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公开(公告)号：US10062679B2
公开(公告)日：2018-08-28
申请号：US15847493
申请日：2017-12-19
Applicant: MICRON TECHNOLOGY, INC.
Inventor： Michel Koopmans
CPC classification number: H01L25/50 , H01L21/6835 , H01L21/78 , H01L22/14 , H01L24/80 , H01L24/97 , H01L25/18 , H01L2221/68354 , H01L2221/68395 , H01L2224/80006 , H01L2224/80203 , H01L2224/95001
Abstract: Apparatuses and methods for forming die stacks are disclosed herein. An example method includes dispensing a temporary adhesive onto a substrate, placing a base die onto the temporary adhesive, curing the temporary adhesive, forming a die stack that includes the base die, activating a release layer disposed on the substrate, wherein the release layer is between the substrate and the temporary adhesive, removing the die stack from the substrate, and removing the temporary adhesive from the die stack.
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公开(公告)号：US20170154902A1
公开(公告)日：2017-06-01
申请号：US15428285
申请日：2017-02-09
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
CPC classification number: H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
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公开(公告)号：US20160314999A1
公开(公告)日：2016-10-27
申请号：US15204091
申请日：2016-07-07
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
IPC: H01L21/67 , H01L21/683 , B32B43/00 , H01L27/12
CPC classification number: H01L27/1266 , B32B43/006 , G02F1/1303 , G02F1/13306 , G06K19/0772 , H01L21/67132 , H01L21/6835 , H01L27/1214 , H01L27/1218 , H01L27/156 , H01L31/1892 , H01L31/206 , H01L33/005 , H01L51/003 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , H01L2221/68395 , H01L2227/326 , H01L2251/5338 , H01L2924/19041 , H01L2924/30105 , Y10T29/41
Abstract: To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
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公开(公告)号：US20120160397A1
公开(公告)日：2012-06-28
申请号：US13312997
申请日：2011-12-07
Applicant: Masayuki Yamamoto , Saburo Miyamoto
Inventor： Masayuki Yamamoto , Saburo Miyamoto
IPC: B32B38/10
CPC classification number: H01L21/67132 , H01L21/67092 , H01L21/6715 , H01L21/6836 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
Abstract: A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape.
Abstract translation: 将液体粘合剂施加到半导体晶片的电路表面。 载体与涂覆有粘合剂的半导体晶片的表面接合。 半导体晶片的后表面在保持载体时被研磨。 半导体晶片通过支撑胶带支撑在环形框架上。 载体从半导体晶片去除。 通过将具有大于半导体晶片的直径的宽度的分离带与半导体晶片上的粘合剂接合，将粘合带与半导体晶片与膜状粘合剂一体地分离，然后分离分离带。
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公开(公告)号：US07846289B2
公开(公告)日：2010-12-07
申请号：US11587854
申请日：2005-04-27
Applicant: Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
Inventor： Masaki Tsujimoto , Takahisa Yoshioka , Kenji Kobayashi
IPC: B32B38/10
CPC classification number: H01L21/68714 , B29C63/0013 , H01L21/67092 , H01L21/67132 , H01L2221/6834 , H01L2221/68395 , H01L2224/16 , H01L2924/01004 , H01L2924/01078 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1978
Abstract: A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.
Abstract translation: 剥离装置10包括：支撑粘贴有片材S的晶片W的剥离台11和设置在剥离台11上方的片材剥离单元12，其中片材S可以通过片材剥离单元12的相对运动而被剥离 和剥离台11.剥离装置10包括剥离带PT的支撑辊20，将剥离带PT粘合到片材S表面的第一和第二辊30,31以及剥离带PT的卷绕辊21。 在形成初始剥离角度a1的状态下执行剥离，使得剥离带PT在形成在第二辊31和片材S之间的孔C中折叠，然后在随后的剥离角度剥离片材S a2对应于第二辊31的直径。
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Patent Agency Ranking
公开(公告)号：US07686916B2
公开(公告)日：2010-03-30
申请号：US10577258
申请日：2004-10-21
Applicant: Masaki Tsujimoto , Takahisa Yoshioka
Inventor： Masaki Tsujimoto , Takahisa Yoshioka
IPC: B32B38/10
CPC classification number: H01L21/67132 , H01L2221/68395 , Y10T156/1168 , Y10T156/195 , Y10T156/1978
Abstract: There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units. A sheet peeling apparatus for peeling off a sheet stuck on the surface of a semiconductor wafer by using an adhesive tape of a width narrower than that of the sheet, which is equipped with a peeling head for peeling off the sheet by pulling the adhesive tape in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers for peeling off the sheet by pulling the adhesive tape in the substantially right angle or acute angle direction in a state stuck with the adhesive tape in the direction across the sheet. Either of the peeling units are selectively used in accordance with the type of the sheet.
