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公开(公告)号：US09159595B2
公开(公告)日：2015-10-13
申请号：US13022215
申请日：2011-02-07
申请人： Daniel T. Hurley , Gregory George
发明人： Daniel T. Hurley , Gregory George
IPC分类号： H01L21/683 , B23B31/30 , H01L21/67 , B23Q3/08
CPC分类号： H01L21/67092 , B23B31/307 , B23Q3/088 , H01L21/67144 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L2221/6834 , H01L2221/68381 , Y10T279/11
摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.
摘要翻译： 用于承载和保持具有低于100微米厚度的半导体晶片的改进的晶片载体装置包括可移动的晶片卡盘，其具有封闭的真空容器和被配置为支撑晶片的顶表面。 顶表面具有从顶表面延伸到真空储存器的一个或多个通孔，并且晶片通过真空从穿过通孔的真空容器被保持在顶表面上。
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公开(公告)号：US20150251396A1
公开(公告)日：2015-09-10
申请号：US14714587
申请日：2015-05-18
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： B32B37/00 , B32B37/18 , H01L21/683 , B32B37/12
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： An apparatus for temporary bonding first and second wafers includes, a first coating chamber configured to apply a first adhesive layer upon a first surface of a first wafer; a second coating chamber configured to apply a second adhesive layer upon a first surface of a second wafer; a curing chamber configured to cure the first adhesive layer of the first wafer; a bonder module comprising an upper chuck assembly and a lower chuck assembly arranged below and opposite the upper chuck assembly. The upper chuck assembly is configured to hold the first wafer so that its first surface with the cured first adhesive layer faces down. The lower chuck assembly is configured to hold the second wafer so that the second adhesive layer faces up and is opposite to the cured first adhesive layer. The lower chuck assembly is configured to move upwards and thereby to bring the second adhesive layer in contact with the cured first adhesive layer. The curing chamber is further configured to cure the second adhesive layer after it is brought in contact with the cured first adhesive layer, thereby forming a temporary bond between the first and second wafers.
摘要翻译： 一种用于临时粘合第一和第二晶片的装置包括：第一涂层室，被配置为将第一粘合剂层施加到第一晶片的第一表面上; 第二涂覆室，被配置为将第二粘合剂层施加到第二晶片的第一表面上; 固化室，其构造成固化所述第一晶片的所述第一粘合剂层; 粘合剂模块包括布置在上卡盘组件下方和相对的上卡盘组件和下卡盘组件。 上卡盘组件构造成保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 下卡盘组件构造成保持第二晶片，使得第二粘合剂层面向上并且与固化的第一粘合剂层相对。 下卡盘组件构造成向上移动，从而使第二粘合剂层与固化的第一粘合剂层接触。 固化室进一步构造成在与固化的第一粘合剂层接触之后固化第二粘合剂层，从而在第一和第二晶片之间形成临时粘合。
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公开(公告)号：US20130244400A1
公开(公告)日：2013-09-19
申请号：US13790684
申请日：2013-03-08
申请人： GREGORY GEORGE , Stefan Lutter
发明人： GREGORY GEORGE , Stefan Lutter
IPC分类号： H01L21/02
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
摘要翻译： 临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。 接下来，将第二粘合剂层施加到第二晶片的第一表面上。 接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。 接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。
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公开(公告)号：US08485336B2
公开(公告)日：2013-07-16
申请号：US12789272
申请日：2010-05-27
申请人： Tyrus Neil Tenold , Gregory George Tenold , Robert Gordon Tenold , Michael Joseph Gilman , Rod Alan Grozdanich
发明人： Tyrus Neil Tenold , Gregory George Tenold , Robert Gordon Tenold , Michael Joseph Gilman , Rod Alan Grozdanich
CPC分类号： B65G11/166
摘要： Chutes and other components may include composite liners to improve performance. Composite liners generally comprise a base metal having a ceramic material embedded therein. The composite liners exhibit improved resistance to wear and, therefore, have a longer usable life than liners formed of the base metal alone.
