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    Method for detaching a semiconductor chip from a foil
    4.
    发明授权
    Method for detaching a semiconductor chip from a foil 有权
    从箔上分离半导体芯片的方法

    公开(公告)号：US09039867B2

    公开(公告)日：2015-05-26

    申请号：US13839586

    申请日：2013-03-15

    申请人： Besi Switzerland AG

    发明人： Ernst Barmettler ,  Fabian Hurschler ,  Brian Pulis

    IPC分类号： B32B38/10 ,  H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  H01L21/00

    CPC分类号： H01L21/67005 ,  H01L21/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/67132 ,  H01L21/67739 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1983

    摘要： A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3

    摘要翻译： 用于从箔片上分离半导体芯片的方法使用包括具有直的支撑边缘和L形支撑边缘的板的模具顶出器包括：将板件提升到盖板表面上方的高度H1; 降低具有L形支撑边缘的第一对板; 可选地，降低具有L形支撑边缘的第二对板; 提升尚未降低到H2> H1高度的板材; 至少有一个或几个板材不被降低，板材的交错降低尚未降低; 可选地，将尚未降低的板降低到高度H3

    Method For Detaching A Semiconductor Chip From A Foil
    5.
    发明申请
    Method For Detaching A Semiconductor Chip From A Foil 有权
    从铝箔上分离半导体芯片的方法

    公开(公告)号：US20140196853A1

    公开(公告)日：2014-07-17

    申请号：US14085693

    申请日：2013-11-20

    申请人： Besi Switzerland AG

    发明人： Ernst Barmettler ,  Irving Rodriguez

    IPC分类号： H01L21/67 ,  H01L21/683

    CPC分类号： H01L21/67011 ,  B32B43/006 ,  H01L21/67132 ,  H01L21/67288 ,  H01L21/6836 ,  H01L24/75 ,  H01L2221/68381 ,  H01L2224/756 ,  H01L2224/75753 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1105 ,  Y10T156/1179 ,  Y10T156/1983

    摘要： The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.

    摘要翻译： 本发明涉及从箔片上分离半导体芯片的方法的印前阶段。 根据第一方面，本发明涉及确定时间段，每个时间段定义了预打步骤的持续时间。 在设置阶段，对每个预打印步骤执行以下步骤：启动方法步骤; 重复两个步骤记录半导体芯片的图像并将时间段分配到从涂覆步骤开始以来已经过去的图像，并且检查图像中半导体芯片的外围区域是否比预定的 亮度值 直到检查导致半导体芯片的周边区域不比预定亮度值更暗的结果。 根据第二方面，实时监测半导体芯片与箔的分离。

    Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method
    7.
    发明授权
    Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method 有权
    芯片拾取装置，芯片拾取方法，芯片释放装置和芯片释放方法

    公开(公告)号：US08192578B2

    公开(公告)日：2012-06-05

    申请号：US12089865

    申请日：2006-10-13

    申请人： Hiroshi Haji ,  Mitsuru Ozono ,  Teruaki Kasai ,  Kazuhiro Noda

    发明人： Hiroshi Haji ,  Mitsuru Ozono ,  Teruaki Kasai ,  Kazuhiro Noda

    IPC分类号： B32B38/10

    CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10S156/932 ,  Y10S156/943 ,  Y10S438/976 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1195 ,  Y10T156/1944 ,  Y10T156/1983 ,  Y10T156/1994

    摘要： In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

    摘要翻译： 在拾取装置中，附着在片材上的芯片由拾取喷嘴吸引并保持，然后由喷嘴拾起，将通过形成球形的诸如橡胶的柔性弹性材料构成的片状上推构件安装在 工具上表面的基台支撑表面，则片材上推构件的上推表面沿着片材的下表面处于平坦表面状态，并且在拾取喷嘴的向下移动状态下与其邻接 然后在拾取喷嘴与芯片一起向上移动的上移操作中，上推表面向上推动纸张的下表面，同时以向上突出的曲面形状变形。 因此，芯片可以从芯片的外周侧从片材释放。

    DEVICE FOR CENTERING WAFERS
    9.
    发明申请
    DEVICE FOR CENTERING WAFERS 有权
    用于中心波浪的装置

    公开(公告)号：US20100266373A1

    公开(公告)日：2010-10-21

    申请号：US12761044

    申请日：2010-04-15

    申请人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

    发明人： GREGORY GEORGE ,  HALE JOHNSON ,  DENNIS PATRICIO

    IPC分类号： H01L21/68

    CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

    摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.

    摘要翻译： 用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。 左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。 右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。 第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。 中间定心连杆在第一端包括第三对准臂。 第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。 凸轮板包括第一和第二直线凸轮轮廓。 第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。