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公开(公告)号:US20240352252A1
公开(公告)日:2024-10-24
申请号:US18290933
申请日:2022-05-27
发明人: Haiming CHEN , Shijie SONG , Yapeng FANG
CPC分类号: C08L71/123 , C08K5/521 , C08L2201/02
摘要: A poly(phenylene ether)-based composition exhibiting improved resistance to decomposition after repeated exposure to high voltages is prepared by melt-blending specific amounts of a poly(phenylene ether), an organophosphate ester flame retardant, and a surface energy reducing agent. The composition includes no more than 30 weight percent of mineral filler. Also described is an injection molded article prepared from the composition.
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2.
公开(公告)号:US20240352222A1
公开(公告)日:2024-10-24
申请号:US18685533
申请日:2022-08-31
发明人: Yinlong Du , Shijie Song , Yapeng Fang
CPC分类号: C08K3/22 , C08K7/14 , C08L71/123 , C08L81/02 , H01Q1/364 , C08K2003/2237 , C08K2003/2241 , C08K2201/005
摘要: Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 μm to about 10 μm, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.
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3.
公开(公告)号:US12091542B2
公开(公告)日:2024-09-17
申请号:US17059655
申请日:2019-05-31
IPC分类号: C08L53/02 , B32B5/02 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/12 , C09D153/02 , C09D171/12 , H05K1/03
CPC分类号: C08L53/02 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/123 , C08L71/126 , C09D153/02 , C09D171/12 , H05K1/0346 , H05K1/0373 , B32B2260/046 , B32B2262/101 , B32B2264/1021 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08J2325/10 , C08J2353/02 , C08J2371/12 , C08J2425/10 , C08J2453/02 , C08J2471/12 , C08L2205/025 , C08L53/02 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L71/126 , C08L53/02 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/02 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/025 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08K5/521
摘要: A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
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公开(公告)号:US20240279462A1
公开(公告)日:2024-08-22
申请号:US18565517
申请日:2022-04-27
发明人: Yoichi TAKANO
CPC分类号: C08L71/123 , C08K3/04 , C08K3/26 , C08K3/346 , C08K5/524 , C08K5/5393 , C08K7/14 , C08K2003/265 , C08L2201/02 , C08L2203/206 , C08L2205/02
摘要: A polyphenylene ether-based resin composition that is an aspect of the present invention contains 2 to 20 parts by mass of a polypropylene homopolymer (c) and 1 to 25 parts by mass of an inorganic filler (d) with respect to 100 parts by mass of a polyphenylene ether-containing resin (A) containing a polyphenylene ether-based resin (a) or containing the polyphenylene ether-based resin (a) and a styrene-based resin (b).
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5.
公开(公告)号:US20240279458A1
公开(公告)日:2024-08-22
申请号:US18646300
申请日:2024-04-25
发明人: Kosuke OKUNO , Masaya KOYAMA
IPC分类号: C08L53/00 , C08L71/12 , C09D153/00 , C09D171/12 , H05K1/03
CPC分类号: C08L53/00 , C08L71/12 , C09D153/00 , C09D171/12 , H05K1/0373
摘要: A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy group in a molecule thereof. The curing agent contains an allyl compound expressed by formula (3). In the formula (1), p indicates an integer from 0 to 10, Z indicates an arylene group, and R1 to R3 each independently indicate either a hydrogen atom or an alkyl group. In the formula (2), R4 indicates either a hydrogen atom or an alkyl group. In the formula (3), RA indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.
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公开(公告)号:US12037492B2
公开(公告)日:2024-07-16
申请号:US17842231
申请日:2022-06-16
申请人: TEKNOR APEX COMPANY
发明人: Mark Elkovitch , Richard Barnes
CPC分类号: C08L77/02 , C08L71/12 , C08L2201/02
摘要: A composition including a compatibilized blend of polyamide, polyphenylene ether and a flameproofing agent that synergistically interact such that plaques produced from the composition pass a glow wire ignition temperature test (GWIT) without producing a flame. Advantageously, the flameproofing agent is non-halogenated and the compositions also free of other halogen containing components. In addition, the compositions are free of fillers and are unexpectedly still able to pass the noted tests.
