公开(公告)号：US11141748B2

公开(公告)日：2021-10-12

申请号：US16397812

申请日：2019-04-29

Applicant: Foammatick, LLC

Inventor： William Stumphauzer

IPC: C08J9/10 ,  B05B7/16 ,  C09J9/00 ,  C09J201/00 ,  G05D23/19 ,  C09J7/35 ,  C09J11/06 ,  B05B7/00 ,  C08K5/14 ,  C08K5/23 ,  C08K5/28 ,  C08J9/00 ,  C08J9/06 ,  C08K5/098 ,  C08K3/22

Abstract: The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

公开(公告)号：US10414844B2

公开(公告)日：2019-09-17

申请号：US14365451

申请日：2012-12-06

Applicant: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

Inventor： Alessio Marrani ,  Ivan Wlassics ,  Vito Tortelli ,  Ivan Falco

IPC: C08F214/22 ,  C08F214/18 ,  C08K5/28 ,  B05D1/00 ,  C08J3/24

Abstract: The present invention pertains to semi-crystalline fluoropolymer [polymer (F)] comprising: —recurring units derived from vinylidene fluoride (VDF); —from 10% to 50% by moles [with respect to the total moles of recurring units of polymer (F)] of recurring units derived from trifluoroethylene (TrFE); and —from 0.01% to 10% by moles [with respect to the total moles of recurring units of polymer (F)] of recurring units derived from at least one monomer comprising an azide group [monomer (Az)], to a process for its manufacture, to a crosslinkable composition comprising the same, to a process for crosslinking the same and to a method for manufacturing one of electrical and electronic devices using the same.

公开(公告)号：US10301452B2

公开(公告)日：2019-05-28

申请号：US15528966

申请日：2015-11-23

Applicant: BASF SE

Inventor： Chao Wu ,  Fulvio G. Brunetti ,  Stefan Becker ,  Maximilian Hemgesberg

IPC: C08K5/28 ,  C08K5/00 ,  C08K5/23 ,  C08F8/30 ,  C08J3/28 ,  C08L25/06

Abstract: The present invention relates to the use of a mono-azide compound for cross-linking polymer strands, wherein said mono-azide compound has a structure of the formula (I): (I), wherein Q1 and Q2 are each independently from another a halogen and wherein R1, R2 and R3 are each independently from another any not comprising an azido moiety. Further, the present invention relates to a method for cross-linking polymer stands and to a cross-linked polymer composition obtainable from said method and an electronic device comprising such composition.

公开(公告)号：US20180162990A1

公开(公告)日：2018-06-14

申请号：US15580887

申请日：2016-06-22

Applicant: Dow Global Technologies LLC

Inventor： Timothy A. Morley ,  Rainer Koeniger ,  Martin Reimers ,  Peter J. Cate ,  Nebojsa Jelic ,  Zeljko Sikman

IPC: C08G59/50 ,  C08G59/06 ,  C08K5/28 ,  C09B17/04 ,  C09B65/00 ,  C09B67/22 ,  C09B67/44

Abstract: A two-component curable epoxy resin system including a dye solution. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol. The system also includes a hardener mixture containing mainly polyethylene tetraamines. The system includes triethylene diamine in specific amounts as a catalyst. The system has beneficial curing characteristics with desired color that make it useful for producing fiber-reinforced composites in a resin transfer molding process.

公开(公告)号：US07638565B2

公开(公告)日：2009-12-29

申请号：US10578268

申请日：2004-10-22

Applicant: Hatsuhiko Harashina

Inventor： Hatsuhiko Harashina

IPC: C08K5/27 ,  C08K5/31 ,  C08K5/3492 ,  C08K5/3435 ,  C08K5/09 ,  C08K5/092 ,  C08K5/098 ,  C08K5/10 ,  C08K5/20 ,  C08K5/28 ,  C08K5/49

CPC classification number: C08L59/00 ,  C08K5/25

Abstract: A polyacetal resin composition comprises a polyacetal resin and a hetero atom-containing aliphatic carboxylic acid hydrazide. The proportion of the hetero atom-containing aliphatic carboxylic acid hydrazide may be about 0.001 to 20 parts by weight relative to 100 parts by weight of the polyacetal resin. The polyacetal resin composition may further comprise at least one member selected from the group consisting of an antioxidant, a heat stabilizer, a processing stabilizer, a weather (light)-resistant stabilizer, an impact resistance improver, a gloss control agent, an agent for improving sliding property, a coloring agent, and a filler. Such a resin composition improves stability of the polyacetal resin and inhibits formaldehyde emission.

