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    Apparatus and method for aligning and centering wafers
    1.
    发明授权
    Apparatus and method for aligning and centering wafers 有权

    公开(公告)号：US09859141B2

    公开(公告)日：2018-01-02

    申请号：US14330497

    申请日：2014-07-14

    申请人： SUSS MicroTec Lithography, GmbH

    发明人： Hale Johnson ,  Gregory George ,  Michael Brennen

    IPC分类号： H01L21/68 ,  H01L21/67

    CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26

    摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

    APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS
    4.
    发明申请
    APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS 有权
    用于对准和中心波形的装置和方法

    公开(公告)号：US20140319786A1

    公开(公告)日：2014-10-30

    申请号：US14330497

    申请日：2014-07-14

    申请人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    发明人： HALE JOHNSON ,  GREGORY GEORGE ,  MICHAEL BRENNEN

    IPC分类号： H01L21/68 ,  H01L21/683

    CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26

    摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

    摘要翻译： 用于定位和接合圆形晶片周界上的凹口的装置包括凹口定位部件和第一板。 凹口定位部件被构造成沿着第一轴线性地移动并且包括沿垂直于第一轴线的第二轴线延伸的前部细长部件，并且具有前表面，与前表面相对的后表面和从该前表面延伸的第一突出部 细长部件的前表面。 第一突起具有补充形成在圆形晶片的周边上的凹口的形状的形状。 当切口定位部件沿着第一轴线朝向圆形晶片的周边被驱动时，测量细长部件的后表面与第一板的前表面之间的距离，并且使用测量的距离的值来确定 第一突起与凹口的接合。

    Method and apparatus for clamping rectangular parallelepipedic work
    6.
    发明授权
    Method and apparatus for clamping rectangular parallelepipedic work 有权
    用于夹紧长方体的方法和装置

    公开(公告)号：US08214985B2

    公开(公告)日：2012-07-10

    申请号：US13204773

    申请日：2011-08-08

    申请人： Akihiro Kitamura

    发明人： Akihiro Kitamura

    IPC分类号： B23P23/00 ,  B23C1/14

    CPC分类号： B23Q3/06 ,  B23Q1/52 ,  B25B5/142 ,  Y10T29/5109 ,  Y10T29/5114 ,  Y10T279/18 ,  Y10T279/29 ,  Y10T409/303752 ,  Y10T409/305656 ,  Y10T409/308792 ,  Y10T409/30896 ,  Y10T409/309016

    摘要： A rectangular parallelepipedic (cuboidal) work is fixed by clamping the opposing two edges between clamp jaws attached to a pair of clamps. With the work fixed, at least one surface of the work is machined. Then, the position of the work is changed by rotating the clamps and the work all together around the rotating axis, and the other surface is machined. The foregoing step is repeated to machine all the six surfaces of the work, during which the work is kept fixed by clamping.

    摘要翻译： 长方体（立方体）工作是通过夹紧连接到一对夹具的夹爪之间的相对的两个边缘来固定的。 工作固定后，工件的至少一个表面被加工。 然后，通过将夹具和工件一起围绕旋转轴线旋转而改变工件的位置，并且另一个表面被加工。 重复上述步骤来加工工件的所有六个表面，在此期间通过夹紧来保持工件的固定。

    METHOD AND APPARATUS FOR CLAMPING RECTANGULAR PARALLELEPIPEDIC WORK
    7.
    发明申请
    METHOD AND APPARATUS FOR CLAMPING RECTANGULAR PARALLELEPIPEDIC WORK 有权
    用于钳位矩形平行放电工作的方法和装置

    公开(公告)号：US20110291340A1

    公开(公告)日：2011-12-01

    申请号：US13204773

    申请日：2011-08-08

    申请人： Akihiro KITAMURA

    发明人： Akihiro KITAMURA

    IPC分类号： B23Q16/02

    CPC分类号： B23Q3/06 ,  B23Q1/52 ,  B25B5/142 ,  Y10T29/5109 ,  Y10T29/5114 ,  Y10T279/18 ,  Y10T279/29 ,  Y10T409/303752 ,  Y10T409/305656 ,  Y10T409/308792 ,  Y10T409/30896 ,  Y10T409/309016

    摘要： A rectangular parallelepipedic (cuboidal) work is fixed by clamping the opposing two edges between clamp jaws attached to a pair of clamps. With the work fixed, at least one surface of the work is machined. Then, the position of the work is changed by rotating the clamps and the work all together around the rotating axis, and the other surface is machined. The foregoing step is repeated to machine all the six surfaces of the work, during which the work is kept fixed by clamping.

