公开(公告)号：US11008415B2

公开(公告)日：2021-05-18

申请号：US16322833

申请日：2017-07-07

Applicant: HITACHI, LTD.

Inventor： Yuri Kajihara ,  Takahito Muraki ,  Yasuhiko Tada ,  Jun Nunoshige ,  Takeshi Kondo

IPC: C08F293/00 ,  H01F27/32 ,  H01B3/44 ,  C08J7/16 ,  C08K5/55 ,  C08K5/098 ,  H02K3/30

Abstract: In a conventional self-healing material, although the resin properties after self-healing are restored to the same level as the initial refractoriness and strength of the resin, no further extension of life can be expected. A resin cured product according to the present invention includes: a first vinyl monomer having an ester bond; a second vinyl monomer having a hydroxyl group; a transesterification reaction catalyst; and a boron compound.

公开(公告)号：US09944732B2

公开(公告)日：2018-04-17

申请号：US15105034

申请日：2013-12-27

Applicant: Hitachi, Ltd.

Inventor： Yuri Kajihara ,  Takahito Muraki ,  Jun Nunoshige

IPC: C08F120/14 ,  C07F5/02 ,  C08F112/08 ,  C09J125/06 ,  C09J133/12 ,  C08F12/08 ,  C08F4/52 ,  C08F4/04 ,  C09D125/06 ,  C09D133/12

CPC classification number: C08F120/14 ,  C07F5/025 ,  C08F4/04 ,  C08F4/52 ,  C08F12/08 ,  C08F112/08 ,  C09D125/06 ,  C09D133/12 ,  C09J125/06 ,  C09J133/12 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

Abstract: This invention is intended to synthesize a multi-branched polymer, which has an uniform molecular chain lengths and is free from branch defects, without the need for purification. This invention is also intended to synthesize a polyfunctional radical polymerization initiator represented by Formula 1: wherein n is an integer of 1 or larger; Y is a polyfunctional unsaturated compound; R1 is a hydrocarbon group; R2 is a structure in which one molecule of a radically polymerizable unsaturated hydrocarbon compound is bound to R1 and the oxygen atom; X1 of B—X1 (boron-X1) bond is an alkoxy or phenyl group; and X2 of B—X2 (boron-X2) bond is an alkoxy or phenyl group.

公开(公告)号：US20150152230A1

公开(公告)日：2015-06-04

申请号：US14402613

申请日：2013-04-10

Applicant: Hitachi, Ltd.

Inventor： Takahito Muraki ,  Satoru Amou ,  Hiroyuki Kagawa

IPC: C08J3/24 ,  H01F27/24 ,  H01F27/28 ,  C09D171/00 ,  H01B3/42

CPC classification number: C08J3/24 ,  C08G65/485 ,  C08J2371/10 ,  C08K5/357 ,  C08L71/12 ,  C09D171/00 ,  C09D171/12 ,  H01B3/307 ,  H01B3/308 ,  H01B3/427 ,  H01F27/24 ,  H01F27/2823 ,  Y10T428/294

Abstract: An object of the present invention is to provide: a resin composition which yields a hardened product having both processability/formability and thermal resistance; and an electrical device using the hardened product of the resin composition. A resin composition containing (A) polyarylene type thermoplastic polymer shown by Expression 1 and (B) chemical compound having at least two substituent groups capable of generating cationic species.

Abstract translation: 本发明的目的是提供：产生具有加工性/成形性和耐热性的硬化产品的树脂组合物; 以及使用该树脂组合物的硬化物的电气装置。 含有（A）式（A）的聚亚芳基型热塑性聚合物和（B）具有至少两个能够产生阳离子种类的取代基的化合物的树脂组合物。