Abstract translation: 聚缩醛树脂组合物包含聚缩醛树脂和含杂原子的脂族羧酸酰肼。 相对于聚缩醛树脂100重量份，含杂原子的脂肪族羧酸酰肼的比例可以为约0.001〜20重量份。 聚缩醛树脂组合物可以进一步包含选自抗氧化剂，热稳定剂，加工稳定剂，耐候（耐光性）稳定剂，耐冲击性改进剂，光泽调节剂，光泽调节剂， 改善滑动性，着色剂和填料。 这种树脂组合物提高了聚缩醛树脂的稳定性并抑制甲醛释放。

公开(公告)号：US20090048374A1

公开(公告)日：2009-02-19

申请号：US12209447

申请日：2008-09-12

Applicant: Stefan Fokken ,  Frank Reichwald ,  Markus Willems

Inventor： Stefan Fokken ,  Frank Reichwald ,  Markus Willems

IPC: C09K15/16 ,  C08K5/3437 ,  C08K5/31 ,  C08K5/28 ,  C09K15/32

CPC classification number: C08K5/0008 ,  C08K5/26

Abstract: A stabilizer composition for halogenated polymers includes at least one compound from group A) and at least one compound from group B), group A) being composed of semicarbazides, carbazides, carbazones, and carbodiazones, and their salts, and group B) of guanidines and melamines, superacids and salts of superacids, epoxy and glycidyl compounds, 1,3-dicarbonyl compounds, polyols, sterically hindered amines, hydrotalcites, zeolites, and alkali metal aluminocarbonates, hydrocalumites, metal hydroxides, metal oxides, metal hydrogen carbonates, and metal carbonates, metal soaps, organotin compounds, organic phosphite esters, amino alcohols and hydroxyl-containing isocyanurates, α,β-unsaturated β-aminocarbonyl compounds, aminouracil compounds and aminothiouracil compounds, and compounds having at least one mercapto-functional, sp2-hybridized C atom. Polymers stabilized in accordance with the invention are notable in particular for improved initial color and also for improved color maintenance.

Abstract translation: 用于卤化聚合物的稳定剂组合物包括至少一种A）化合物和至少一种B）的化合物，A）组由氨基脲，卡巴肼，卡巴肼和碳二氮烷及其盐组成，组B）的胍 和超级酸，环氧和缩水甘油基化合物的三聚氰胺，超强酸和盐，1,3-二羰基化合物，多元醇，空间位阻胺，水滑石，沸石和碱金属铝碳酸盐，氢钙钙石，金属氢氧化物，金属氧化物，金属碳酸氢盐和金属 碳酸盐，金属皂，有机锡化合物，有机亚磷酸酯，氨基醇和含羟基异氰脲酸酯，α，β-不饱和β-氨基羰基化合物，氨基尿嘧啶化合物和氨基硫脲嘧啶化合物，以及具有至少一个巯基官能的sp2杂化C 原子。 根据本发明稳定的聚合物尤其值得注意的是改善初始颜色并且还用于改进颜色维持。

公开(公告)号：US6077893A

公开(公告)日：2000-06-20

申请号：US300902

申请日：1994-09-01

Applicant: John B. Yates

Inventor： John B. Yates

IPC: C08K3/00 ,  C08K5/00 ,  C08K5/28 ,  C08L25/02 ,  C08L53/00 ,  C08L53/02 ,  C08L55/02 ,  C08L67/00 ,  C08L69/00 ,  C08L71/00 ,  C08L71/12 ,  C08K5/16

CPC classification number: C08L71/126 ,  C08L67/00 ,  C08L25/02 ,  C08L55/02 ,  C08L69/00 ,  C08L71/12

Abstract: Disclosed are poly(phenylene ether) resin--polyester resin compositions comprising a flow promoting amide. The compositions may optionally contain an impact modifier; a non-elastomeric polymer of an alkenylaromatic compound; a polycarbonate resin; a reinforcing filler or any combination of the foregoing. The compatibility of the compositions can be further improved with the addition of a poly(phenylene ether) resin which is epoxy or ortho-ester functionalized. Improved articles can be made from these compositions.

