公开(公告)号：US20150165741A1

公开(公告)日：2015-06-18

申请号：US14566062

申请日：2014-12-10

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hirofumi Imai ,  Atsushi Kubo ,  Takahiro Yoshioka ,  Kimihiro Nakada ,  Shigeru Kato ,  Yasumasa Iwata

IPC: B32B37/10 ,  B32B37/18 ,  B32B37/12

CPC classification number: B32B37/18 ,  B32B37/0015 ,  B32B37/003 ,  B32B37/1018 ,  B32B37/1207 ,  B32B39/00 ,  B32B2037/1215 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68304 ,  H01L2221/68327 ,  Y10T156/10

Abstract: A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.

Abstract translation: 一种接合方法，其包括将基板和支撑板通过粘合剂层彼此粘合并且使用板构件按压所述键合基板和支撑板的按压步骤; 并且在所述按压工序之后，将所述基板和所述支撑板通过所述粘合层彼此粘合的压力调整步骤，所述压力调节步骤在比进行所述按压工序的环境压力高的压力的环境中进行。

公开(公告)号：US20240103368A1

公开(公告)日：2024-03-28

申请号：US18262451

申请日：2022-01-31

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kenichi Yamagata ,  Ryosuke Nakamura ,  Hirofumi Imai

IPC: G03F7/032 ,  G03F7/004 ,  G03F7/029

CPC classification number: G03F7/032 ,  G03F7/0043 ,  G03F7/0295

Abstract: A negative photosensitive composition for forming a top plate portion of a hollow structure which contains an epoxy group-containing compound, a cationic polymerization initiator, a polyfunctional (meth)acrylate compound, and a photoradical polymerization initiator.

公开(公告)号：US10793756B2

公开(公告)日：2020-10-06

申请号：US16141696

申请日：2018-09-25

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Koki Tamura ,  Hirofumi Imai ,  Toshiyuki Ogata ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC: C09J153/00 ,  C09J7/38 ,  C09J7/20 ,  C09J5/00 ,  C09J153/02 ,  H01L21/683

Abstract: An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×105 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.; and (c) a thermal polymerization inhibitor.

公开(公告)号：US20190091979A1

公开(公告)日：2019-03-28

申请号：US16200215

申请日：2018-11-26

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo

IPC: B32B27/28 ,  B32B27/06 ,  H01L21/02 ,  C09J181/06 ,  B32B37/12 ,  B32B27/00 ,  H01L21/683

Abstract: A method of producing a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

公开(公告)号：US08809457B2

公开(公告)日：2014-08-19

申请号：US13628989

申请日：2012-09-27

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hirofumi Imai ,  Koki Tamura ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC: C08L53/00 ,  C09B67/00 ,  C09J7/02 ,  C09J153/02

CPC classification number: C09J7/0221 ,  C09J7/20 ,  C09J7/387 ,  C09J153/02 ,  C09J153/025 ,  Y10T428/2852

Abstract: An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

Abstract translation: 一种粘合剂组合物，其包含烃树脂，与至少一个含官能团的原子基团键合的改性弹性体和溶剂。

公开(公告)号：US20140166209A1

公开(公告)日：2014-06-19

申请号：US14183988

申请日：2014-02-19

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hirofumi Imai ,  Koki Tamura ,  Atsushi Kubo ,  Takahiro Yoshioka ,  Yasushi Fujii ,  Yoshihiro Inao

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  B32B2310/0825 ,  B32B2457/14 ,  C08G77/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1195 ,  Y10T428/31663

Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

Abstract translation: 包括透射红外线的支撑体的层压体; 由支撑体支撑的基板; 粘合层，支撑体和基板通过该粘合层彼此附接; 以及分离层，其位于所述支撑体的与所述基板的表面相连的表面上，并且由具有红外线吸收结构的化合物制成。 目标物紧密地附着并支撑在层压板中，同时确保支撑物与目标的容易分离。

公开(公告)号：US20240045330A1

公开(公告)日：2024-02-08

申请号：US18349825

申请日：2023-07-10

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Shota Katayama ,  Takahiro Kondo ,  Kenichi Yamagata ,  Hirofumi Imai

IPC: G03F7/038 ,  G03F7/031

CPC classification number: G03F7/0385 ,  G03F7/031

Abstract: A negative photosensitive composition including a novolak-type polyfunctional aromatic epoxy resin (Ap), a trifunctional epoxy monomer (Am), and a sulfonium salt represented by Formula (I0). A mass ratio of (Am)/(Ap) is 5/5 to 8/2. In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4; L is —S—, —O—, —SO—, —SO2—, or —CO— and X− represents a monovalent polyatomic anion

公开(公告)号：US09944049B2

公开(公告)日：2018-04-17

申请号：US15139920

申请日：2016-04-27

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo

IPC: B32B7/06 ,  B32B7/12 ,  C09J7/02 ,  C09D183/00 ,  H01L21/683 ,  B32B9/04 ,  C09D183/06 ,  C08L83/04 ,  B32B27/28 ,  C08L83/06

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/283 ,  B32B2250/02 ,  B32B2255/26 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  C08G77/28 ,  C08L83/04 ,  C08L83/06 ,  C09D183/00 ,  C09D183/06 ,  C09D183/08 ,  C09J7/40 ,  C09J7/401 ,  C09J2483/005 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

公开(公告)号：US09607875B2

公开(公告)日：2017-03-28

申请号：US14691262

申请日：2015-04-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC: C09J125/06 ,  C09J153/00 ,  B32B7/12 ,  B32B38/00 ,  H01L21/683 ,  C09J145/00 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/28 ,  B32B27/30 ,  C09J153/02

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

公开(公告)号：US20150299534A1

公开(公告)日：2015-10-22

申请号：US14691262

申请日：2015-04-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC: C09J153/00 ,  C09J145/00 ,  C09J125/14 ,  B32B38/00 ,  B32B7/06 ,  H01L21/683 ,  B32B43/00 ,  C09J125/06 ,  B32B7/12

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

Abstract translation: 一种用于将基板临时附接到支撑基板的支撑板的粘合剂组合物，并且包括热塑性树脂和脱模剂。