公开(公告)号：US11028250B2

公开(公告)日：2021-06-08

申请号：US16477036

申请日：2018-01-11

申请人： SHPP Global Technologies B.V.

发明人： Yaqin Zhang ,  Jian Wang ,  Mingcheng Guo ,  Yunan Cheng ,  Shijie Song

IPC分类号： C08K3/04 ,  C08K3/22 ,  C08K3/34 ,  C08K3/38 ,  C08K7/14 ,  C23C18/16 ,  C08L23/06 ,  C08L27/18 ,  C08L69/00

摘要： The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20240352222A1

公开(公告)日：2024-10-24

申请号：US18685533

申请日：2022-08-31

申请人： SHPP GLOBAL TECHNOLOGIES B.V.

发明人： Yinlong Du ,  Shijie Song ,  Yapeng Fang

IPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/12 ,  C08L81/02 ,  H01Q1/36

CPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/123 ,  C08L81/02 ,  H01Q1/364 ,  C08K2003/2237 ,  C08K2003/2241 ,  C08K2201/005

摘要： Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 μm to about 10 μm, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

公开(公告)号：US11649357B2

公开(公告)日：2023-05-16

申请号：US16982630

申请日：2019-03-18

申请人： SHPP Global Technologies B.V.

发明人： Jian Wang ,  Shijie Song

IPC分类号： C08L83/12 ,  C08K3/013 ,  C08G77/46 ,  C08G77/00 ,  C08K3/22 ,  C08K3/30 ,  C08K5/00 ,  C08L71/12 ,  C08K5/521

CPC分类号： C08L83/12 ,  C08G77/46 ,  C08G77/80 ,  C08K3/013 ,  C08K3/22 ,  C08K3/30 ,  C08K5/0066 ,  C08K5/521 ,  C08L71/12 ,  C08K2003/222 ,  C08K2003/2248 ,  C08K2003/3036 ,  C08L71/12 ,  C08L53/02 ,  C08L83/12 ,  C08L53/02 ,  C08L71/12 ,  C08L83/04

摘要： A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.

公开(公告)号：US11643586B2

公开(公告)日：2023-05-09

申请号：US17040733

申请日：2019-03-26

申请人： SHPP Global Technologies B.V.

发明人： Jian Wang ,  Shijie Song ,  Yaqin Zhang

IPC分类号： C09K5/14 ,  C08J3/20 ,  C08L71/12 ,  H05K1/02 ,  H05K1/03

CPC分类号： C09K5/14 ,  C08J3/203 ,  C08L71/123 ,  H05K1/024 ,  H05K1/0373 ,  C08L2203/20 ,  C08L2205/035 ,  C08L2207/066 ,  H05K2201/0158

摘要： A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US11370911B2

公开(公告)日：2022-06-28

申请号：US16476757

申请日：2018-01-10

申请人： SHPP Global Technologies B.V.

发明人： Yunan Cheng ,  Shijie Song ,  Jian Wang

IPC分类号： C08L71/12 ,  B29C35/08 ,  B29C45/00 ,  C08L23/10 ,  C23C18/16 ,  C23C18/20 ,  B29K23/00 ,  B29K509/02 ,  B29L31/34

摘要： Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.

公开(公告)号：US11958972B2

公开(公告)日：2024-04-16

申请号：US18195533

申请日：2023-05-10

申请人： SHPP GLOBAL TECHNOLOGIES B.V.

发明人： Rui Mao ,  Shijie Song

IPC分类号： C08L71/12 ,  C08K7/14

CPC分类号： C08L71/12 ,  C08K7/14 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2207/04

摘要： A thermoplastic composition includes: (a) about 30 wt % to about 60 wt % of a resin component including polyphenylene ether (PPE) and polystyrene (PS); (b) from about 35 wt % to about 65 wt % of a filler component; (c) from about 1 wt % to about 5 wt % of a flow promoter including at least a partially hydrogenated hydrocarbon resin; and (d) an elastomer component including from 2.5 wt % to 5 wt % rubber content in the composition excluding the filler component. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition except as indicated in (d).

公开(公告)号：US20230392007A1

公开(公告)日：2023-12-07

申请号：US18266668

申请日：2021-12-22

申请人： SHPP GLOBAL TECHNOLOGIES B.V.

发明人： Shijie Song ,  Jian WANG ,  Yinlong DU

IPC分类号： C08L71/12 ,  C08K3/22 ,  C08K3/30 ,  C08K5/524

CPC分类号： C08L71/12 ,  C08K3/22 ,  C08K3/30 ,  C08K5/524 ,  C08L2205/035 ,  C08K2003/2241 ,  C08L2203/20 ,  C08K2003/3036 ,  C08K2201/014

摘要： Thermoplastic compositions include: (a) from about 10 wt. % to 60 wt. % of a first polyphenylene oxide PPO; (b) from about 0.5 wt. % to about 10 wt. % of a second PPO with low degree of polymerization and a viscosity between 0.1 dl/g and 0.3 dl/g as measured in chloroform at 25° C. using a viscometer; (c) from about 0.5 wt. % to about 10 wt. % of a general purpose polystyrene GPPS, (d) from about 0.5 wt % to about 10 wt % of an impact modifier; and (e) from about 30 wt. % to about 70 wt. % of an inorganic ceramic filler. A ratio of the first PPO and the second PPO to polystyrene is from 1:1 to 6:1. The combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.