Process and composition for removing substances from substrates
    7.
    发明授权
    Process and composition for removing substances from substrates 有权
    从基材中去除物质的工艺和组成

    公开(公告)号:US09158202B2

    公开(公告)日:2015-10-13

    申请号:US13834513

    申请日:2013-03-15

    申请人: Dynaloy, LLC

    IPC分类号: G03F7/42 C11D7/32 C11D11/00

    摘要: Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.

    摘要翻译: 描述了可用于从基底例如光致抗蚀剂晶片去除有机和有机金属物质的组合物。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法,从而加入足够的热量,并通过漂洗完全除去有机或有机金属物质。 组合物和方法可适用于从电子设备中去除和在一些情况下完全溶解正和负变种的光致抗蚀剂,特别是负的干膜光致抗蚀剂。

    Process And Composition For Removing Substances From Substrates
    9.
    发明申请
    Process And Composition For Removing Substances From Substrates 有权
    用于从基材去除物质的工艺和组成

    公开(公告)号:US20140142017A1

    公开(公告)日:2014-05-22

    申请号:US13834513

    申请日:2013-03-15

    申请人: DYNALOY, LLC

    IPC分类号: G03F7/42

    摘要: Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.

    摘要翻译: 描述了可用于从基底例如光致抗蚀剂晶片去除有机和有机金属物质的组合物。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法,从而加入足够的热量,并通过漂洗完全除去有机或有机金属物质。 组合物和方法可适用于从电子设备中去除和在一些情况下完全溶解正和负变种的光致抗蚀剂,特别是负的干膜光致抗蚀剂。

    SILICONE SOLVENT
    10.
    发明申请
    SILICONE SOLVENT 有权
    硅胶溶剂

    公开(公告)号:US20140135251A1

    公开(公告)日:2014-05-15

    申请号:US14123848

    申请日:2012-06-04

    IPC分类号: C11D7/50

    CPC分类号: C11D7/5009 C08K3/32 C08L83/04

    摘要: A composition comprising a phosphonitrile halide and an oligomeric organopolysiloxanes having from 10 to 50 Si units is effective to remove silicone residues from substrates with minimal swelling of thin polymer substrates.

    摘要翻译: 包含磷腈卤化物和具有10至50个Si单元的低聚有机聚硅氧烷的组合物有效地从基材中除去薄的聚合物基材溶胀的硅氧烷残余物。