HOT MELT ADHESIVE COMPOSITION
    5.
    发明公开

    公开(公告)号:US20230279275A1

    公开(公告)日:2023-09-07

    申请号:US18005679

    申请日:2021-07-19

    申请人: BOSTIK SA

    发明人: Genta OKAZAKI Xin YE

    IPC分类号: C09J153/02

    CPC分类号: C09J153/02

    摘要: The present invention relates to a hot melt adhesive composition comprising styrene triblock copolymer components, and related articles comprising at least one interior or exterior surface coated with the hot melt adhesive composition.

    ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE

    公开(公告)号:US20230111471A1

    公开(公告)日:2023-04-13

    申请号:US17914251

    申请日:2021-03-31

    摘要: A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.