Abstract translation: 公开了包含流动促进酰胺的聚（苯醚）树脂 - 聚酯树脂组合物。 组合物可任选地含有抗冲改性剂; 链烯基芳族化合物的非弹性体聚合物; 聚碳酸酯树脂; 增强填料或上述的任何组合。 通过添加环氧或邻酯官能化的聚（苯醚）树脂，可以进一步提高组合物的相容性。 可以从这些组合物制备改进的制品。

公开(公告)号：US5415968A

公开(公告)日：1995-05-16

申请号：US794060

申请日：1991-11-19

Applicant: Hiroshi Adachi ,  Yamamoto Shigeyuki

Inventor： Hiroshi Adachi ,  Yamamoto Shigeyuki

IPC: G02B5/20 ,  C08K5/28 ,  C08L83/06 ,  C08L83/07 ,  C09D183/04 ,  C09D183/06 ,  C09D183/07 ,  G03F7/012

CPC classification number: G02B1/105 ,  C08K5/28 ,  C09D183/04

Abstract: A solution containing a low-temperature curing type organosilicon ladder resin composition comprising: (A) a polylphenysylsesquioxane which has a hydroxyl group at the end, in which 3% of the side chain consists of vinyl groups, and which has a weight-average molecular weight of 150,000; (B) 1.8 wt % of 3,3'-diazidophenylsulfone based on the polylphenysylsesquioxane (A); and (C) methoxybenzene which is added to the polylphenysylsesquioxane (A) so that the polylphenysylsesquioxane content is about 15 wt % is used as the material for a surface protective film of a color filter for a light-receiving element or a display element.

Abstract translation: 一种含有低温固化型有机硅梯度树脂组合物的溶液，其包含：（A）末端具有羟基的聚二苯基倍半硅氧烷，其中3％的侧链由乙烯基组成，并且其具有重均分子量 重量15万; （B）基于聚二苯基倍半硅氧烷（A）的1.8重量％的3,3'-二叠氮基苯基砜; 作为用于受光元件或显示元件的滤色器的表面保护膜的材料，使用加成到聚苯基倍半硅氧烷（A）中的（C）甲氧基苯，使得聚苯基倍半硅氧烷含量为约15重量％。

公开(公告)号：US5405720A

公开(公告)日：1995-04-11

申请号：US196497

申请日：1994-02-15

Applicant: Yoshihiro Hosaka ,  Ikuo Nozue ,  Masashige Takatori ,  Yoshiyuki Harita

Inventor： Yoshihiro Hosaka ,  Ikuo Nozue ,  Masashige Takatori ,  Yoshiyuki Harita

IPC: G03C1/00 ,  C08K5/28 ,  C08L61/06 ,  G03C1/72 ,  G03F7/004 ,  G03F7/008 ,  G03F7/022 ,  H01L21/027 ,  G03F7/023

CPC classification number: G03F7/0226 ,  G03F7/0048 ,  G03F7/0085

Abstract: A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Abstract translation: 一种辐射敏感性树脂组合物，其包含碱溶性树脂和辐射敏感性化合物在包含单一单羧酸酯的溶剂中的溶液。 该组合物具有高的储存稳定性（即，在储存期间形成非常少量的微粒），并且适合用作制造集成电路的抗蚀剂。

公开(公告)号：US5114826A

公开(公告)日：1992-05-19

申请号：US458130

申请日：1989-12-28

Applicant: Ranee W. Kwong ,  Harbans S. Sachdev ,  Krishna G. Sachdev

Inventor： Ranee W. Kwong ,  Harbans S. Sachdev ,  Krishna G. Sachdev

IPC: C08F2/46 ,  C08G73/10 ,  C08K5/23 ,  C08K5/28 ,  C08L79/08 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/26 ,  H01L21/027 ,  H01L21/30

CPC classification number: G03F7/0758 ,  G03F7/0387 ,  G03F7/039 ,  H01L2224/11334

Abstract: New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.