公开(公告)号：US10403782B2

公开(公告)日：2019-09-03

申请号：US15431782

申请日：2017-02-14

申请人： Manufacturing Integration Technology Ltd

发明人： Kim Mone Kwong ,  Teck Keong Boh ,  Kok Yeow Lim ,  Han Yong Lam

IPC分类号： B23K26/00 ,  B23K26/02 ,  H01L21/00 ,  G02B26/10 ,  H01L31/18 ,  B23K26/08 ,  B23K26/40 ,  H01L31/04 ,  B23K103/00

摘要： A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations.

公开(公告)号：US09929036B2

公开(公告)日：2018-03-27

申请号：US15319259

申请日：2015-05-13

申请人： Manufacturing Integration Technology Ltd

发明人： Kim Mone Kwong ,  Kok Yeow Lim ,  Zhiqiang Mao

IPC分类号： H01L21/683

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68386 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.