公开(公告)号：US20240299793A1

公开(公告)日：2024-09-12

申请号：US18662270

申请日：2024-05-13

申请人： THE CHEMOURS COMPANY FC,LLC

发明人： MARK L. ROBIN ,  KONSTANTINOS KONTOMARIS

IPC分类号： A62D1/00 ,  A01N29/00 ,  A62D1/02 ,  B01D11/02 ,  C08J9/14 ,  C09K3/30 ,  C09K5/00 ,  C09K5/04 ,  C10M105/04 ,  C10M105/52 ,  C11D7/50 ,  H01B3/24 ,  H01B3/56 ,  H05F3/04

CPC分类号： A62D1/0057 ,  A01N29/00 ,  A62D1/0071 ,  A62D1/0092 ,  B01D11/0288 ,  C08J9/144 ,  C08J9/146 ,  C09K3/30 ,  C09K5/00 ,  C09K5/044 ,  C09K5/045 ,  C09K5/048 ,  C10M105/04 ,  C10M105/52 ,  C11D7/5018 ,  H01B3/24 ,  H01B3/56 ,  H05F3/04 ,  C08J2203/162 ,  C08J2203/182 ,  C08J2203/202 ,  C08J2367/00 ,  C09K2205/12 ,  C09K2205/126 ,  C09K2205/24 ,  C09K2205/32 ,  C10M2203/045 ,  C10M2211/0225

摘要： Disclosed is a mixture comprising the compound trans-1,1,1,4,4,4-hexafluoro-2-butene and 1,1-difluoroethane (R-152a). Also disclosed are methods of using and products of using the above compositions as blowing agents, solvents, heat transfer compositions, aerosol propellant compositions, fire extinguishing and suppressant compositions.

公开(公告)号：US20240231237A9

公开(公告)日：2024-07-11

申请号：US18400807

申请日：2023-12-29

申请人： FUJIFILM Corporation

发明人： Tomonori TAKAHASHI ,  Tetsuya KAMIMURA

IPC分类号： G03F7/42 ,  C11D3/00 ,  C11D7/04 ,  C11D7/20 ,  C11D7/26 ,  C11D7/32 ,  C11D7/34 ,  C11D7/50 ,  H01L21/02

CPC分类号： G03F7/425 ,  C11D3/0073 ,  C11D7/04 ,  C11D7/20 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3227 ,  C11D7/3281 ,  C11D7/34 ,  C11D7/5004 ,  C11D7/5009 ,  C11D7/5022 ,  G03F7/423 ,  G03F7/426 ,  H01L21/02063 ,  H01L21/02068 ,  C11D2111/22

摘要： A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10−12 to 10−4.

公开(公告)号：US20240150683A1

公开(公告)日：2024-05-09

申请号：US18411354

申请日：2024-01-12

申请人： AGC Inc.

发明人： Satoshi KAWAGUCHI

IPC分类号： C11D7/50 ,  B05D3/04 ,  C09K5/04

CPC分类号： C11D7/5018 ,  B05D3/046 ,  C09K5/045 ,  C09K2205/126 ,  C11D2111/16

摘要： To provide a solvent composition that can suppress corrosion of a metal, a cleaning method using the solvent composition, and a method for producing an article with a coating film. A solvent composition comprising, as a first component, 1-chloro-2,3,3-trifluoropropene and, as a second component, at least one member selected from the group consisting of 1,2,3,3-tetrachloropropene, 1,2,3-trichloro-3-fluoropropene, 1,3,3-trichloro-2-fluoropropene, 1,3-dichloro-2,3-difluoropropene, 2-chloro-3,3-difluoropropene, 2,3,3-trifluoropropene, 1,3-dichloro-1,2,2-trifluoropropane, 1-chloro-1,2,2,3-tetrafluoropropane, 2-chloro-1,1,3,3-tetrafluoropropane, 2-chloro-1,1,2-trifluoropropane and chloroform, characterized in that the ratio of the total content of the second component to the sum of the content of 1-chloro-2,3,3-trifluoropropene and the total content of the second component, is from 0.0001 to 1.0 mass %.

公开(公告)号：US11965148B2

公开(公告)日：2024-04-23

申请号：US15839204

申请日：2017-12-12

申请人： Mainstream Engineering Corporation

发明人： Ted J. Amundsen

IPC分类号： C11D3/24 ,  C11D7/28 ,  C11D7/30 ,  C11D7/50

CPC分类号： C11D7/5018 ,  C11D7/30 ,  C11D7/5022

摘要： An aerosolized HVAC/R system solvent for decontaminating HVAC/R components and line sets The solvent contains 25-90 wt % propellant, and 10-75 wt % solvent mixture which is about 60-95 wt % trans-1,2,dichloroethylene, about 5-20 wt % n-propanol, and an inerting constituent providing a weight percent ratio of the inerting constituent to n-propanol of less than 1.5. The solvent is packaged in a container that is connected to the HVAC/R components or line sets to be decontaminated for supplying the solvent mixture under pressure to the HVAC/R components or line sets.

公开(公告)号：US20240076586A1

公开(公告)日：2024-03-07

申请号：US18459859

申请日：2023-09-01

申请人： Hangzhou Joinleader New Materials Co., Ltd.

