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公开(公告)号：US20190115243A1
公开(公告)日：2019-04-18
申请号：US16214422
申请日：2018-12-10
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , Li-Wen Hung , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC分类号： H01L21/683 , B32B43/00 , H01L21/78 , B23K26/57 , H01L21/67
CPC分类号： H01L21/6835 , B23K26/57 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/94 , H01L2924/10253 , H01L2924/14 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
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2.发明申请公开(公告)号：US20180269077A1
公开(公告)日：2018-09-20
申请号：US15916265
申请日：2018-03-08
发明人： Chunbin Zhang
IPC分类号： H01L21/67 , H01L21/78 , C09J7/20 , H01L21/683 , B32B43/00
CPC分类号： H01L21/6715 , B32B43/003 , B32B43/006 , B32B2457/14 , C09J5/00 , C09J7/201 , C09J2203/326 , C09J2205/302 , H01L21/67051 , H01L21/6708 , H01L21/67092 , H01L21/6836 , H01L21/7813 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1111 , Y10T156/1126 , Y10T156/1933
摘要： A method of debonding a temporarily adhesive-bonded carrier-workpiece pair employs a stream of a solvent at a high pressure. The carrier and the workpiece are bonded with an adhesive that is dissolvable in a selected solvent. The workpiece such as a device wafer may have been thinned and processed. The solvent is applied to the adhesive at a high pressure to debond and dissolve the adhesive with high throughput. The dissolved adhesive can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.
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公开(公告)号：US10076900B2
公开(公告)日：2018-09-18
申请号：US15117423
申请日：2015-03-17
申请人： LG CHEM, LTD.
发明人： San Park , Bong su Jeung , Jea han Ryoo , Cheon ho Park , Sukjae Lee , Kyoung sik Kim
CPC分类号： B32B43/006 , B32B37/003 , B32B37/06 , B32B38/10 , B32B2307/42 , B32B2457/20 , B65H29/54 , B65H41/00 , B65H2301/51122 , B65H2801/61 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1978
摘要： The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a roller of the peeling bar. The radius of the roller of the peeling bar and the inclined surface of the fixing unit are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar.According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.
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公开(公告)号：US09865564B2
公开(公告)日：2018-01-09
申请号：US14624601
申请日：2015-02-18
申请人： GLOBALFOUNDRIES Inc.
发明人： Maxime Cadotte , Luc Guerin , Van Thanh Truong , Steve Whitehead
IPC分类号： B32B38/10 , B32B43/00 , H01L21/00 , H01L23/00 , B08B7/00 , H01L21/02 , H01L21/311 , B32B38/00 , B23K103/00
CPC分类号： H01L24/799 , B08B7/0042 , B23K2103/42 , B23K2103/50 , B32B38/0008 , B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/02076 , H01L21/31127 , H01L24/27 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/05442 , H01L2924/07025 , H01L2924/12042 , H01L2924/3025 , H01L2924/40501 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1158 , Y10T156/1917 , H01L2924/00
摘要： A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
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公开(公告)号：US09865491B2
公开(公告)日：2018-01-09
申请号：US15401344
申请日：2017-01-09
发明人： Elena Becerra Woodard , Daniel Kwadwo Amponsah Berkoh , David James Zapp , Steve Canale , Hyong Yong Lee , Daniel Eduardo Sanchez , Hung V. Phan
IPC分类号： H01L21/683 , B32B43/00
CPC分类号： H01L21/6835 , B23Q3/084 , B32B43/006 , H01L21/67092 , H01L21/6838 , H01L2221/68327 , H01L2221/68359 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1132 , Y10T156/1933 , Y10T156/1944 , Y10T156/1978 , Y10T428/21 , Y10T428/219
摘要： Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.
