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Patent Agency Ranking
公开(公告)号：US12275846B2
公开(公告)日：2025-04-15
申请号：US18012176
申请日：2021-06-14
Inventor： Jun Yasumoto , Rihoko Watanabe , Teppei Washio , Hiroharu Inoue
Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
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2.发明授权公开(公告)号：US11234329B2
公开(公告)日：2022-01-25
申请号：US16954020
申请日：2018-12-04
Inventor： Rihoko Watanabe , Keiko Kashihara , Hiroharu Inoue
Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
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公开(公告)号：US11945910B2
公开(公告)日：2024-04-02
申请号：US16978599
申请日：2019-03-11
Inventor： Hiroaki Umehara , Rihoko Watanabe , Hiroharu Inoue , Yiqun Wang
IPC: B32B3/10 , B32B15/08 , C08F222/40 , C08G65/48 , C08J5/24 , C08L25/06 , C08L47/00 , C08L71/12 , C08L79/08 , H05K1/03
CPC classification number: C08G65/485 , B32B15/08 , C08F222/40 , C08J5/244 , C08J5/249 , C08L25/06 , C08L47/00 , C08L71/126 , C08L79/08 , H05K1/0326 , H05K1/0346 , B32B2457/08 , C08F212/36 , C08F222/406
Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1):
wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.-
公开(公告)号：US12122129B2
公开(公告)日：2024-10-22
申请号：US16977384
申请日：2019-03-11
Inventor： Hiroaki Umehara , Rihoko Watanabe , Hiroharu Inoue , Yiqun Wang
IPC: B32B27/28 , B32B15/08 , C08F112/08 , C08F120/14 , C08F222/40 , C08J5/04 , C08J5/18 , C08J5/24 , C08L71/12
CPC classification number: B32B27/281 , B32B15/08 , C08F112/08 , C08F120/14 , C08F222/404 , C08J5/043 , C08J5/18 , C08J5/244 , C08J5/249 , C08L71/126 , B32B2250/02 , B32B2250/03 , B32B2457/08 , C08F2810/40 , C08J2371/12 , C08F290/06 , C08F222/40
Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).
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公开(公告)号：US11407869B2
公开(公告)日：2022-08-09
申请号：US16466979
申请日：2017-12-07
Inventor： Keiko Kashihara , Rihoko Watanabe , Hiroharu Inoue
Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
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