公开(公告)号：US11876014B2

公开(公告)日：2024-01-16

申请号：US17349159

申请日：2021-06-16

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Shigeru Konishi ,  Yoshihiro Kubota

IPC: H01L21/762 ,  H01L21/683

CPC classification number: H01L21/76251 ,  H01L21/6835 ,  H01L2221/6839

Abstract: A highly thermal conductive substrate formed by bonding a device layer formed on a silicon on insulator (SOI) wafer and a buried oxide film to an insulator substrate having a thermal conductivity of 40 W/m·K or more via a low-stress adhesive, wherein a thickness of the buried oxide film is 50 to 500 nm and a thickness of the adhesive is 0.1 to 10 μm.

公开(公告)号：US20230298923A1

公开(公告)日：2023-09-21

申请号：US18017229

申请日：2021-07-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Hiroto OGATA ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: H01L21/683 ,  H01L21/02 ,  C09J7/40 ,  C09J183/04

CPC classification number: H01L21/6835 ,  H01L21/02057 ,  C09J7/40 ,  C09J183/04 ,  H01L2221/68327 ,  H01L2221/6839 ,  C09J2301/502 ,  C09J2301/416

Abstract: A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

公开(公告)号：US20230162997A1

公开(公告)日：2023-05-25

申请号：US17916992

申请日：2021-05-20

Applicant: ENGION CO., LTD.

Inventor： Jae Won CHO

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/02079 ,  H01L21/6836 ,  H01L2221/6839

Abstract: The present invention provides a semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, including: a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon; a delamination feeding unit (300) configured to feed a delamination seal contactable with the protective film so as to peel off the protective film from the semiconductor chip; a covering unit (500, 600) configured to allow the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film; and a delaminating unit (700) configured to peel off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof, and provides a method of controlling the semiconductor chip delamination device.

公开(公告)号：US09472437B2

公开(公告)日：2016-10-18

申请号：US14577369

申请日：2014-12-19

Applicant: SUSS MicroTec Lithography GmbH

Inventor： Gregory George ,  Christopher Rosenthal

IPC: B32B38/10 ,  H01L21/683 ,  H01L21/67 ,  B32B43/00 ,  H01L21/00 ,  H01L21/687 ,  B32B38/18

CPC classification number: H01L21/6835 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/00 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/67282 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68728 ,  H01L2221/683 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/6839 ,  Y10T156/11 ,  Y10T156/1142 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

公开(公告)号：US20160049334A1

公开(公告)日：2016-02-18

申请号：US14861821

申请日：2015-09-22

Applicant: ALTA DEVICES, Inc.

Inventor： Thomas GMITTER ,  Gang HE ,  Melissa ARCHER ,  Andreas HEGEDUS

IPC: H01L21/78 ,  H01L21/306 ,  H01L31/18 ,  H01L21/683

CPC classification number: H01L21/7813 ,  H01L21/30612 ,  H01L21/67086 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L31/184 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2221/6839

Abstract: Embodiments of the invention generally relate to apparatuses and methods for producing epitaxial thin films and devices by epitaxial lift off (ELO) processes. In one embodiment, a method for forming thin film devices during an ELO process is provided which includes coupling a plurality of substrates to an elongated support tape, wherein each substrate contains an epitaxial film disposed over a sacrificial layer disposed over a wafer, exposing the substrates to an etchant during an etching process while moving the elongated support tape, and etching the sacrificial layers and peeling the epitaxial films from the wafers while moving the elongated support tape. Embodiments also include several apparatuses, continuous-type as well as a batch-type apparatuses, for forming the epitaxial thin films and devices, including an apparatus for removing the support tape and epitaxial films from the wafers on which the epitaxial films were grown.

