公开(公告)号：US20240317672A1

公开(公告)日：2024-09-26

申请号：US18483911

申请日：2023-10-10

申请人： Samsung Electronics Co., Ltd.

发明人： Dmitry ANDROSOV ,  Cheol KANG ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Beomseok KIM ,  Hana KIM ,  Hoyoon PARK

IPC分类号： C07C69/94 ,  G03F7/038 ,  G03F7/039

CPC分类号： C07C69/94 ,  G03F7/0385 ,  G03F7/039 ,  C07C2601/08 ,  C07C2603/54

摘要： Disclosed are a polycarboxylate compound represented by Formula 1 below, a resist composition including the same, and a method of forming a pattern using the same.




In Formula 1, A11, X11, m11, n11, R13 and b13 are as described in the specification.

公开(公告)号：US20230229081A1

公开(公告)日：2023-07-20

申请号：US18010821

申请日：2021-06-03

申请人： Huntsman Advanced Materials Licensing (Switzerland)GmbH

发明人： Yiwan Shu ,  Wancheong Wong

IPC分类号： G03F7/038 ,  H05K3/22

CPC分类号： G03F7/0385 ,  H05K3/22

摘要： This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

公开(公告)号：US20180136559A1

公开(公告)日：2018-05-17

申请号：US15569051

申请日：2016-10-12

申请人： GOO CHEMICAL CO., LTD.

发明人： Yoshio Sakai

IPC分类号： G03F7/033 ,  G03F7/031 ,  G03F7/029 ,  H05K3/28

CPC分类号： G03F7/033 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/2054

摘要： A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).

公开(公告)号：US20170291984A1

公开(公告)日：2017-10-12

申请号：US15516967

申请日：2015-10-23

申请人： NITTO DENKO CORPORATION

发明人： Tomoyuki HIRAYAMA

IPC分类号： C08G59/18 ,  H01L51/00 ,  G03F7/004

CPC分类号： C08G59/186 ,  C08G59/226 ,  C08G59/68 ,  C08L63/00 ,  G02B6/12 ,  G03F7/0043 ,  G03F7/038 ,  G03F7/0385 ,  H01L51/0034 ,  H01L51/0097 ,  H05K1/0274 ,  H05K1/118 ,  H05K2201/0108 ,  H05K2203/0514 ,  H05K2203/0525

摘要： Disclosed is a photosensitive resin composition for an optical waveguide containing a resin component and a photoacid generator. In the photosensitive resin composition, the resin component is constituted of an epoxy resin component containing both an aromatic epoxy resin and an aliphatic epoxy resin, and the content of the aromatic epoxy resin is 55 wt. % or more and less than 80 wt. % of the entirety of the epoxy resin component and the content of the aliphatic epoxy resin is more than 20 wt. % and 45 wt. % or less of the entirety of the epoxy resin component. Accordingly, for example, when a core layer of an optical waveguide is formed using the disclosed photosensitive resin composition for an optical waveguide, a core layer of an optical waveguide having satisfactorily low tackiness and high transparency while maintaining satisfactory roll-to-roll compatibility and a high resolution patterning property can be formed.

公开(公告)号：US20170017152A1

公开(公告)日：2017-01-19

申请号：US15124469

申请日：2015-08-17

申请人： GOO CHEMICAL CO., LTD.

发明人： Yoshio SAKAI

IPC分类号： G03F7/031 ,  G03F7/038 ,  H05K1/03 ,  G03F7/26 ,  H05K1/02 ,  G03F7/004 ,  G03F7/20

CPC分类号： G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

摘要： This photosensitive resin composition includes: (A) a photopolymerizable compound including at least one of a photopolymerizable monomer and a photopolymerizable oligomer; (B) titanium dioxide; and (C) a photopolymerization initiator. The component (C) includes (C1) an acylphosphine oxide-containing photopolymerization initiator and (C2) a phenylglyoxylic acid-containing photopolymerization initiator.

摘要翻译： 该感光性树脂组合物包含：（A）包含光聚合性单体和光聚合性低聚物中的至少一种的光聚合性化合物， （B）二氧化钛; 和（C）光聚合引发剂。 组分（C）包括（C1）含酰基氧化膦的光聚合引发剂和（C2）含苯基乙醛酸的光聚合引发剂。

公开(公告)号：US20150382473A1

公开(公告)日：2015-12-31

申请号：US14753655

申请日：2015-06-29

申请人： Taiyo Ink Manufacturing Co., Ltd.

发明人： Daichi OKAMOTO ,  Nobuhito ITO ,  Shoji MINEGISHI

IPC分类号： H05K3/00 ,  G03F7/11 ,  H05K1/03

CPC分类号： G03F7/11 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/09 ,  H05K3/281 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0129

摘要： Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.

