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1.发明申请公开(公告)号：US20210229407A1
公开(公告)日：2021-07-29
申请号：US17059563
申请日：2019-05-31
摘要： Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).
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2.发明申请公开(公告)号：US20210214547A1
公开(公告)日：2021-07-15
申请号：US17059655
申请日：2019-05-31
IPC分类号： C08L53/02 , C08L71/12 , C08J5/24 , C09D153/02 , C09D171/12 , H05K1/03 , B32B15/08
摘要： A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
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3.发明授权公开(公告)号：US12091542B2
公开(公告)日：2024-09-17
申请号：US17059655
申请日：2019-05-31
IPC分类号： C08L53/02 , B32B5/02 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/12 , C09D153/02 , C09D171/12 , H05K1/03
CPC分类号： C08L53/02 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/123 , C08L71/126 , C09D153/02 , C09D171/12 , H05K1/0346 , H05K1/0373 , B32B2260/046 , B32B2262/101 , B32B2264/1021 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08J2325/10 , C08J2353/02 , C08J2371/12 , C08J2425/10 , C08J2453/02 , C08J2471/12 , C08L2205/025 , C08L53/02 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L71/126 , C08L53/02 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/02 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/025 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08K5/521
摘要： A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
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