    摘要翻译： 长方体（立方体）工作是通过夹紧连接到一对夹具的夹爪之间的相对的两个边缘来固定的。 工作固定后，工件的至少一个表面被加工。 然后，通过将夹具和工件一起围绕旋转轴线旋转而改变工件的位置，并且另一个表面被加工。 重复上述步骤来加工工件的所有六个表面，在此期间通过夹紧来保持工件的固定。

    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS
    8.
    发明申请
    APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR WAFERS 有权
    用于机械结合临时粘结半导体波导的装置

    公开(公告)号：US20100263794A1

    公开(公告)日：2010-10-21

    申请号：US12761014

    申请日：2010-04-15

    申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  JAMES HERMANOWSKI ,  MATTHEW STILES

    IPC分类号： B32B38/10

    CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

    摘要： A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface. In operation, a wafer pair, comprising a carrier wafer stacked upon and being bonded to a device wafer via an adhesive layer and a release layer, is placed upon the chuck so that the ubonded surface of the device wafer is in contact with the chuck top surface. Next, the flex plate swings around the hinge and is placed above the bottom chuck so that its first surface is in contact with the unbonded surface of the carrier wafer. Next, the contact roller is driven upward until it contacts and pushes the second edge of the flex plate up while the carrier wafer is held by the flex plate and the device wafer is held by the chuck via the second and first wafer holders, respectively. The contact roller push flexes the second edge of the flex plate and causes delamination of the wafer pair along the release layer.

    摘要翻译： 用于通过与释放层临时粘合的晶片组合的粘合层分离两个脱粘器装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和构造成保持与卡盘的顶表面接触的晶片的第一晶片保持器。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括连接到铰链的第一边缘和与第一边缘径向相对的第二边缘，并且柔性板的第一边缘邻近卡盘的第一边缘布置，并且柔性板构造成围绕铰链摆动，并且 被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电动机构造成使接触辊垂直于卡盘顶表面的平面移动。 在操作中，包括经由粘合剂层和释放层堆叠在器件晶片上并且通过粘合剂层和释放层结合到器件晶片上的载体晶片的晶片对放置在卡盘上，使得器件晶片的ubonded表面与卡盘顶部接触 表面。 接下来，柔性板围绕铰链摆动并且被放置在底部卡盘的上方，使得其第一表面与载体晶片的未结合的表面接触。 接下来，接触辊被向上驱动，直到其接触并将柔性板的第二边缘向上推动，同时载体晶片被柔性板保持，并且装置晶片分别通过第二和第一晶片保持器由卡盘保持。 接触辊推动弯曲柔性板的第二边缘并导致晶片对沿着释放层的分层。

    Holding device for disk-shaped objects
    9.
    发明授权
    Holding device for disk-shaped objects 有权
    用于盘形物体的保持装置

    公开(公告)号：US07284760B2

    公开(公告)日：2007-10-23

    申请号：US10913891

    申请日：2004-08-06

    申请人： Sönke Siebert ,  Michael Schweiger ,  Andreas Lang

    发明人： Sönke Siebert ,  Michael Schweiger ,  Andreas Lang

    IPC分类号： B23B31/30

    CPC分类号： H01L21/68707 ,  Y10T279/1291 ,  Y10T279/18 ,  Y10T279/1961 ,  Y10T279/1966 ,  Y10T279/33

    摘要： Semiconductor technology requires the use of object holders, which are capable of holding wafers securely, also during rotation. In order to save time and expense, such holders should be suitable for integration directly into a processing facility, wherever possible. According to the invention it is proposed to provide centrally mounted holders which comprise support surfaces for the wafer and pivotable gripper fingers, in which the gripper fingers are pretensioned by means of at least one pretension element in the holding position and are actuated through one opening mechanism, in which at least one opening mechanism and at least one pretension element are integrated in the central clamping arm fixture and/or in the clamping arms.

    摘要翻译： 半导体技术需要使用能够在旋转期间牢固地保持晶片的物体保持器。 为了节省时间和费用，这些持有人应尽可能直接融入加工设施。 根据本发明，提出了提供中心安装的保持器，其包括用于晶片和可枢转的夹持器指状物的支撑表面，其中夹持器指状物通过至少一个预紧元件在保持位置被预张紧并且通过一个开启机构 ，其中至少一个打开机构和至少一个预紧元件集成在中心夹紧臂固定装置和/或夹紧臂中。

    Tool holding fixture and insert tool
    10.
    发明授权
    Tool holding fixture and insert tool 失效
    工具夹具和插入工具

    公开(公告)号：US07258515B2

    公开(公告)日：2007-08-21

    申请号：US10496145

    申请日：2003-04-11

    申请人： Harald Krondorfer

    发明人： Harald Krondorfer

    IPC分类号： B24B45/00

    CPC分类号： B24D7/16 ,  B24B23/028 ,  B24B45/006 ,  Y10T83/9379 ,  Y10T279/18 ,  Y10T279/33 ,  Y10T403/7005 ,  Y10T409/309352 ,  Y10T409/309408

    摘要： The invention is based on a tool holder for a power tool (i0), in particular for a hand-guided power angle grinder, having a slaving device (12) by way of which an inserted tool (14), which has a disklike hub (64), can be operatively connected to a drive shaft (16), and having a fastening device (18) which has a holding position and a release position. It is proposed that with the fastening device (18), the inserted tool (14) can be connected by positive engagement to the slaving device (12) in the circumferential direction (20, 22) in the release position and additionally in the axial direction (24, 26) in the holding position.

    摘要翻译： 本发明基于用于电动工具（i 0）的工具架，特别是用于手动导向功率角磨机，具有从动装置（12），借助于该装置，插入的工具（14）具有盘状 轮毂（64）可以可操作地连接到驱动轴（16），并且具有具有保持位置和释放位置的紧固装置（18）。 提出通过紧固装置（18），插入的工具（14）可以在释放位置中沿着圆周方向（20,22）通过正向接合而与从动装置（12）连接，另外在轴向方向 （24,26）处于保持位置。