Abstract translation: 本发明的实施例一般涉及通过外延剥离（ELO）工艺制造外延薄膜和器件的装置和方法。 在一个实施例中，提供了一种在ELO工艺期间形成薄膜器件的方法，其包括将多个衬底耦合到细长支撑带，其中每个衬底包含设置在设置在晶片上方的牺牲层上的外延膜， 在移动细长的支撑带的同时蚀刻过程中的蚀刻剂，以及蚀刻牺牲层并在移动细长支撑带的同时从晶片剥离外延膜。 实施例还包括几种用于形成外延薄膜和器件的连续型和间歇式器件的装置，包括用于从其上生长外延膜的晶片去除支撑带和外延膜的装置。

公开(公告)号：US09159596B2

公开(公告)日：2015-10-13

申请号：US13663073

申请日：2012-10-29

Applicant: SunEdison Semiconductor Limited

Inventor： Gregory A. Young ,  Jeffrey L. Libbert

IPC: B32B38/10 ,  H01L21/67 ,  B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  C09J2205/302 ,  H01L21/67092 ,  H01L2221/68386 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1961 ,  Y10T156/1978 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/357 ,  Y10T225/393

Abstract: Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.

Abstract translation: 公开了用于机械地切割接合晶片结构的装置和方法。 该装置和方法涉及夹持键合晶片结构并被致动以使接合结构断裂的夹具。

公开(公告)号：US20130340947A1

公开(公告)日：2013-12-26

申请号：US14013145

申请日：2013-08-29

Applicant: EV Group GmbH

Inventor： Friedrich Paul Lindner ,  Jurgen Burggraf

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  B32B43/003 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10S156/942 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1922 ,  Y10T156/1961 ,  Y10T156/1967

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract translation: 用于通过安装在胶片框架上的柔性膜通过互连层从连接到产品基板的载体基板上剥离产品基板的装置，该柔性膜包括用于将产品基板保持在粘合表面部分中的粘合剂层 薄膜，薄膜被安装在薄膜框架上的薄膜的围绕接合表面部分的连接部分中，并且薄膜包括位于接合表面部分和安装部分之间的剥离部分，该装置具有用于 从产品基板的周围进行从载体基板剥离产品基板。

公开(公告)号：US20130302570A1

公开(公告)日：2013-11-14

申请号：US13921321

申请日：2013-06-19

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Maiko TANAKA ,  Michio URUNO ,  Takayuki MATSUZAKI ,  Ryoji FURUTANI ,  Michio MASHINO ,  Teiichi INADA

IPC: H01L23/00

CPC classification number: H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

Abstract translation: 一种粘合片，其包括放置在剥离基板10和基材膜14之间的剥离基板10，基材膜14和第一粘性层12，其中环状切口D从剥离基板10的表面形成 第一粘合剂层12侧，第一粘合剂层12层叠以覆盖剥离基板10中的切口D的整个内表面，并且切口D的深度d小于 释放基板10和25或更小。

公开(公告)号：US20120160397A1

公开(公告)日：2012-06-28

申请号：US13312997

申请日：2011-12-07

Applicant: Masayuki Yamamoto ,  Saburo Miyamoto

Inventor： Masayuki Yamamoto ,  Saburo Miyamoto

IPC: B32B38/10

CPC classification number: H01L21/67132 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2221/6839 ,  H01L2221/68395

Abstract: A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape.

Abstract translation: 将液体粘合剂施加到半导体晶片的电路表面。 载体与涂覆有粘合剂的半导体晶片的表面接合。 半导体晶片的后表面在保持载体时被研磨。 半导体晶片通过支撑胶带支撑在环形框架上。 载体从半导体晶片去除。 通过将具有大于半导体晶片的直径的宽度的分离带与半导体晶片上的粘合剂接合，将粘合带与半导体晶片与膜状粘合剂一体地分离，然后分离分离带。

公开(公告)号：US20120073743A1

公开(公告)日：2012-03-29

申请号：US13310531

申请日：2011-12-02

Applicant: Maiko TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

Inventor： Maiko TANAKA ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC: B32B37/16 ,  B32B7/06

CPC classification number: H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.