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    HOT-MELT PRESSURE-SENSITIVE ADHESIVE
    6.
    发明申请
    HOT-MELT PRESSURE-SENSITIVE ADHESIVE 审中-公开
    热熔敏感胶粘剂

    公开(公告)号：US20170022399A1

    公开(公告)日：2017-01-26

    申请号：US15274082

    申请日：2016-09-23

    Applicant: HENKEL AG & CO. KGAA

    Inventor： Yukio ISOBE ,  Itsuro TOMATSU ,  Tadashi HAYAKAWA

    IPC: C09J125/06 ,  C09J153/02

    CPC classification number: C09J125/06 ,  C08L25/06 ,  C08L53/02 ,  C09J153/02

    Abstract: To provide a hot-melt pressure-sensitive adhesive which is easily coated, has a weak odor, high stability with time, and is also excellent in adhesive force retention performance from a low temperature range to a high temperature range. A hot-melt pressure-sensitive adhesive comprising: an amorphous polystyrene resin (A) having a number-average molecular weight of 50,000 or more; and a thermoplastic block copolymer (B) which is a copolymer of vinyl-based aromatic hydrocarbons and conjugated diene compounds.

    Abstract translation: 为了提供容易涂布的热熔压敏粘合剂，具有弱的气味，高稳定性随时间的变化，并且在低温范围至高温范围内的粘合力保持性能也优异。 一种热熔压敏粘合剂，包括：数均分子量为50,000以上的无定形聚苯乙烯树脂（A） 和作为乙烯基类芳香族烃和共轭二烯化合物的共聚物的热塑性嵌段共聚物（B）。

    TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
    8.
    发明申请
    TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
    用于制造半导体器件的临时粘合剂，以及使用该半导体器件的半导体器件的粘合支持和生产方法

    公开(公告)号：US20150184032A1

    公开(公告)日：2015-07-02

    申请号：US14641656

    申请日：2015-03-09

    Applicant: FUJIFILM Corporation

    Inventor： Yu IWAI ,  Ichiro KOYAMA

    IPC: C09J4/00 ,  H01L21/306 ,  C09J101/14 ,  C09J125/06 ,  C09J101/12 ,  H01L21/304 ,  H01L21/683

    CPC classification number: C09J4/00 ,  C09J101/00 ,  C09J101/08 ,  C09J101/10 ,  C09J101/12 ,  C09J101/14 ,  C09J101/26 ,  C09J125/06 ,  C09J201/00 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31133 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/28

    Abstract: By a temporary adhesive for production of semiconductor device containing (A) a polymer compound having a thermal decomposition initiation temperature of 250° C. or more, and (B) a radical polymerizable monomer, and an adhesive support and a production method of semiconductor device using the same, a temporary adhesive for production of semiconductor device, which can temporarily support a member to be processed (for example, a semiconductor wafer) with a high adhesive force even under high temperature condition (for example, at 100° C.) when the member to be processed is subjected to a mechanical or chemical processing, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition, and which can easily release the temporary support for the member processed without imparting damage to the member processed, and an adhesive support and a production method of semiconductor device using the same can be provided.

    Abstract translation: 通过使用含有（A）热分解开始温度为250℃以上的高分子化合物和（B）自由基聚合性单体的半导体装置的临时粘合剂，以及粘合剂支持体和半导体装置的制造方法 使用它们，即使在高温条件下（例如，在100℃）下也可以以高粘合力临时支撑待处理的部件（例如，半导体晶片）的用于生产半导体器件的临时粘合剂。 当待加工的构件经受机械或化学处理时，即使在高温条件下也能在临时支撑体中减少气体产生的问题，并且能够容易地释放所加工的构件的临时支撑而不损害 可以提供加工构件，并且可以提供使用其的半导体装置的粘合剂支持体和制造方法。

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