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公开(公告)号：US20170117183A1
公开(公告)日：2017-04-27
申请号：US14949691
申请日：2015-11-23
发明人： Mathias VAUPEL , Kurt GEHRIG , Kian Pin QUECK
IPC分类号： H01L21/78 , H01L21/683 , H01L21/67
CPC分类号： H01L21/78 , H01L21/67017 , H01L21/67092 , H01L21/67098 , H01L21/67132 , H01L21/6836 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/10 , Y10T156/1121 , Y10T156/1126 , Y10T156/1137 , Y10T156/1153 , Y10T156/1911 , Y10T156/1922 , Y10T156/1939
摘要： An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
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7.发明申请公开(公告)号：US20160358806A1
公开(公告)日：2016-12-08
申请号：US15238363
申请日：2016-08-16
发明人： Xue MAO
IPC分类号： H01L21/683 , B32B43/00 , H01L27/12
CPC分类号： H01L21/6835 , B32B43/006 , B32B2315/08 , B32B2457/20 , G02F1/1303 , G02F1/133305 , H01L21/78 , H01L27/1218 , H01L27/1262 , H01L27/1266 , H01L2221/6835 , H01L2221/68395 , Y10S156/93 , Y10S156/941 , Y10T156/1174 , Y10T156/195
摘要： An apparatus of separating a flexible substrate from a glass substrate comprises a cylinder-shaped roller; and a control unit connected to the roller configured to control a rotation of the roller so as to separate a flexible substrate from a glass substrate by the rotation of the roller; the roller has a cylinder surface provided with a depressed area thereon, and the depressed area is configured to allow a driver IC on the flexible substrate to be received by the depressed area during the rotation of the roller, thereby preventing the driver IC from being damaged.
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8.发明授权Apparatus of separating flexible substrate from glass substrate and manufacturing equipment thereof 有权将柔性基板与玻璃基板分离的装置及其制造设备公开(公告)号：US09508585B2
公开(公告)日：2016-11-29
申请号：US14355072
申请日：2013-12-16
发明人： Xue Mao
IPC分类号： B32B38/10 , H01L21/683 , H01L21/78 , B32B43/00 , G02F1/1333 , G02F1/13 , H01L27/12
CPC分类号： H01L21/6835 , B32B43/006 , B32B2315/08 , B32B2457/20 , G02F1/1303 , G02F1/133305 , H01L21/78 , H01L27/1218 , H01L27/1262 , H01L27/1266 , H01L2221/6835 , H01L2221/68395 , Y10S156/93 , Y10S156/941 , Y10T156/1174 , Y10T156/195
摘要： An apparatus of separating a flexible substrate from a glass substrate comprises a cylinder-shaped roller; and a control unit connected to the roller configured to control a rotation of the roller so as to separate a flexible substrate from a glass substrate by the rotation of the roller; the roller has a cylinder surface provided with a depressed area thereon, and the depressed area is configured to allow a driver IC on the flexible substrate to be received by the depressed area during the rotation of the roller, thereby preventing the driver IC from being damaged.
摘要翻译： 将柔性基板从玻璃基板分离的装置包括：圆筒形辊; 以及连接到所述辊的控制单元，所述控制单元被配置为控制所述辊的旋转，以便通过所述辊的旋转将柔性基板与玻璃基板分离; 辊具有在其上设置有凹陷区域的圆筒表面，并且凹陷区域被配置为允许柔性基板上的驱动器IC在辊旋转期间被凹陷区域接收，从而防止驱动器IC损坏 。
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9.发明授权公开(公告)号：US09281229B2
公开(公告)日：2016-03-08
申请号：US14556298
申请日：2014-12-01
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/683 , B32B43/00 , H01L21/67 , H01L21/673 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.
摘要翻译： 一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动 控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。 接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。 接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。 接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。 接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。
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公开(公告)号：US20150325465A1
公开(公告)日：2015-11-12
申请号：US14698049
申请日：2015-04-28
IPC分类号： H01L21/683 , B32B43/00
CPC分类号： H01L21/67092 , B32B37/02 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2037/268 , B32B2307/202 , B32B2310/0825 , B32B2310/0843 , B32B2311/00 , B32B2313/00 , B32B2457/14 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1111 , Y10T156/1158 , Y10T156/1189 , Y10T156/1917
摘要： A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.
摘要翻译： 一种支撑构件分离方法，用于分离通过粘合剂层层叠基板和支撑板而形成的层压体，并且其中在基板侧的表面的周边部分的至少一部分上设置有剥离层 面对支撑板或面向基板的支撑板侧表面上的周边部分，该方法包括降低设置在基板的周边部分上的剥离层的至少一部分的粘合力或 支撑并固定在基板和支撑板上的部件，并且在预处理之后，通过向另一部分施加力将基板与基板分离。
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