公开(公告)号：US20240352281A1

公开(公告)日：2024-10-24

申请号：US18292056

申请日：2022-07-14

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Yuki USUI ,  Tetsuya SHINJO

IPC: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/683

CPC classification number: C09J5/06 ,  C09J5/04 ,  C09J7/10 ,  C09J183/06 ,  H01L21/6835 ,  C09J2203/326 ,  C09J2301/208 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2301/502 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A method of manufacturing a laminate includes forming a first adhesive coating layer on a surface of a support substrate; forming a second adhesive coating layer on a surface of a semiconductor substrate; and bonding the first and second adhesive coating layer, followed by heating, to form an adhesive layer from the first adhesive coating layer and the second adhesive coating layer, wherein the first adhesive coating layer is formed from a first adhesive composition, the second adhesive coating layer is formed from a second adhesive composition, and one of the first adhesive composition and the second adhesive composition contains a first thermosetting component and a second thermosetting component that reacts with the first thermosetting component in the presence of a catalyst, and the other contains the catalyst, and at least one of the first adhesive composition and the second adhesive composition contains a release agent component.

公开(公告)号：US20230151307A1

公开(公告)日：2023-05-18

申请号：US17912979

申请日：2021-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroshi OGINO ,  Takahisa OKUNO ,  Masaki YANAI ,  Takuya FUKUDA ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Tetsuya SHINJO ,  Kazuhiro SAWADA

IPC: C11D7/50 ,  H01L21/02 ,  C11D11/00

CPC classification number: C11D7/5027 ,  H01L21/02057 ,  C11D11/0047

Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition which contains a solvent but no salt, the solvent containing a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound. As the C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound, a linear-chain hydrocarbon compound is used.

公开(公告)号：US20210130666A1

公开(公告)日：2021-05-06

申请号：US17052223

申请日：2019-04-23

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Kazuhiro SAWADA ,  Shunsuke MORIYA ,  Tetsuya SHINJO ,  Hiroshi OGINO ,  Takahisa OKUNO

IPC: C09J183/04 ,  C09J11/06 ,  C09J5/04 ,  H01L21/683 ,  H01L21/304 ,  B32B7/06

Abstract: A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is cured by a hydrosilylation reaction; a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and a solvent (C). The component (A) may include a polysiloxane (A1) including a polyorganosiloxane (a1) containing a C1-10 alkyl group and a C2-10 alkenyl group, and a polyorganosiloxane (a2) containing a C1-10 alkyl group and a hydrogen atom; and a platinum group metal-based catalyst (A2). The polymerization inhibitor (B) may be a compound of formula (1): (wherein R7 and R8 are each a C6-40 aryl group, or a combination of a C1-10 alkyl group and a C6-40 aryl group).

公开(公告)号：US20200216731A1

公开(公告)日：2020-07-09

申请号：US16627993

申请日：2018-07-05

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Shunsuke MORIYA ,  Tomoyuki ENOMOTO ,  Tetsuya SHINJO ,  Hiroshi OGINO ,  Kazuhiro SAWADA

IPC: C09J183/04 ,  H01L21/304 ,  H01L21/683 ,  C08G77/00 ,  C09J5/06

Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

公开(公告)号：US20230298923A1

公开(公告)日：2023-09-21

申请号：US18017229

申请日：2021-07-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Hiroto OGATA ,  Masaki YANAI ,  Tetsuya SHINJO

IPC: H01L21/683 ,  H01L21/02 ,  C09J7/40 ,  C09J183/04

CPC classification number: H01L21/6835 ,  H01L21/02057 ,  C09J7/40 ,  C09J183/04 ,  H01L2221/68327 ,  H01L2221/6839 ,  C09J2301/502 ,  C09J2301/416

Abstract: A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

公开(公告)号：US20230151308A1

公开(公告)日：2023-05-18

申请号：US17913624

申请日：2021-03-22

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Takahisa OKUNO ,  Masaki YANAI ,  Takuya FUKUDA ,  Hiroto OGATA ,  Shunsuke MORIYA ,  Hiroshi OGINO ,  Tetsuya SHINJO

IPC: C11D11/00 ,  C11D7/50 ,  C09J5/00 ,  H01L21/02 ,  B08B3/08

CPC classification number: C11D11/0047 ,  C11D7/5022 ,  C11D7/5013 ,  C11D7/5009 ,  C09J5/00 ,  H01L21/02079 ,  B08B3/08 ,  C09J2483/00 ,  B08B2220/01

Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.


L1-L3-L2(L)

公开(公告)号：US20230143007A1

公开(公告)日：2023-05-11

申请号：US17801016

申请日：2021-02-16

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroto OGATA ,  Tetsuya SHINJO

IPC: C09J7/40 ,  C09J183/04 ,  C09J7/38 ,  B32B7/12

CPC classification number: C09J7/401 ,  B32B7/12 ,  C09J7/38 ,  C09J183/04 ,  C09J2203/326 ,  H01L21/6836

Abstract: The invention provides a laminate having a first substrate formed of a semiconductor substrate; a second substrate formed of a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the first substrate and the second substrate, characterized in that the release layer is a film formed from a releasing agent composition containing a polynuclear phenol derivative represented by formula (P) (wherein Ar represents an arylene group), a cross-linking agent, and at least one of an acid generator and an acid.

公开(公告)号：US20220411684A1

公开(公告)日：2022-12-29

申请号：US17787663

申请日：2020-12-15

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Hiroto OGATA ,  Tetsuya SHINJO ,  Hiroshi OGINO ,  Shunsuke MORIYA ,  Takahisa OKUNO ,  Takuya FUKUDA ,  Masaki YANAI

IPC: C09J183/04 ,  B32B7/12 ,  B32B37/12 ,  B32B43/00 ,  B32B17/06 ,  B32B7/06 ,  B32B38/00 ,  B32B9/04 ,  H01L21/683

Abstract: The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa·S) or higher.

公开(公告)号：US20220002602A1

公开(公告)日：2022-01-06

申请号：US17294144

申请日：2019-11-14

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Kazuhiro SAWADA ,  Shunsuke MORIYA ,  Tetsuya SHINJO ,  Takuya FUKUDA

IPC: C09J183/04 ,  C09J5/00 ,  C08G77/20 ,  B32B43/00 ,  B32B7/12 ,  B32B37/12 ,  H01L21/683

Abstract: An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.

公开(公告)号：US20250043216A1

公开(公告)日：2025-02-06

申请号：US18692622

申请日：2022-09-13

Applicant: NISSAN CHEMICAL CORPORATION

Inventor： Masafumi YAGYU ,  Takahisa OKUNO ,  Tetsuya SHINJO

IPC: C11D7/32 ,  C09J5/00 ,  C09J183/12 ,  C11D7/50 ,  H01L21/02

Abstract: A method for cleaning a semiconductor substrate includes releasing and dissolving an adhesive layer formed on a semiconductor substrate using a releasing and dissolving composition, in which the releasing and dissolving composition contains: a component [I]: a quaternary ammonium salt; a component [II]: an amide-based solvent; and a component [III]: a solvent represented by the following Formula (L), where L represents a substituent substituted on a benzene ring and each independently represents an alkyl group having 1 to 4 carbon atoms, and k represents the number of L and is an integer of 0 to 5.