摘要翻译： 滑槽和其他部件可以包括复合衬套以提高性能。 复合衬里通常包括其中嵌有陶瓷材料的母材。 复合衬里表现出改善的耐磨性，因此具有比仅由贱金属形成的衬垫更长的使用寿命。
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公开(公告)号：US08425715B2
公开(公告)日：2013-04-23
申请号：US13079446
申请日：2011-04-04
申请人： Gregory George
发明人： Gregory George
IPC分类号： B29C65/00 , B29C65/08 , B29C45/00 , B29C47/00 , B29C43/02 , B29C49/00 , B29C51/00 , B29C43/10 , B32B37/00 , B30B5/02 , B30B5/04 , B30B15/34 , H01L21/30 , H01L21/46 , H01L21/76 , B29D24/00 , B29D29/00 , B28B21/36 , A01J21/00 , A01J25/12 , A21C3/00 , A21C11/00 , A23G1/20 , A23G3/02 , A23P1/00 , B28B11/08 , B29C55/28
CPC分类号： H01L21/6719 , H01L21/67092
摘要： An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.
摘要翻译： 一种工业规模的高通量晶片接合装置，包括沿着主轴延伸的晶片接合室，包括多个室区，多个加热器/隔离板，沿主轴延伸的导杆系统，一对平行轨道 杆沿着主轴线延伸，以及第一压力装置。 室区彼此分离并通过加热器/隔离板彼此热隔离。 加热器/隔离板垂直于主轴定向，由导杆系统可移动地支撑和引导，并被构造成沿着主轴线的方向移动。 每个室区的尺寸被设计成适应对准的晶片对，并且晶片对构造成由平行轨道杆支撑。 第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。 所施加的第一力使得加热器/隔离板沿着主轴线彼此移动，从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。
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公开(公告)号：US08366873B2
公开(公告)日：2013-02-05
申请号：US13085159
申请日：2011-04-12
申请人： Gregory George
发明人： Gregory George
IPC分类号： B32B38/10
CPC分类号： B32B43/006 , B32B38/1858 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1174 , Y10T156/1944 , Y10T156/1956 , Y10T156/1978
摘要： A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.
摘要翻译： 脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。 卡盘组件包括卡盘和保持与卡盘接触的接合晶片对的第一晶片的第一晶片保持架。 柔性板组件包括柔性板和保持接合晶片对的第二晶片与柔性板接触的第二晶片保持架。 柔性板放置在卡盘的上方。 接触辊被布置成与卡盘的第一边缘相邻并且将柔性板的第一边缘推起并提升，同时阻力辊横向于柔性板上的水平方向并且向上施加向下的力到柔性板上，从而将接合的晶片 沿分离层分层，并且第一和第二晶片彼此分离。
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公开(公告)号：US20120224289A1
公开(公告)日：2012-09-06
申请号：US13396068
申请日：2012-02-14
IPC分类号： H02H3/06
CPC分类号： H02H7/00 , H02J7/0031
摘要： A voltage activated 2nd level safety circuit for permanent isolation having a current activated fuse useful for class III medical devices, military applications, and any other passive loads. The battery system has a fuse current limiter and the current activated fuse maintain the fuse closed when a power cell, having a current sufficient to blow the fuse expeditiously, directs its current to the load. The power cell continues to direct its current to the load until the system detects an unacceptable battery or circuit condition. Once that unacceptable condition exists and is detected, a fuse blowing circuitry allows the power cell's current to expeditiously blow the current activated fuse. In response to the blown current activated fuse, the system's isolation switch(es) open as well to establish a permanent isolated battery.
