公开(公告)号：US12098257B2

公开(公告)日：2024-09-24

申请号：US17626881

申请日：2020-07-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hirosuke Saito ,  Yiqun Wang ,  Hiroharu Inoue

IPC: C08J5/24 ,  B32B5/02 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  C08L63/08 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08J5/249 ,  B32B5/02 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  C08J5/24 ,  C08L63/08 ,  H05K1/0353 ,  H05K1/036 ,  H05K3/022 ,  B32B2260/046 ,  B32B2307/206 ,  B32B2457/04 ,  B32B2457/08 ,  C08J2363/08 ,  C08J2453/00 ,  C08J2471/12 ,  C08L2205/03

Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent.




In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.




In Formula (2), R4 represents a hydrogen atom or an alkyl group.

公开(公告)号：US11905409B2

公开(公告)日：2024-02-20

申请号：US18112837

申请日：2023-02-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kosuke Tsuda ,  Hirosuke Saito ,  Yiqun Wang ,  Hiroharu Inoue

IPC: B32B3/00 ,  C08L71/12 ,  C08J5/24 ,  C08J5/18 ,  C08K3/36 ,  H05K1/03

CPC classification number: C08L71/126 ,  C08J5/18 ,  C08J5/249 ,  C08K3/36 ,  H05K1/0373 ,  C08J2371/12 ,  C08J2425/16 ,  C08J2453/02 ,  C08L2203/16

Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

公开(公告)号：US11945910B2

公开(公告)日：2024-04-02

申请号：US16978599

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Rihoko Watanabe ,  Hiroharu Inoue ,  Yiqun Wang

IPC: B32B3/10 ,  B32B15/08 ,  C08F222/40 ,  C08G65/48 ,  C08J5/24 ,  C08L25/06 ,  C08L47/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/03

CPC classification number: C08G65/485 ,  B32B15/08 ,  C08F222/40 ,  C08J5/244 ,  C08J5/249 ,  C08L25/06 ,  C08L47/00 ,  C08L71/126 ,  C08L79/08 ,  H05K1/0326 ,  H05K1/0346 ,  B32B2457/08 ,  C08F212/36 ,  C08F222/406

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1):




wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.

公开(公告)号：US12122129B2

公开(公告)日：2024-10-22

申请号：US16977384

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Rihoko Watanabe ,  Hiroharu Inoue ,  Yiqun Wang

IPC: B32B27/28 ,  B32B15/08 ,  C08F112/08 ,  C08F120/14 ,  C08F222/40 ,  C08J5/04 ,  C08J5/18 ,  C08J5/24 ,  C08L71/12

CPC classification number: B32B27/281 ,  B32B15/08 ,  C08F112/08 ,  C08F120/14 ,  C08F222/404 ,  C08J5/043 ,  C08J5/18 ,  C08J5/244 ,  C08J5/249 ,  C08L71/126 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2457/08 ,  C08F2810/40 ,  C08J2371/12 ,  C08F290/06 ,  C08F222/40

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

公开(公告)号：US11365274B2

公开(公告)日：2022-06-21

申请号：US16978564

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Yiqun Wang ,  Hiroharu Inoue

IPC: C08F290/06 ,  C08J5/24 ,  B32B15/08 ,  H05K1/05

Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.