-
公开(公告)号：US09984927B2
公开(公告)日：2018-05-29
申请号：US14949691
申请日：2015-11-23
发明人： Mathias Vaupel , Kurt Gehrig , Kian Pin Queck
IPC分类号： B32B43/00 , H01L21/78 , H01L21/67 , H01L21/683
CPC分类号： H01L21/78 , H01L21/67017 , H01L21/67092 , H01L21/67098 , H01L21/67132 , H01L21/6836 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/10 , Y10T156/1121 , Y10T156/1126 , Y10T156/1137 , Y10T156/1153 , Y10T156/1911 , Y10T156/1922 , Y10T156/1939
摘要： An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
-
公开(公告)号：US09922862B2
公开(公告)日：2018-03-20
申请号：US15108027
申请日：2014-01-28
发明人： Andreas Fehkuhrer
IPC分类号： H01L21/687 , B32B43/00 , H01L21/67
CPC分类号： H01L21/68728 , H01L21/67092 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
摘要： A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.
-
公开(公告)号：US09919509B2
公开(公告)日：2018-03-20
申请号：US13977134
申请日：2011-12-16
申请人： Osamu Hirakawa , Naoto Yoshitaka , Masaru Honda , Xavier Francois Brun , Charles Wayne Singleton, Jr.
发明人： Osamu Hirakawa , Naoto Yoshitaka , Masaru Honda , Xavier Francois Brun , Charles Wayne Singleton, Jr.
CPC分类号： B32B43/006 , B32B37/06 , B32B38/10 , B32B41/00 , B32B2309/68 , B32B2310/0472 , B32B2457/14 , H01L21/67051 , H01L21/67092 , H01L21/67103 , H01L21/68728 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1126 , Y10T156/1137 , Y10T156/1153 , Y10T156/1189 , Y10T156/1911 , Y10T156/1939 , Y10T156/1972
摘要： A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.
-
公开(公告)号：US09827740B2
公开(公告)日：2017-11-28
申请号：US14805898
申请日：2015-07-22
申请人： Brewer Science Inc.
发明人： Xiao Liu , Dongshun Bai , Tony D. Flaim , Xing-Fu Zhong , Qi Wu
IPC分类号： B32B38/10 , B32B7/06 , B05D3/00 , B32B27/06 , B32B37/14 , C09D179/08 , H01L21/683 , C08G73/10
CPC分类号： B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
-
公开(公告)号：US20160329233A1
公开(公告)日：2016-11-10
申请号：US15215658
申请日：2016-07-21
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , Li-Wen Hung , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC分类号： H01L21/683 , B32B43/00
CPC分类号： H01L21/6835 , B23K26/57 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/94 , H01L2924/10253 , H01L2924/14 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
-
公开(公告)号：US20160023436A1
公开(公告)日：2016-01-28
申请号：US14805898
申请日：2015-07-22
申请人： Brewer Science Inc.
