 ,  C09J133/08 ,  C09J2433/00 ,  Y02P20/582 ,  Y10T156/1153 ,  Y10T428/1059 ,  Y10T428/28 ,  Y10T428/283 ,  Y10T428/2848

Abstract: The pressure-sensitive adhesive composition of the invention includes a base polymer; and amphiphilic molecule particles that have an aggregate structure of amphiphilic molecules having hydrophilic group and hydrophobic group in the same molecule. The pressure-sensitive adhesive has stable adhesive characteristics and can be reduced in adhesive strength in a desired manner depending on how it is to be used.

公开(公告)号：US20180229487A1

公开(公告)日：2018-08-16

申请号：US15750317

申请日：2015-12-18

Applicant: Jiangsu Cherrity Optronics Co., Ltd

Inventor： Jinhua He

IPC: B32B37/00 ,  H01L33/00 ,  B32B37/08 ,  B32B37/20 ,  B32B38/00

CPC classification number: B32B37/0053 ,  B32B37/08 ,  B32B37/203 ,  B32B38/0004 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/00 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56 ,  H01L2933/005 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1174 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/195 ,  Y10T156/1956

Abstract: An equipment system for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling includes a protective film removing apparatus used for removing a protective film on one side of a photoconversion sheet with protective films on both sides and a roll-bonding apparatus for packaging a flip chip LED array by using the photoconversion sheet containing a protective film on a single side, to form LED package elements. The protective film removing apparatus includes a photoconversion sheet freezing part (2-1, 2-2), a traction part for pulling and removing a protective film on a single side of the frozen photoconversion sheet, and a photoconversion sheet rewarming part (4-1, 4-2) that are sequentially connected and disposed. The roll-bonding apparatus includes two single-wheeled rollers (5-1, 5-2) whose rolling surfaces are both smooth surfaces. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a requirement of a process for bond-package an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.

公开(公告)号：US10018782B2

公开(公告)日：2018-07-10

申请号：US15148389

申请日：2016-05-06

Applicant: CORNING OPTICAL COMMUNICATIONS LLC

Inventor： Qi Wu

IPC: B32B38/10 ,  G02B6/245 ,  B32B43/00 ,  B08B7/00

CPC classification number: G02B6/245 ,  B08B7/0007 ,  B32B38/10 ,  B32B43/006 ,  Y10T156/1153 ,  Y10T156/1911

Abstract: An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater extending at least partially around and at least partially defining an elongate heating region configured for receiving the lengthwise section of the optical fiber. The heater can heat the heating region to a temperature above the thermal decomposition temperature of the at least one coating. A controller automatically deactivates the heater after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region. Thereafter, an air mover can cause ambient air to cool the heater.

公开(公告)号：US20180029210A1

公开(公告)日：2018-02-01

申请号：US15225091

申请日：2016-08-01

Applicant: Sikorsky Aircraft Corporation

Inventor： Scott O. Smith ,  Sven R. Lofstrom ,  Philip Petering

IPC: B25B27/28 ,  C09J5/06

CPC classification number: B25B27/28 ,  B25B5/003 ,  B25B5/006 ,  B25B5/065 ,  B25B27/06 ,  B32B38/10 ,  B32B43/006 ,  C09J5/06 ,  Y10T156/1153 ,  Y10T156/1911

Abstract: A cuff-blade attachment bushing removal tool system includes an alignment plate comprising alignment holes defined through the alignment plate in a pattern of a plurality of bushing holes of a blade root, a bladder plate connected to the alignment plate, and a bladder positioned on the bladder plate such that a gap is formed between the bladder and the alignment plate to receive a blade root to align the alignment holes and the bushing holes of the blade root, wherein the bladder is transitionable between an uninflated position where the blade root can be inserted into the gap and an inflated position where the blade root is clamped between the bladder and the alignment plate.

公开(公告)号：US09862115B2

公开(公告)日：2018-01-09

申请号：US14671760

申请日：2015-03-27

Applicant: Intel Corporation

Inventor： Denica N. Larsen ,  Wing K. Ho

IPC: B29C65/02 ,  B29C65/48 ,  B32B43/00 ,  B26F3/12 ,  G06F1/16 ,  B29L31/34

CPC classification number: B26F3/12 ,  B29L2031/34 ,  G06F1/1626 ,  Y10S156/924 ,  Y10S156/937 ,  Y10T156/1153 ,  Y10T156/1911

Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

公开(公告)号：US09676918B2

公开(公告)日：2017-06-13

申请号：US15183110

申请日：2016-06-15

Applicant: Immunolight, LLC.

Inventor： Zakaryae Fathi ,  John Pacanovsky ,  Frederic A. Bourke, Jr.

IPC: B32B38/10 ,  C08J11/10 ,  B32B7/04 ,  B32B43/00

CPC classification number: C08J11/10 ,  B32B7/04 ,  B32B38/10 ,  B32B43/006 ,  C08J2321/00 ,  Y02W30/702 ,  Y10T156/1153 ,  Y10T156/1917

Abstract: A method is provided for de-bonding objects contained in an article at an interface between the objects, wherein the objects are joined at the interface through an intermediate layer, which involves applying energy from a radiation source, wherein the energy is sufficient to cause destruction of bonds within the intermediate layer; and separating the two objects from one another.

公开(公告)号：US09666674B2

公开(公告)日：2017-05-30

申请号：US14691270

申请日：2015-04-20

Applicant: GLOBALFOUNDRIES INC.

Inventor： Christos D. Dimitrakopoulos ,  Keith E. Fogel ,  Jeehwan Kim ,  Hongsik Park

IPC: H01L29/06 ,  H01L29/16 ,  H01L21/027 ,  H01L21/20 ,  B32B9/04 ,  B32B37/26 ,  B32B38/10 ,  C01B31/00 ,  C01B31/04 ,  B32B9/00 ,  H01L23/532

CPC classification number: H01L29/1606 ,  B32B9/007 ,  B32B9/041 ,  B32B38/10 ,  B32B2307/202 ,  B32B2307/704 ,  C01B32/188 ,  H01L21/0272 ,  H01L21/2007 ,  H01L23/53276 ,  H01L2924/0002 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T428/24612 ,  Y10T428/26 ,  H01L2924/00

Abstract: A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.