Abstract translation: 提供了使用多个剥离单元的片材剥离装置和剥离方法。 一种片剥离装置，用于通过使用宽度窄于片材的宽度的胶带剥离粘附在半导体晶片的表面上的片材，该带材具有用于通过将粘合带拉出来剥离片材的剥离头 在粘贴在片材端部的状态下的钝角方向; 以及第一和第二辊，用于通过在粘合带沿着穿过纸张的方向的状态下拉动粘合带以大致直角或锐角方向剥离片材。 根据片材的类型选择性地使用任一剥离单元。
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7.发明申请Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer 有权用于加工晶片的方法和装置，除了包括分离层和支撑层的晶片外公开(公告)号：US20090176349A1
公开(公告)日：2009-07-09
申请号：US12359730
申请日：2009-01-26
Applicant: Andreas JAKOB , Klaus-D VISSING , Volkmar STENZEL
Inventor： Andreas JAKOB , Klaus-D VISSING , Volkmar STENZEL
CPC classification number: H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395
Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.
Abstract translation: 描述了用于处理晶片的工艺和设备，特别是用于晶片的减薄。 还描述了具有载体层和布置在载体层和晶片之间的中间层的晶片，其中中间层是粘附到晶片并且比载体层更坚固地粘附到晶片上的等离子体聚合物层。
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8.发明申请Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit 审中-公开切割胶带安装单元，其可将预切割的切割带和通用切割带附接到晶片和具有切割带附接单元的在线系统公开(公告)号：US20060177954A1
公开(公告)日：2006-08-10
申请号：US11397824
申请日：2006-04-03
Applicant: Ki-Kwon Jeong , Dong-Kuk Kim
Inventor： Ki-Kwon Jeong , Dong-Kuk Kim
CPC classification number: H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/68395 , Y10T29/49121 , Y10T29/5313 , Y10T29/53187 , Y10T29/53261
Abstract: A dicing tape attaching unit that can attach both a pre-cut dicing tape and a general dicing tape to a wafer in a semiconductor package assembling process, and an in-line system used in a semiconductor package process including the dicing tape attaching unit are provided. The dicing tape attaching unit supplies one of the pre-cut dicing tape and the general dicing tape and attaches it to a wafer according to the direction of rotation of a tape loader. Accordingly, without an additional pre-cut dicing tape attaching unit, either of the pre-cut dicing tape and the general dicing tape can be attached to the back side of the wafer by one and the same unit.
Abstract translation: 在半导体封装组装工序中，可以将预切割的切割带和一般的切割带与晶片连接的切割胶带安装单元，以及在包括切割胶带安装部的半导体封装工序中使用的在线系统 。 切割胶带安装单元提供预切割切割带和一般切割带中的一个，并根据带式装载机的旋转方向将其附接到晶片。 因此，没有附加的预切割切割胶带安装单元，预切割切割带和一般切割带中的任一个可以通过同一单元附接到晶片的背面。
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公开(公告)号：US06716295B2
公开(公告)日：2004-04-06
申请号：US10314276
申请日：2002-12-09
Applicant: Masayuki Yamamoto
Inventor： Masayuki Yamamoto
IPC: B32B3128
CPC classification number: H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , Y10T156/1994
Abstract: A protective tape is applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table. The protective tape is cut to the shape of the wafer by a cutter unit. Then, a protective tape having stronger adhesion than the first protective tape is applied over the protective tape. The protective tapes in plies are separated together from the surface of the wafer in one separating operation of a tape separating device.
Abstract translation: 通过带施加机构将保护带施加到由卡盘台吸引支撑的晶片的表面。 保护带通过切割单元切割成晶片的形状。 然后，将比第一保护带更牢固的保护带施加在保护带上。 在带分离装置的一次分离操作中，层状物中的保护带在晶片表面分离。
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公开(公告)号：US20030121599A1
公开(公告)日：2003-07-03
申请号：US10314276
申请日：2002-12-09
Inventor： Masayuki Yamamoto
IPC: B32B031/00
CPC classification number: H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , Y10T156/1994
Abstract: A protective tape is applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table. The protective tape is cut to the shape of the wafer by a cutter unit. Then, a protective tape having stronger adhesion than the first protective tape is applied over the protective tape. The protective tapes in plies are separated together from the surface of the wafer in one separating operation of a tape separating device.
Abstract translation: 通过带施加机构将保护带施加到由卡盘台吸引支撑的晶片的表面。 保护带通过切割单元切割成晶片的形状。 然后，将比第一保护带更牢固的保护带施加在保护带上。 在带分离装置的一次分离操作中，层状物中的保护带在晶片表面分离。
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