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1.发明授权公开(公告)号：US12091542B2
公开(公告)日：2024-09-17
申请号：US17059655
申请日：2019-05-31
IPC分类号： C08L53/02 , B32B5/02 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/12 , C09D153/02 , C09D171/12 , H05K1/03
CPC分类号： C08L53/02 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/123 , C08L71/126 , C09D153/02 , C09D171/12 , H05K1/0346 , H05K1/0373 , B32B2260/046 , B32B2262/101 , B32B2264/1021 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08J2325/10 , C08J2353/02 , C08J2371/12 , C08J2425/10 , C08J2453/02 , C08J2471/12 , C08L2205/025 , C08L53/02 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L71/126 , C08L53/02 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/02 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/025 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08K5/521
摘要： A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
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2.发明公开公开(公告)号：US20240270903A1
公开(公告)日：2024-08-15
申请号：US18560404
申请日：2022-05-18
发明人： Shinichi FUKUEN , Yudai TANAKA
CPC分类号： C08G65/2612 , C08G65/2672 , C08J5/246 , C08J2371/12
摘要： An object of the present disclosure is to provide a polyphenylene ether with excellent solubility in general-purpose aromatic solvents and general-purpose ketone-based solvents and a production method of the same. A polyphenylene ether containing a repeating unit derived from the phenol of the formula (1), a method for producing the same, a thermosetting composition, a prepreg, and a laminate are provided.
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公开(公告)号：US20240243464A1
公开(公告)日：2024-07-18
申请号：US18264757
申请日：2022-01-31
发明人： Tatsuaki KASAI
CPC分类号： H01Q1/42 , B32B5/18 , B32B5/32 , B32B7/023 , C08J9/0061 , C08J9/18 , C08J9/232 , C08J9/36 , B32B2266/0228 , B32B2266/025 , B32B2266/10 , B32B2307/204 , B32B2307/3065 , B32B2307/418 , B32B2307/72 , C08J2203/06 , C08J2203/22 , C08J2205/04 , C08J2371/12 , C08J2425/06
摘要： A cover for an electronic device that transmits and receives radio waves in a high-frequency band, the cover comprising a resin and satisfying the relationship of the following formula:
(100−frontal transmittance X)×(100−oblique transmittance Y)-
公开(公告)号：US20240110027A1
公开(公告)日：2024-04-04
申请号：US18270290
申请日：2021-03-19
发明人： Cheng LUO , Yundong MENG , Shanyin YAN
CPC分类号： C08J5/244 , C08J5/249 , C08K5/0066 , C08L33/04 , C08L47/00 , C08L53/02 , C08L71/126 , H05K1/0366 , C08J2309/06 , C08J2315/00 , C08J2333/04 , C08J2353/02 , C08J2371/12 , C08K2201/005 , C08K2201/011 , C08L2203/30 , C08L2205/035 , C08L2312/02
摘要： The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
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公开(公告)号：US20240059847A1
公开(公告)日：2024-02-22
申请号：US18267299
申请日：2021-12-09
发明人： Haruhiko MATSUURA , Shinya MATSUNO
IPC分类号： C08J3/16 , C08G65/46 , C09D171/12
CPC分类号： C08J3/16 , C08G65/46 , C09D171/12 , C08J2371/12
摘要： Provided is a hollow resin particle that has a hollow portion therein and that can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a hollow portion therein, has an ether structure represented by formula (1), and has an average particle diameter of 0.1 μm to 100 μm. [Chem. 1]
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公开(公告)号：US11905409B2
公开(公告)日：2024-02-20
申请号：US18112837
申请日：2023-02-22
发明人： Kosuke Tsuda , Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
CPC分类号： C08L71/126 , C08J5/18 , C08J5/249 , C08K3/36 , H05K1/0373 , C08J2371/12 , C08J2425/16 , C08J2453/02 , C08L2203/16
摘要： An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
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7.发明授权公开(公告)号：US11773115B2
公开(公告)日：2023-10-03
申请号：US17013226
申请日：2020-09-04
发明人： Zhilong Hu , Hezong Zhang
CPC分类号： C07F7/0812 , C08K5/5406 , C08L71/126 , C08L79/085 , C08J5/18 , C08J5/244 , C08J2371/12
摘要： A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.
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公开(公告)号：US20230211583A1
公开(公告)日：2023-07-06
申请号：US18000543
申请日：2021-06-02
发明人： Yasuyuki KAWAZU
CPC分类号： B32B15/046 , C09J163/00 , C08J9/228 , B32B7/12 , B32B5/18 , B32B3/266 , C08J2325/06 , C08J2371/12 , C08J2377/06 , B32B2307/54 , B32B2266/08 , B32B2266/0257 , B32B5/32
摘要： An object of the present disclosure is to provide a composite material laminate excellent in impact resistance and vibration damping property. The present disclosure is a composite material laminate including a metal substrate, an adhesive layer formed on a surface of the metal substrate, and a foamed body layer formed on a surface of the adhesive layer, wherein a shear fracture strength (S) at an interface between the metal substrate and the adhesive layer is 1.0 MPa or more, and (S/F) determined by dividing the shear fracture strength (S) at the interface by a bending elastic modulus (F) of the foamed body layer is 0.007 or more and 0.5 or less.
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公开(公告)号：US20180134856A1
公开(公告)日：2018-05-17
申请号：US15571429
申请日：2016-08-02
申请人： Teijin Limited
发明人： Akihisa Nomura , Katsuaki Yuasa , Guofei Hua
CPC分类号： C08J5/042 , C08J5/04 , C08J5/06 , C08J2371/10 , C08J2371/12 , C08J2377/02 , C08J2377/06 , C08J2425/06 , C08J2471/10 , C08J2471/12 , C08J2477/02 , C08J2477/06 , C08K7/02 , C08K7/06 , C08L71/12 , C08L77/00
摘要： A press-molded product includes: carbon fibers having a weight average fiber length of 1 mm or more; a polyamide-based resin (X); and a polyarylene ether-based resin (Y). The carbon fibers include carbon fiber bundles. The polyamide-based resin (X) and the polyarylene ether-based resin (Y) form a sea-island structure inside and outside the carbon fiber bundles. In the sea-island structure, one of the polyamide-based resin (X) and the polyarylene ether-based resin (Y) forms a sea phase and the other forms an island phase having a particle diameter Dr of 0.05 μm or more and less than 50 μm.
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10.发明授权公开(公告)号：US09926435B2
公开(公告)日：2018-03-27
申请号：US15067144
申请日：2016-03-10
发明人： Chen-Yu Hsieh
CPC分类号： C08K5/53 , C08J5/18 , C08J5/24 , C08J2371/00 , C08J2371/12 , H05K1/0326 , H05K1/0353 , H05K1/0373 , H05K1/09 , H05K2201/012 , H05K2203/122 , C08L71/02
摘要： A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
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