摘要翻译： 本发明提供能够形成具有优异的底部填充性能的焊料保护层的感光性干膜，与模具材料的附着性优异。 根据本发明的感光性干膜是包含支撑膜和设置在支撑膜的一侧的感光性树脂层的感光性干膜，其中，支撑膜的侧面的算术平均表面粗糙度Ra为感光性 树脂层的厚度为50〜390nm。

公开(公告)号：US20150346405A1

公开(公告)日：2015-12-03

申请号：US14713563

申请日：2015-05-15

申请人： CHI MEI CORPORATION

发明人： JUNGPIN HSU

IPC分类号： G02B5/22 ,  G02F1/1335

CPC分类号： G02B5/223 ,  G02B1/04 ,  G02B5/201 ,  G02F1/133516 ,  G03F7/0007 ,  G03F7/032 ,  G03F7/033 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/30 ,  C08L2666/70

摘要： The present invention relates to a photosensitive resin composition for a color filter and uses thereof. The photosensitive resin composition includes a pigment (A), an alkali-soluble resin (B), a cationic polymeric compound (C), a compound (D) having an ethylenically unsaturated group, a photoinitiator (E) and an organic solvent (F). The photosensitive resin composition according to the present invention can improve voltage holding ratio and developing-resistance of the color filter.

摘要翻译： 本发明涉及一种滤色器用感光性树脂组合物及其用途。 感光性树脂组合物包含颜料（A），碱溶性树脂（B），阳离子聚合化合物（C），具有烯属不饱和基团的化合物（D），光引发剂（E）和有机溶剂（F ）。 根据本发明的感光性树脂组合物可以提高滤色器的电压保持率和显影电阻。

公开(公告)号：US09128375B2

公开(公告)日：2015-09-08

申请号：US14237962

申请日：2012-06-20

申请人： Michiya Higuchi ,  Fumito Suzuki ,  Yoshio Sakai ,  Hisashi Marusawa

发明人： Michiya Higuchi ,  Fumito Suzuki ,  Yoshio Sakai ,  Hisashi Marusawa

IPC分类号： G03F7/038 ,  C08G59/40 ,  G03F7/027 ,  H05K3/28 ,  C08G59/17 ,  C08G59/42 ,  C08L63/10 ,  G03F7/032 ,  H05K3/34

CPC分类号： G03F7/0385 ,  C08G59/1466 ,  C08G59/40 ,  C08G59/42 ,  C08L63/10 ,  G03F7/027 ,  G03F7/032 ,  G03F7/038 ,  G03F7/0384 ,  G03F7/0388 ,  H05K3/287 ,  H05K3/3452

摘要： The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having; a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid.

摘要翻译： 本发明提供一种抗蚀剂用树脂组合物，其能够有效地形成具有高耐龟裂性，耐膨胀性，抗突出性等的固化物，用于填充通孔，通孔等，固化 产品。 根据本发明的掩模用树脂组合物含有第一树脂和第二树脂。 第一树脂通过多元酸酐与具有羧基的烯属不饱和化合物和双官能环氧树脂的加合物的加成反应制备。 第二树脂具有： 通过环氧基与一元羧酸的加成反应获得的基团; 和通过环氧基与多元酸的加成反应获得的基团。

公开(公告)号：US20150125789A1

公开(公告)日：2015-05-07

申请号：US14403968

申请日：2013-05-24

申请人： LG CHEM, LTD.

发明人： Kwang Han Park ,  Sunghyun Kim ,  Dongchang Choi ,  Kyung Soo Choi ,  Sang Chul Lee ,  Heeyoung Oh

IPC分类号： G03F7/038 ,  G03F7/30

CPC分类号： G03F7/0388 ,  G03F7/033 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0751 ,  G03F7/30 ,  G06F2203/04103

摘要： The present specification provides a photosensitive resin composition comprising an alkali-soluble binder, a crosslinkable compound, a photopolymerization initiator, a solvent, a coloring agent and an epoxy adhesion promoter. The photosensitive resin composition has excellent insulating properties and light-shielding properties and shows excellent chemical resistance in an etching process and a stripping process. Thus, the photosensitive resin composition can be formed into a thin bezel layer having a gradual taper, and thus can provide an integrated touch sensor that makes it possible to prevent short circuits from occurring in metal wiring and minimize any decrease in resistance resulting from high-temperature processing.

摘要翻译： 本说明书提供了包含碱溶性粘合剂，可交联化合物，光聚合引发剂，溶剂，着色剂和环氧树脂粘合促进剂的感光性树脂组合物。 感光性树脂组合物具有优异的绝缘性和遮光性，并且在蚀刻工艺和剥离工艺中表现出优异的耐化学性。 因此，感光性树脂组合物可以形成为具有逐渐变细的薄的边框层，从而可以提供一体的触摸传感器，其可以防止在金属布线中发生短路， 温度处理。

公开(公告)号：US20150053886A1

公开(公告)日：2015-02-26

申请号：US14529014

申请日：2014-10-30

申请人： Simon Fraser University

发明人： Bonnie Gray ,  Daniel B. Lenzoff ,  Jasmine L. Korcok ,  Ajit Khosla

IPC分类号： H01F1/117 ,  H01F1/06

CPC分类号： H01F1/0551 ,  B82Y25/00 ,  C22C38/002 ,  C22C38/08 ,  G03F7/0047 ,  G03F7/0385 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38 ,  H01F1/0063 ,  H01F1/0571 ,  H01F1/0578 ,  H01F1/058 ,  H01F1/06 ,  H01F1/083 ,  H01F1/113 ,  H01F1/117 ,  H01F1/14733 ,  H01F1/14791 ,  H01F1/26 ,  H01F1/28

摘要： Compositions including hard magnetic photoresists, soft photoresists, hard magnetic elastomers and soft magnetic elastomers are provided.

摘要翻译： 提供包括硬磁性光致抗蚀剂，软光致抗蚀剂，硬磁性弹性体和软磁性弹性体的组合物。