公开(公告)号：US09607875B2

公开(公告)日：2017-03-28

申请号：US14691262

申请日：2015-04-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC: C09J125/06 ,  C09J153/00 ,  B32B7/12 ,  B32B38/00 ,  H01L21/683 ,  C09J145/00 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/28 ,  B32B27/30 ,  C09J153/02

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

公开(公告)号：US20150299534A1

公开(公告)日：2015-10-22

申请号：US14691262

申请日：2015-04-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC: C09J153/00 ,  C09J145/00 ,  C09J125/14 ,  B32B38/00 ,  B32B7/06 ,  H01L21/683 ,  B32B43/00 ,  C09J125/06 ,  B32B7/12

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

Abstract translation: 一种用于将基板临时附接到支撑基板的支撑板的粘合剂组合物，并且包括热塑性树脂和脱模剂。

公开(公告)号：US10607876B2

公开(公告)日：2020-03-31

申请号：US14270086

申请日：2014-05-05

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yasushi Fujii ,  Akihiko Nakamura ,  Yasumasa Iwata ,  Shingo Ishida

IPC: H01L21/00 ,  H01L21/683 ,  H01L23/00 ,  H01L21/56

Abstract: A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

公开(公告)号：US20160005635A1

公开(公告)日：2016-01-07

申请号：US14439430

申请日：2014-03-24

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Yoshihiro Inao ,  Shigeru Kato ,  Yasumasa Iwata ,  Yasushi Fujii

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  B24B7/228 ,  B24B9/065 ,  B32B37/10 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: An attachment method including an overlapping step of overlapping a support plate over a substrate under a reduced pressure environment; a temporary fixing step of temporarily fixing the support plate to the substrate; and an attaching step of attaching the support plate to the substrate under a reduced pressure environment. The method further includes, prior to the overlapping step, at least one of a first heating step in which heating is performed under an atmospheric pressure environment and a second heating step in which heating is performed under a reduced pressure environment.

Abstract translation: 一种附着方法，包括在减压环境下将支撑板重叠在基板上的重叠步骤; 将支撑板暂时固定在基板上的暂时固定工序; 以及在减压环境下将支撑板附接到基板的安装步骤。 该方法还包括在重叠步骤之前，在大气压环境下进行加热的第一加热步骤和在减压环境下进行加热的第二加热步骤中的至少一个。

公开(公告)号：US20150325465A1

公开(公告)日：2015-11-12

申请号：US14698049

申请日：2015-04-28

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yasumasa Iwata ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Shinji Takase ,  Takahiro Yoshioka

IPC: H01L21/683 ,  B32B43/00

CPC classification number: H01L21/67092 ,  B32B37/02 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/202 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2313/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1189 ,  Y10T156/1917

Abstract: A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Abstract translation: 一种支撑构件分离方法，用于分离通过粘合剂层层叠基板和支撑板而形成的层压体，并且其中在基板侧的表面的周边部分的至少一部分上设置有剥离层 面对支撑板或面向基板的支撑板侧表面上的周边部分，该方法包括降低设置在基板的周边部分上的剥离层的至少一部分的粘合力或 支撑并固定在基板和支撑板上的部件，并且在预处理之后，通过向另一部分施加力将基板与基板分离。

公开(公告)号：US20150165741A1

公开(公告)日：2015-06-18

申请号：US14566062

申请日：2014-12-10

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hirofumi Imai ,  Atsushi Kubo ,  Takahiro Yoshioka ,  Kimihiro Nakada ,  Shigeru Kato ,  Yasumasa Iwata

IPC: B32B37/10 ,  B32B37/18 ,  B32B37/12

CPC classification number: B32B37/18 ,  B32B37/0015 ,  B32B37/003 ,  B32B37/1018 ,  B32B37/1207 ,  B32B39/00 ,  B32B2037/1215 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68304 ,  H01L2221/68327 ,  Y10T156/10

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Abstract translation: 一种接合方法，其包括将基板和支撑板通过粘合剂层彼此粘合并且使用板构件按压所述键合基板和支撑板的按压步骤; 并且在所述按压工序之后，将所述基板和所述支撑板通过所述粘合层彼此粘合的压力调整步骤，所述压力调节步骤在比进行所述按压工序的环境压力高的压力的环境中进行。

公开(公告)号：US20140332149A1

公开(公告)日：2014-11-13

申请号：US14270086

申请日：2014-05-05

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yasushi Fujii ,  Akihiko Nakamura ,  Yasumasa Iwata ,  Shingo Ishida

IPC: B29C65/72

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A method for processing a mold material which includes a heating step of heating a mold material layer formed of the mold material to discharge gas from the mold material constituting the mold material layer.

Abstract translation: 一种加工模具材料的方法，该方法包括加热由模具材料形成的模具材料层以从构成模具材料层的模具材料排出气体的加热步骤。

公开(公告)号：US09881829B2

公开(公告)日：2018-01-30

申请号：US15425706

申请日：2017-02-06

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC: C09J125/06 ,  B32B7/12 ,  H01L21/683 ,  C09J145/00 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/28 ,  B32B27/30 ,  C09J153/02 ,  B32B38/10 ,  C09J11/08

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

公开(公告)号：US09682541B2

公开(公告)日：2017-06-20

申请号：US14566062

申请日：2014-12-10

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hirofumi Imai ,  Atsushi Kubo ,  Takahiro Yoshioka ,  Kimihiro Nakada ,  Shigeru Kato ,  Yasumasa Iwata

IPC: B32B37/18 ,  B32B37/00 ,  H01L21/67 ,  B32B37/10 ,  H01L21/683 ,  B32B37/12 ,  B32B39/00

CPC classification number: B32B37/18 ,  B32B37/0015 ,  B32B37/003 ,  B32B37/1018 ,  B32B37/1207 ,  B32B39/00 ,  B32B2037/1215 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68304 ,  H01L2221/68327 ,  Y10T156/10

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

公开(公告)号：US09627235B2

公开(公告)日：2017-04-18

申请号：US14698049

申请日：2015-04-28

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yasumasa Iwata ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Shinji Takase ,  Takahiro Yoshioka

IPC: H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B32B37/02 ,  B32B38/10 ,  B32B38/18 ,  B32B37/26

CPC classification number: H01L21/67092 ,  B32B37/02 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/202 ,  B32B2310/0825 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2313/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1189 ,  Y10T156/1917

Abstract: A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.