发明人： Cheng FU ,  Shengyu GE ,  Huijun GUO ,  Liang ZHAO

IPC分类号： C11D7/50 ,  C11D7/24 ,  C11D7/26 ,  C11D7/34 ,  C11D11/00

CPC分类号： C11D7/5009 ,  C11D7/24 ,  C11D7/263 ,  C11D7/34 ,  C11D7/5027 ,  C11D11/0029 ,  C11D11/0035

摘要： The present disclosure provides a formula of a remover reagent for a cured silicone sealant and a method using the same. The remover reagent is prepared from an acid catalyst and a solvent each having a high boiling point and a high flash point. The acid catalyst is benzenesulfonic acid or alkylbenzenesulfonic acid. The solvent is mineral oil and/or silicone oil. The cured silicone sealant is first soaked with the remover reagent for 30 to 120 min, and then baked at a high temperature of 80 to 120° C. for 10 min or above into debris or powder, whereby the cured silicone sealant with a thickness of 10 mm or above can be removed. Moreover, the remover reagent has the advantages of readily available raw materials, high safety, environmentally friendliness, convenient preparation and good sealant removal effect, and thus, has good application prospects.

公开(公告)号：US11905490B2

公开(公告)日：2024-02-20

申请号：US17275629

申请日：2019-09-19

申请人： Kanto Kagaku Kabushiki Kaisha

发明人： Areji Takanaka

IPC分类号： C11D3/37 ,  C11D11/00 ,  C11D1/16 ,  C11D7/08 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  H01L21/02

CPC分类号： C11D11/0047 ,  C11D1/16 ,  C11D7/08 ,  C11D7/261 ,  C11D7/266 ,  C11D7/267 ,  C11D7/3209 ,  C11D7/50 ,  H01L21/02068

摘要： An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present.
The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

公开(公告)号：US20240050792A1

公开(公告)日：2024-02-15

申请号：US18383173

申请日：2023-10-24

申请人： DAIKIN INDUSTRIES, LTD.

发明人： Kazuhiro TAKAHASHI

IPC分类号： A62D1/00 ,  B01D3/14 ,  B01D3/36 ,  C07C17/383 ,  C08J9/12 ,  C08J9/14 ,  C09K3/14 ,  C09K3/30 ,  C09K5/04 ,  C11D7/50 ,  H01B3/56

CPC分类号： A62D1/0057 ,  B01D3/143 ,  B01D3/36 ,  C07C17/383 ,  C08J9/127 ,  C08J9/146 ,  C09K3/1472 ,  C09K3/30 ,  C09K5/045 ,  C11D7/5018 ,  C11D7/5036 ,  H01B3/56 ,  C08J2203/142 ,  C08J2203/182 ,  C09K2205/122 ,  C09K2205/22 ,  C09K2205/32

摘要： The present disclosure provides a novel azeotropic or azeotrope-like composition comprising hydrogen fluoride and 1,1,2-trifluoroethane (HFC-143), 1-chloro-2, 2-difluoroethane (HCFC-142), or 1,2-dichloro-1-fluoroethane (HCFC-141); and a separation method using the composition.
An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HFC-143. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-142. An azeotropic or azeotrope-like composition comprising hydrogen fluoride and HCFC-141. A separation method of a composition comprising hydrogen fluoride and at least one member selected from the group consisting of HFC-143, HCFC-142, and HCFC-141.

公开(公告)号：US11872603B2

公开(公告)日：2024-01-16

申请号：US16304836

申请日：2017-05-24

申请人： BROOKS AUTOMATION (GERMANY) GMBH

发明人： Lutz Rebstock ,  Matthias Fryda ,  Thorsten Matthée

IPC分类号： B08B3/08 ,  C02F1/461 ,  C11D7/10 ,  C11D7/50 ,  C11D11/00 ,  H01L21/673

CPC分类号： B08B3/08 ,  C02F1/4618 ,  C11D7/10 ,  C11D7/50 ,  C11D11/0035 ,  H01L21/67389 ,  C02F2001/46195 ,  C02F2201/46115

摘要： The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.

公开(公告)号：US20240010952A1

公开(公告)日：2024-01-11

申请号：US18139380

申请日：2023-04-26

申请人： Fujifilm Electronic Materials U.S.A., Inc.

发明人： Jieying Jiao ,  Thomas Dory

IPC分类号： C11D3/34 ,  C11D7/50 ,  C11D11/00 ,  C11D3/30

CPC分类号： C11D3/34 ,  C11D7/5004 ,  C11D11/007 ,  C11D11/0047 ,  C11D3/30

摘要： This disclosure relates to compositions for cleaning post etching residues on a semiconductor substrate, as well as related cleaning methods.

公开(公告)号：US20230416582A1

公开(公告)日：2023-12-28

申请号：US18456665

申请日：2023-08-28

申请人： Mexichem Amanco Holding S.A. de C.V.

发明人： Robert Low

IPC分类号： C09K5/04 ,  C08J9/14 ,  C09K3/30 ,  C11D7/50 ,  F03C99/00 ,  B01D11/02 ,  B01D11/04 ,  G06Q30/018

CPC分类号： C09K5/045 ,  C08J9/149 ,  C09K3/30 ,  C11D7/5018 ,  F03C99/00 ,  B01D11/0288 ,  B01D11/0492 ,  C08J9/146 ,  G06Q30/018 ,  Y10T29/49716 ,  C08J2203/14 ,  C08J2203/142 ,  C08J2203/16 ,  C08J2203/162 ,  C08J2203/202 ,  C09K2205/12 ,  C09K2205/126 ,  C09K2205/22 ,  Y02A40/963 ,  C08J2325/06 ,  C08J2363/00 ,  C08J2375/04 ,  C09K2205/122

摘要： A heat transfer composition includes:



(i) trans-1,3,3,3-tetrafluoropropene (R-1234ze(E));
(ii) a second component selected from difluoromethane (R-32), propene (R-1270), propane (R290) and mixtures thereof;
(iii) a third component selected from pentafluoroethane (R-125), 1,1,1,2-tetraflueroethane (R-34a), and mixtures thereof; and optionally
(iv) a fourth component selected from fluoroethane (R-161), 1,1-difluoroethane (R-152a) and mixtures thereof.