公开(公告)号：US20140040038A1

公开(公告)日：2014-02-06

申请号：US13566340

申请日：2012-08-03

申请人： James Hermanowski ,  Sherri Hermanowski ,  Ashley Hermanowski ,  James Hermanowski ,  Henre Hermanowski

发明人： James Hermanowski ,  Sherri Hermanowski ,  Ashley Hermanowski ,  James Hermanowski ,  Henre Hermanowski

IPC分类号： G06Q30/02

CPC分类号： G06Q30/02

摘要： A consumer oriented method and system for product preference management is disclosed where the consumer explicitly communicates product preferences and reasoning for such preferences allowing marketers, advertisers, distributors and manufacturers to directly understand said consumer desires. The data provided by such system being invaluable to marketers, advertisers, distributors and manufacturers allows them to modify their products to make them more attractive to the specific tastes of the consumer and to build consumer loyalty. The preference management system allows, if a consumer desires, to filter undesired advertising communication from the other parties.

摘要翻译： 披露了一种以消费者为导向的产品偏好管理方法和系统，其中消费者明确地传达产品偏好和推理这样的偏好，从而允许营销人员，广告商，经销商和制造商直接理解所述消费者的愿望。 这种系统提供的数据对营销人员，广告商，分销商和制造商来说是非常有价值的，因此他们可以修改其产品，使其更具吸引消费者的特定品味并建立消费者忠诚度。 偏好管理系统允许消费者期望从其他方过滤不期望的广告通信。

公开(公告)号：US20150083342A1

公开(公告)日：2015-03-26

申请号：US14556298

申请日：2014-12-01

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/673

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.

摘要翻译： 一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动 控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。 接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。 接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。 接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。 接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。

公开(公告)号：US20110010908A1

公开(公告)日：2011-01-20

申请号：US12760973

申请日：2010-04-15

申请人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

发明人： GREGORY GEORGE ,  HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES

IPC分类号： B23P19/00

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.

摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。

公开(公告)号：US20180115338A1

公开(公告)日：2018-04-26

申请号：US15333392

申请日：2016-10-25

申请人： James Hermanowski ,  Sherri Hermanowski ,  Yvette Randolph

发明人： James Hermanowski ,  Sherri Hermanowski ,  Yvette Randolph

IPC分类号： H04B1/3888 ,  H05K7/20

CPC分类号： H04B1/3888

摘要： For use with portable electronic devices, a protective system consisting of a multi-functional outer shell having various types of thermal and mechanical properties with inner pockets for holding additional thermally protective elements which are combined in a single unit and useful in providing thermal protection to portable electronic devices which are positioned within the outer shell.

公开(公告)号：US20120307512A1

公开(公告)日：2012-12-06

申请号：US13486082

申请日：2012-06-01

申请人： Jeffrey Cogger ,  James Hermanowski ,  Joel Melnick

发明人： Jeffrey Cogger ,  James Hermanowski ,  Joel Melnick

IPC分类号： F21V13/04 ,  F21V7/00 ,  F21V5/02 ,  F21V9/00 ,  F21V8/00

CPC分类号： G02B27/149 ,  A61B1/043 ,  A61B1/063 ,  A61B1/0638 ,  A61B1/0669 ,  G02B21/06 ,  G02B23/2461 ,  G02B27/10 ,  G02B27/1006 ,  G02B27/126 ,  G02B27/145

摘要： Systems for providing high-intensity and high-quality illumination and other electromagnetic radiation (EMR) to target regions. The systems each include multiple EMR sources and a radiation combiner for combining the output radiation of the multiple sources. In some examples, the EMR sources are visible light sources, such as light-emitting diodes and laser diodes. In some of those examples, the light sources are of differing colors that are combined to form output illumination having user-selected qualities, such as color and intensity. The output of the radiation combiner can be directed into an optical fiber or bundle of optical fibers for remote delivery of the output to a target, such as in endoscopy and remote-illumination microscopy. Systems disclosed can also include additional EMR beams, such as visible light beams used for pointing/targeting and non-visible beams used, for example, for heating and fluoroscopic excitation of dyes/stains, among other things.

摘要翻译： 向目标地区提供高强度和高质量照明等电磁辐射（EMR）系统。 这些系统各自包括多个EMR源和用于组合多个源的输出辐射的辐射组合器。 在一些示例中，EMR源是可见光源，例如发光二极管和激光二极管。 在这些示例中的一些示例中，光源具有不同的颜色，其被组合以形成具有用户选择的质量（例如颜色和强度）的输出照明。 辐射组合器的输出可以被引导到光纤或光纤束中，用于将输出远程传送到目标，例如在内窥镜和远程照明显微镜中。 所公开的系统还可以包括附加的EMR光束，例如用于指向/瞄准的可见光束和所使用的不可见光束，例如用于染料/污渍的加热和透视激发等。

公开(公告)号：US08919412B2

公开(公告)日：2014-12-30

申请号：US12760973

申请日：2010-04-15

申请人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10 ,  H01L21/67 ,  B32B43/00 ,  H01L21/683 ,  B32B38/18

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.

摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。

公开(公告)号：US08181688B2

公开(公告)日：2012-05-22

申请号：US12760640

申请日：2010-04-15

申请人： Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles ,  Michael Kuhnle

发明人： Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles ,  Michael Kuhnle

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

摘要翻译： 用于临时晶片键合的改进的装置包括临时键合器簇和解粘束簇。 临时粘合剂簇包括执行电子晶片接合工艺的临时粘合剂模块，包括粘合剂层粘合，粘合剂层与剥离层粘合的组合以及UV光可固化粘合剂层与激光吸收剥离层粘合的组合。 脱粘聚集体包括热敏剥离器，机械剥离器和辐射剥离器。

公开(公告)号：US20110014774A1

公开(公告)日：2011-01-20

申请号：US12760640

申请日：2010-04-15

申请人： HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES ,  MICHAEL KUHNLE

发明人： HALE JOHNSON ,  PATRICK GORUN ,  EMMETT HUGHLETT ,  JAMES HERMANOWSKI ,  MATTHEW STILES ,  MICHAEL KUHNLE

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

摘要翻译： 用于临时晶片键合的改进的装置包括临时键合器簇和解粘束簇。 临时粘合剂簇包括执行电子晶片接合工艺的临时粘合剂模块，包括粘合剂层粘合，粘合剂层与剥离层粘合的组合以及UV光可固化粘合剂层与激光吸收剥离层粘合的组合。 脱粘聚集体包括热敏剥离器，机械剥离器和辐射剥离器。

公开(公告)号：US08699138B2

公开(公告)日：2014-04-15

申请号：US13486082

申请日：2012-06-01

申请人： Jeffrey Cogger ,  James Hermanowski ,  Joel Melnick

发明人： Jeffrey Cogger ,  James Hermanowski ,  Joel Melnick

IPC分类号： G02B27/10 ,  G02B26/08 ,  G02B26/00

CPC分类号： G02B27/149 ,  A61B1/043 ,  A61B1/063 ,  A61B1/0638 ,  A61B1/0669 ,  G02B21/06 ,  G02B23/2461 ,  G02B27/10 ,  G02B27/1006 ,  G02B27/126 ,  G02B27/145

摘要： Systems for providing high-intensity and high-quality illumination and other electromagnetic radiation (EMR) to target regions. The systems each include multiple EMR sources and a radiation combiner for combining the output radiation of the multiple sources. In some examples, the EMR sources are visible light sources, such as light-emitting diodes and laser diodes. In some of those examples, the light sources are of differing colors that are combined to form output illumination having user-selected qualities, such as color and intensity. The output of the radiation combiner can be directed into an optical fiber or bundle of optical fibers for remote delivery of the output to a target, such as in endoscopy and remote-illumination microscopy. Systems disclosed can also include additional EMR beams, such as visible light beams used for pointing/targeting and non-visible beams used, for example, for heating and fluoroscopic excitation of dyes/stains, among other things.

摘要翻译： 向目标地区提供高强度和高质量照明等电磁辐射（EMR）系统。 这些系统各自包括多个EMR源和用于组合多个源的输出辐射的辐射组合器。 在一些示例中，EMR源是可见光源，例如发光二极管和激光二极管。 在这些示例中的一些示例中，光源具有不同的颜色，其被组合以形成具有用户选择的质量（例如颜色和强度）的输出照明。 辐射组合器的输出可以被引导到光纤或光纤束中，用于将输出远程传送到目标，例如在内窥镜和远程照明显微镜中。 所公开的系统还可以包括附加的EMR光束，例如用于指向/瞄准的可见光束和所使用的不可见光束，例如用于染料/污渍的加热和透视激发等。

公开(公告)号：US08343300B2

公开(公告)日：2013-01-01

申请号：US12975521

申请日：2010-12-22

申请人： James Hermanowski

发明人： James Hermanowski

IPC分类号： B29C65/00 ,  B29C63/00 ,  B32B37/00 ,  B32B38/00 ,  B65H1/00 ,  B65G25/00 ,  B66C17/08 ,  H01L21/677 ,  B24B49/00 ,  B24B51/00 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30 ,  B24B3/00 ,  B24B5/18 ,  B24B5/00 ,  B24B29/00

CPC分类号： H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

摘要： An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

摘要翻译： 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。