发明人： Xiao Liu , Dongshun Bai , Tony D. Flaim , Xing-Fu Zhong , Qi Wu
CPC分类号： B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
摘要翻译： 本发明广泛地涉及在微电子制造期间能够实现薄晶片处理的释放层组合物。 优选的剥离层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟， 薄膜。 该方法将释放组合物形成为可用于临时粘合工艺的聚酰亚胺剥离层，并且在所需的加工已经进行之后激光剥离。
-
7.发明申请CLAMPING APPARATUS FOR CLEAVING A BONDED WAFER STRUCTURE AND METHODS FOR CLEAVING 有权用于清除粘结的水平结构的夹紧装置和用于清洗的方法公开(公告)号：US20150375495A1
公开(公告)日：2015-12-31
申请号：US14845327
申请日：2015-09-04
CPC分类号： B32B43/006 , B32B38/10 , C09J2205/302 , H01L21/67092 , H01L2221/68386 , H01L2221/6839 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1184 , Y10T156/1961 , Y10T156/1978 , Y10T225/10 , Y10T225/12 , Y10T225/357 , Y10T225/393
摘要： Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
摘要翻译： 公开了用于机械地切割接合晶片结构的装置和方法。 该装置和方法涉及夹持键合晶片结构并被致动以使接合结构断裂的夹具。
-
公开(公告)号：US09186877B2
公开(公告)日：2015-11-17
申请号：US14551474
申请日：2014-11-24
申请人： EV Group GmbH
IPC分类号： B32B38/10 , B32B43/00 , H01L21/683 , H01L21/67
CPC分类号： B32B43/006 , B32B38/10 , B32B43/003 , B32B2457/14 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2221/6839 , Y10S156/93 , Y10S156/941 , Y10S156/942 , Y10T156/11 , Y10T156/1111 , Y10T156/1121 , Y10T156/1184 , Y10T156/19 , Y10T156/1922 , Y10T156/1961 , Y10T156/1967
摘要： Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
摘要翻译： 用于通过安装在胶片框架上的柔性膜通过互连层从连接到产品基板的载体基板上剥离产品基板的装置，该柔性膜包括用于将产品基板保持在粘合表面部分中的粘合剂层 薄膜，薄膜被安装在薄膜框架上的薄膜的围绕接合表面部分的连接部分中，并且薄膜包括位于接合表面部分和安装部分之间的剥离部分，该装置具有用于 从产品基板的周围进行从载体基板剥离产品基板。
-
公开(公告)号：US09165802B2
公开(公告)日：2015-10-20
申请号：US13663038
申请日：2012-10-29
CPC分类号： B32B43/006 , B32B38/10 , C09J2205/302 , H01L21/67092 , H01L2221/68386 , H01L2221/6839 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1184 , Y10T156/1961 , Y10T156/1978 , Y10T225/10 , Y10T225/12 , Y10T225/357 , Y10T225/393
摘要： Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
摘要翻译： 公开了用于机械地切割接合晶片结构的装置和方法。 该装置和方法涉及夹持键合晶片结构并被致动以使接合结构断裂的夹具。
-
公开(公告)号：US20150239210A1
公开(公告)日：2015-08-27
申请号：US14422476
申请日：2014-04-08
申请人： LG CHEM, LTD.
发明人： Hye Won Jeong , Kyungjun Kim , Kyoung Hoon Kim , Chan Hyo Park , BoRa Shin , Seung Yup Lee , HangAh Park , JinHo Lee , MiRa Im
CPC分类号： C08G73/1067 , B32B3/16 , B32B7/02 , B32B7/06 , B32B7/12 , B32B17/064 , B32B27/06 , B32B27/08 , B32B27/281 , B32B27/286 , B32B27/308 , B32B27/36 , B32B37/26 , B32B43/006 , B32B2037/268 , B32B2250/02 , B32B2250/03 , B32B2255/26 , B32B2307/30 , B32B2307/402 , B32B2307/412 , B32B2307/748 , B32B2379/08 , B32B2457/00 , B32B2457/20 , B32B2457/202 , B32B2457/206 , C03C17/3405 , C03C2218/355 , H01L31/02 , H01L31/18 , H01L51/0024 , H01L51/0097 , H01L51/52 , H01L51/56 , H01L2221/68318 , H01L2227/326 , H01L2251/5338 , Y10S156/93 , Y10T156/1168 , Y10T156/1195 , Y10T428/24942 , Y10T428/265 , Y10T428/31507 , Y10T428/31533 , Y10T428/31623 , Y10T428/31681 , Y10T428/31721 , Y10T428/31736
摘要： The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.
摘要翻译： 本发明涉及一种层压板和使用层压板制造的装置。 层压体包括在载体基板和柔性基板之间包括聚酰亚胺树脂的脱粘层。 通过物理刺激改变脱粘层对柔性基底的粘合强度。 根据本发明，柔性基板可以容易地与载体基板分离，而不需要诸如激光或光照射的进一步处理。 因此，使用层压板有助于制造具有柔性基板的装置。 该设备可以是例如柔性显示设备。 此外，可以防止该装置的可靠性劣化和由激光或光照射引起的缺陷的发生。 这确保了设备的改进的特性和高可靠性。
-
-
-
-
-
-
-
-
-
搜索结果
270 条记录 (耗时 0.023 秒)
