公开(公告)号：US12275846B2

公开(公告)日：2025-04-15

申请号：US18012176

申请日：2021-06-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Jun Yasumoto ,  Rihoko Watanabe ,  Teppei Washio ,  Hiroharu Inoue

IPC: H05K1/03 ,  C08J5/24 ,  C08J7/04 ,  C08L79/08

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

公开(公告)号：US12173151B2

公开(公告)日：2024-12-24

申请号：US18517442

申请日：2023-11-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Fumito Suzuki ,  Jun Yasumoto ,  Hiroharu Inoue

IPC: C08L71/12 ,  C08J5/24 ,  C08K5/00 ,  C08K5/3492

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

公开(公告)号：US11866580B2

公开(公告)日：2024-01-09

申请号：US16957232

申请日：2018-10-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Fumito Suzuki ,  Jun Yasumoto ,  Hiroharu Inoue

IPC: C08L71/12 ,  C08K5/00 ,  C08K5/3492 ,  C08J5/24

CPC classification number: C08L71/126 ,  C08J5/244 ,  C08K5/0025 ,  C08K5/34924 ,  C08L2203/16 ,  C08L2203/202 ,  C08L2205/025 ,  C08L2312/00

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.