- 专利标题: Thermoplastic resin compositions, adhesive coating materials, and laminates using the same
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申请号: US15560615申请日: 2016-02-29
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公开(公告)号: US11987692B2公开(公告)日: 2024-05-21
- 发明人: Ryota Nakanishi , Kosuke Sugiya
- 申请人: RIKEN TECHNOS CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: RIKEN TECHNOS CORPORATION
- 当前专利权人: RIKEN TECHNOS CORPORATION
- 当前专利权人地址: JP Tokyo-To
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP 15061875 2015.03.25 JP 15179009 2015.09.11 JP 15229333 2015.11.25
- 国际申请: PCT/JP2016/055983 2016.02.29
- 国际公布: WO2016/152389A 2016.09.29
- 进入国家日期: 2017-09-22
- 主分类号: B32B27/00
- IPC分类号: B32B27/00 ; B32B15/085 ; B32B27/08 ; C08K5/14 ; C08K5/1539 ; C08L23/08 ; C08L53/02 ; C09J123/08 ; C09J145/00 ; C09J153/02
摘要:
Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).
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