-
公开(公告)号：US20250065466A1
公开(公告)日：2025-02-27
申请号：US18568522
申请日：2022-06-10
Applicant: Zeeko Innovations Limited
Inventor： Anthony Beaucamp , Richard Freeman , Christopher William King , Samyak Jain , Oliver Pakenham-Walsh , Harry John Knighton , Filip Antoni Jaskot
Abstract: The invention relates to a sub-aperture polishing tool, comprising a support member including an attachment feature for attachment to a sub-aperture polishing machine. At an end of the support member is a polishing head comprising: a base structure attached to or integral with the support member, the base structure being arranged to provide a non-flat surface. The polishing head also comprises an outer shell, at least part of the outer surface of which defines the working surface of the polishing tool, the outer shell being affixed to the base structure so as to enclose a cavity between the outer shell and the non-flat surface. A viscoelastic material filling the cavity, located between the outer shell and the base structure.
-
公开(公告)号：US12202094B2
公开(公告)日：2025-01-21
申请号：US17579775
申请日：2022-01-20
Applicant: Taiwan Semiconductor Manufacturing Company
Inventor： Shih-Chung Chen , Wei-Kang Tu , Ching-Wen Cheng , Chun Yan Chen
Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.
-
公开(公告)号：US12145237B2
公开(公告)日：2024-11-19
申请号：US16719641
申请日：2019-12-18
Applicant: Seoul Laser Dieboard System Co., Ltd.
Inventor： Kyong Chan Lim
IPC: B24B7/12 , B24B27/033 , B24B29/00 , B24B29/06 , B24B49/00
Abstract: Method and system, including: a strip of metallic material used by a bender to produce the 3-D signage; a sanding unit coupled to the bender and configured to sand away any dirt, oil, or other undesirable material attaching to the strip of metallic material; and a controller configured to make a measurement of how fast the strip of metallic material is feeding into the bender, and to control an operating speed of the sanding unit based on the measurement.
-
公开(公告)号：US12115620B2
公开(公告)日：2024-10-15
申请号：US17273531
申请日：2019-08-30
Applicant: RUD. STARCKE GMBH & CO. KG
Inventor： Werner Unnerstall , Christian Wall , Christian Burstein , Stephan Kampmeyer , Diethard Sinram , Peter Alfer
Abstract: A polishing device is held on a robot arm and has a support plate, a polishing disc held on the support plate, a drive moving the support plate in a plane, and a metering device for feeding a polishing agent to the working side of the polishing disc. An application nozzle of the metering device is guided through an open central axis of the support plate, the polishing disc having a central opening for allowing the passage of the polishing agent metered in computer-controlled manner.
-
公开(公告)号：US11865670B2
公开(公告)日：2024-01-09
申请号：US16738110
申请日：2020-01-09
Applicant: ALEX GLOBAL TECHNOLOGY, INC.
Inventor： Wei-Chin Chen
IPC: B24B5/06 , B24B9/04 , B24B19/18 , B24B29/04 , B24B5/44 , B24B5/18 , B24B41/06 , B24B27/00 , B24B29/00
CPC classification number: B24B5/44 , B24B5/06 , B24B5/185 , B24B9/04 , B24B19/18 , B24B27/0076 , B24B29/005 , B24B29/04 , B24B41/06 , B60B2310/234 , B60B2900/113
Abstract: The present invention discloses a device for removal of wheel rim burr which comprises a main body, plural positioning wheels, an eccentric wheel disposed on the main body, and at least two brush wheels disposed between two corresponding positioning wheels.
-
公开(公告)号：US20230167755A1
公开(公告)日：2023-06-01
申请号：US17922493
申请日：2020-07-29
Applicant: FUJI OOZX Inc.
Inventor： Takahiro TSUCHIYA , Takaaki KUMAGAI , Keigo NAKAJIMA , Koji KUSHIMA , Shingo AGATA
CPC classification number: F01L3/04 , B21K1/22 , B24B29/005 , F01L2301/00 , F01L2303/00
Abstract: An engine valve having a shaft portion and a head portion expanding in diameter like a head at an edge of the shaft portion, and being to open and close a port provided in a cylinder head, wherein the head portion has a head front surface on a bottom side facing a combustion chamber side, a head rear surface on a top side facing the port side, and an outer peripheral surface of the head portion formed between the head front surface and the head rear surface, and the head portion is provided a mirror-finished mirror portion, and the head portion is provided a mirror-finished mirror portion on the entire area of the head front surface exposed to the combustion chamber and the entire area of the outer peripheral surface exposed to the combustion chamber.
-
公开(公告)号：US11559824B2
公开(公告)日：2023-01-24
申请号：US16865355
申请日：2020-05-03
Applicant: Hymmen GmbH Maschinen- und Anlagenbau
Inventor： René Pankoke
IPC: B05D1/02 , B05B1/02 , B05D3/00 , B24B7/19 , B24B21/04 , B24B53/00 , B41M5/00 , B44C3/00 , B29C59/02 , B29C59/16 , B24B29/00
Abstract: A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.
-
公开(公告)号：US11213926B2
公开(公告)日：2022-01-04
申请号：US16997274
申请日：2020-08-19
Applicant: Carl Zeiss SMT GmbH
Inventor： Andreas Wolpert , Franz-Josef Stickel
Abstract: A method for polishing a workpiece in the production of an optical element, in particular for microlithography, wherein a relative movement takes place between a polishing tool (300) and a workpiece surface (110, 120, 210) being machined. A polishing tool surface (215, 315) of the polishing tool (300) is formed by a viscoelastic polishing medium (303), wherein the polishing tool surface has an average diameter which is less than 50% of the average diameter of the workpiece surface being machined. The polishing tool surface during polishing is guided by an overrun distance beyond at least one edge (110a, 110b, 120a, 120b, 210a, 210b) delimiting the workpiece surface being machined, wherein the average diameter of the polishing tool surface is at least twice the overrun distance.
-
公开(公告)号：US20210402546A1
公开(公告)日：2021-12-30
申请号：US17355024
申请日：2021-06-22
Applicant: Applied Materials, Inc.
Inventor： Brian J. Brown , Andrew J. Nagengast , Justin Ho Kuen Wong
IPC: B24B37/005 , B24B37/10 , B24B49/10 , B24B29/00
Abstract: A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.
-
公开(公告)号：US11205582B2
公开(公告)日：2021-12-21
申请号：US16564175
申请日：2019-09-09
Applicant: Illinois Tool Works Inc.
Inventor： Bradley Scott Withers , Corey Alan Hughes , Erik Scott Nelson , Steven Kenneth Christie , Brent Allan Best
Abstract: A system for monitoring contamination level of effluent of an offline brush conditioning system includes a first set of reservoirs configured to collect first effluents from corresponding portions of a first brush and a second set of reservoirs configured to collect second effluents from corresponding portions of a second brush, and the first and second effluents are from a fluid used to condition the first and second brushes that are configured to clean a surface of a semiconductor wafer. An effluent contamination monitor is configured to monitor contamination levels of the first and second effluents, wherein the monitored contamination levels may provide feedback for use in the brush conditioning.