摘要翻译： 用于永久隔离的电压激活的第二级安全电路，具有用于III类医疗设备，军事应用和任何其它被动负载的电流激活保险丝。 电池系统具有保险丝限流器，并且当具有足以快速熔断保险丝的电流的功率单元将其电流引导到负载时，电流激活的保险丝保持保险丝闭合。 电池继续将其电流引导到负载，直到系统检测到不可接受的电池或电路状况。 一旦存在不可接受的状况并且被检测到，保险丝熔断电路允许电池的电流迅速地吹动电流激活的保险丝。 为了响应熔断的电流激活的保险丝，系统的隔离开关也打开以建立永久隔离的电池。
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公开(公告)号：US20120190612A1
公开(公告)日：2012-07-26
申请号：US13376939
申请日：2010-06-09
IPC分类号： A61K38/17 , A61K38/02 , A61K38/10 , A61P37/06 , A61K31/7088 , A61P35/04 , A61P19/02 , A61P11/06 , C12N5/071 , A61P9/00
摘要： The present invention relates to methods for inhibiting proliferation and/or migration of lymphatic endothelial cells and for inhibiting lymphangiogenesis, comprising administering to a subject, or to lymphatic endothelial cells derived therefrom, an effective amount of a collagen type IV-derived NC1 domain polypeptide or a fragment, derivative or variant thereof, a polynucleotide encoding the same, or an agent capable of increasing the expression or production of the NC1 domain polypeptide. Aso provided are methods for the treatment or prevention of diseases and conditions associated with aberrant lymphatic endothelial cell activity.
摘要翻译： 本发明涉及抑制淋巴管内皮细胞增殖和/或迁移并抑制淋巴管生成的方法，其包括向受试者或由其衍生的淋巴内皮细胞施用有效量的IV型胶原衍生的NC1结构域多肽或 其片段，衍生物或变体，编码其的多核苷酸或能够增加NC1结构域多肽的表达或产生的试剂。 Aso提供了用于治疗或预防与异常淋巴内皮细胞活性相关的疾病和病症的方法。
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公开(公告)号：US08227419B2
公开(公告)日：2012-07-24
申请号：US12278266
申请日：2007-02-02
CPC分类号： A61K38/39
摘要： The invention provides a method for improving airway conductance in a subject in need thereof, the method comprising administering to the subject an effective amount of one or more of tumstatin; a derivative, variant or homologue thereof, a polynucleotide encoding tumstatin or a derivative, variant or homologue thereof; or an agent capable of increasing the expression or production of tumstatin.
摘要翻译： 本发明提供了一种在有需要的受试者中改善气道导电的方法，所述方法包括向受试者施用有效量的一种或多种肿瘤抑素; 其衍生物，变体或同源物，编码肿瘤抑素或其衍生物，变体或同源物的多核苷酸; 或能够增加肿瘤抑素的表达或产生的药剂。
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公开(公告)号：US20120168308A1
公开(公告)日：2012-07-05
申请号：US13183632
申请日：2011-07-15
CPC分类号： C01B31/02 , B82Y15/00 , B82Y30/00 , B82Y40/00 , C01B32/05 , C01B32/174 , C01B32/20 , G01N27/308
摘要： An electrode for use in a electrochemical sensor comprises carbon modified with a chemically sensitive redox-active compound, excluding an electrode based on carbon having derivatised thereron two redox-active species wherein at least one of said species is selected from anthraquinone, phenanthrenequinone and N,N′-diphenyl-p-phenylenediamine (DPPD). The invention further provides a pH sensor comprising: a working electrode comprising carbon modified with a chemically sensitive redox active material; and a counter electrode, wherein the ratio of the surface area of the working electrode to the surface area of the counter electrode is from 1:10 to 10:1. Also provided is a pH sensor comprising: a working electrode comprising carbon modified with a chemically sensitive redox active material, and a counter electrode, wherein the area of the working electrode is from 500 μm2 to 0.1 m2. The uses of these electrodes and sensors are also described.
摘要翻译： 用于电化学传感器的电极包括用化学敏感的氧化还原活性化合物改性的碳，不包括基于其衍生的两种氧化还原活性物质的碳的电极，其中至少一种所述物质选自蒽醌，菲醌和N， N'-二苯基对苯二胺（DPPD）。 本发明还提供一种pH传感器，其包括：工作电极，其包含用化学敏感的氧化还原活性材料改性的碳; 和相对电极，其中工作电极的表面积与对电极的表面积之比为1:10至10:1。 还提供了一种pH传感器，其包括：包含用化学敏感性氧化还原活性材料改性的碳的工作电极和对电极，其中所述工作电极的面积为500μm2至0.1m 2。 还描述了这些电极和传感器的用途。
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