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公开(公告)号:US20240218123A1
公开(公告)日:2024-07-04
申请号:US18286951
申请日:2022-04-26
IPC分类号: C08G65/48 , C08F283/08 , C08L71/12
CPC分类号: C08G65/485 , C08F283/085 , C08L71/126 , C08F2810/20 , C08F2810/30 , C08L2205/025
摘要: A composition comprising a sizing agent comprising a bifunctional poly(arylene ether) comprising a silyl-containing group comprising a silyl-containing terminal group, a silyl-containing pendant group, or a combination thereof; and optionally comprising a terminal functional group, wherein the terminal functional group is not a silyl-containing terminal group or hydrogen.
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公开(公告)号:US20240132712A1
公开(公告)日:2024-04-25
申请号:US18263670
申请日:2022-01-25
发明人: Eloïne NPETGAT
CPC分类号: C08L53/025 , B29C48/022 , C08F2/001 , C08F12/08 , C08L51/003 , C08L71/123 , B29C2948/92704 , B29K2009/06 , B29K2071/12 , C08L2205/025 , C08L2205/035 , C08L2205/22
摘要: The present invention is related to high Impact strength thermoplastic compositions comprising: a) from 10 to 90% by weight of a rubber-modified monovinylidene aromatic (co)polymer; b) from 10 to 90% by weight of a polyphenylene ether; wherein: said rubber-modified monovinylidene aromatic (co)polymer a) comprising: I) a matrix comprising monovinylidene aromatic polymer, and II) from 5 to 25% by weight of rubber in the form of discrete rubber particles dispersed within the matrix, wherein the rubber particles comprise a blend of at least two polybutadienes as well as graft- and block copolymers of polybutadiene and monovinylidene aromatic polymer segments, said rubber particles exhibit: —an average particle size by volume (D50) comprised between 0.8 and 5.5 μm, measured by laser light scattering; said blend of at least two polybutadienes comprises: —at least 50% by weight of one or more polybutadiene(s) with a cis-1,4 structure content of at least 80% by weight and —at most 50% by weight of one or more polybutadiene(s) with a trans-1-4 structure content of at least 25% by weight and a 1,2-vinyl content of at least 5% by weight; said blend being characterized by a dynamic solution viscosity, comprised between 50 and 160 mPa·s, as determined by Brookfield viscometer according to ISO 2555 at a concentration of 5.43% by weight in toluene; and said polyphenylene ether b) has a repeating structural formula (I) wherein R1 and R2 are independently selected from the group consisting of a hydrogen atom, a halogen atom, C1-4 alkyl radicals, C1-4 alkoxy radicals, C6-10 aromatic radicals which are unsubstituted or substituted by a C1-4 alkyl radical, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus, hydrocarbonoxy radicals and halohydrocarbonoxy radicals having at least two carbon atoms between the halogen and the phenyl nucleus, and wherein n is an integer of at least 50. The invention further is related to a method for the preparation of the high Impact strength thermoplastic compositions.
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公开(公告)号:US11958973B2
公开(公告)日:2024-04-16
申请号:US17044004
申请日:2019-05-09
发明人: Fumihito Okamoto
CPC分类号: C08L77/06 , B29C45/0001 , B29C65/16 , C08K3/38 , C08K5/0041 , C08K5/0066 , C08K5/5399 , C08K7/14 , C08L71/126 , C08K2003/387 , C08L2201/10 , C08L2310/00
摘要: To provide a resin composition having large light transmittance and capable of providing a molded article which is highly laser-weldable to an absorbing resin member, as well as a kit, a method for manufacturing the resin composition, a method for manufacturing a formed article, and a formed article. The resin composition contains a polyamide resin, a maleic anhydride-modified polyphenylene ether-based resin, a phosphazene-based flame retardant, a zinc metal oxide, and a light transmitting dye.
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公开(公告)号:US20240110027A1
公开(公告)日:2024-04-04
申请号:US18270290
申请日:2021-03-19
发明人: Cheng LUO , Yundong MENG , Shanyin YAN
CPC分类号: C08J5/244 , C08J5/249 , C08K5/0066 , C08L33/04 , C08L47/00 , C08L53/02 , C08L71/126 , H05K1/0366 , C08J2309/06 , C08J2315/00 , C08J2333/04 , C08J2353/02 , C08J2371/12 , C08K2201/005 , C08K2201/011 , C08L2203/30 , C08L2205/035 , C08L2312/02
摘要: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
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