公开(公告)号：US11767391B2

公开(公告)日：2023-09-26

申请号：US16887006

申请日：2020-05-29

申请人： NAN YA PLASTICS CORPORATION

发明人： Te-Chao Liao ,  Sen-Huang Hsu ,  Chung-Chi Su ,  Chuan Chou ,  Jui-Jung Lin

IPC分类号： C08F283/01 ,  C09D167/00 ,  C08G63/91 ,  C08G63/685 ,  C08G59/50 ,  C08G59/40 ,  C08G63/68 ,  C08G59/56 ,  C08G59/18 ,  C08G59/42 ,  C08K3/08 ,  C09D167/02 ,  C08L63/00 ,  C08L67/02 ,  C08L67/00 ,  C09D5/10 ,  C09D163/00 ,  C09D7/63

CPC分类号： C08F283/01 ,  C09D167/00 ,  C08G59/18 ,  C08G59/184 ,  C08G59/40 ,  C08G59/4014 ,  C08G59/42 ,  C08G59/4276 ,  C08G59/50 ,  C08G59/5013 ,  C08G59/56 ,  C08G63/68 ,  C08G63/685 ,  C08G63/6854 ,  C08G63/6856 ,  C08G63/91 ,  C08G63/914 ,  C08G63/916 ,  C08K2003/0812 ,  C08K2003/0893 ,  C08L63/00 ,  C08L67/00 ,  C08L67/02 ,  C09D5/10 ,  C09D5/103 ,  C09D5/106 ,  C09D7/63 ,  C09D163/00 ,  C09D167/02 ,  C09D163/00 ,  C08K3/08 ,  C08K5/06 ,  C08K5/5435

摘要： A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

公开(公告)号：US20230235164A1

公开(公告)日：2023-07-27

申请号：US18010803

申请日：2021-06-29

申请人： TOAGOSEI CO., LTD.

发明人： Yuko SUZUKI ,  Masashi YAMADA ,  Hiroyuki YAMAGA

IPC分类号： C08L63/00 ,  C08G59/40 ,  H01B3/40 ,  H01B7/282

CPC分类号： C08L63/00 ,  C08G59/40 ,  H01B3/40 ,  H01B7/282 ,  C08L2203/206 ,  H01B13/328

摘要： A sealing composition and a sealing method for a coated electric cable have excellent sealing performance even under conditions such as cooling-heating cycles or high temperature and humidity. The coated electric cable sealing composition is for sealing a core wires connection section formed by electrically connecting multiple core wires exposed from multiple coated electric wires, and features having a hardening time of 10 minutes or less at 130° C., and permeating to inside of the coated electric wires at a height of 5 mm or more at the time point of hardening while the exposed parts of the core wires including the core wires connection section and the boundary part between the coated parts and the exposed parts of the core wires are immersed perpendicularly in the coated electric cable sealing composition filled in a resin cap and the sealing composition is heated to be cured.

公开(公告)号：US20180327541A1

公开(公告)日：2018-11-15

申请号：US15527876

申请日：2015-11-10

申请人： DIC Corporation

发明人： Kazuo Arita ,  Tatsuya Okamoto

IPC分类号： C08G59/40 ,  C08G63/197 ,  H05K1/03

CPC分类号： C08G59/40 ,  C08G63/181 ,  C08G63/197 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/46 ,  H05K2201/012 ,  H05K2201/0145 ,  H01L2924/00

摘要： Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

公开(公告)号：US20180327265A1

公开(公告)日：2018-11-15

申请号：US16045714

申请日：2018-07-25

申请人： FUJIFILM Corporation

发明人： SEIICHI HITOMI ,  KEITA TAKAHASHI

IPC分类号： C01B21/064 ,  C01B21/068 ,  C08G18/76 ,  C08G59/40 ,  C08L61/06 ,  C08L61/34 ,  C01B35/14 ,  C08K3/38 ,  C08K9/06

CPC分类号： C01B21/064 ,  C01B21/06 ,  C01B21/068 ,  C01B21/072 ,  C01B35/14 ,  C08G18/76 ,  C08G59/40 ,  C08K3/38 ,  C08K9/04 ,  C08K9/06 ,  C08L61/06 ,  C08L61/34 ,  C08L101/02

摘要： According to the present invention, there are provided a surface-modified inorganic substance obtained by performing surface modification on a inorganic nitride by using an aldehyde compound such as a compound represented by General Formula I and a resin composition containing the surface-modified inorganic substance and a monomer having a group selected from the group consisting of an oxetanyl group, an oxiranyl group, and a (meth)acrylate group. By using the surface-modified inorganic substance or the resin composition, it is possible to provide a thermally conductive material having excellent thermal conductivity and a device having high durability. ZZ—XX—CHO  General Formula I (In the formula, ZZ represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, a (meth)acrylate group, and a hydrogen atom, and XX represents a divalent linking group.)

公开(公告)号：US20180215969A1

公开(公告)日：2018-08-02

申请号：US15878845

申请日：2018-01-24

申请人： DEXERIALS CORPORATION ,  KINKI UNIVERSITY

发明人： Hiroto Chiba ,  Tetsuya Abe ,  Sungkil Lee ,  Makiya Ito ,  Takeshi Endo

IPC分类号： C09J163/00 ,  C07D407/12

CPC分类号： C09J163/00 ,  C07D407/12 ,  C08G59/24 ,  C08G59/40 ,  C08G59/68

摘要： A fluorene derivative represented by General Formula (1) below. X1—Y—X2  General Formula (1) In the General Formula (1), X1 represents a cyclic carbonate group including a carbonate bond [—O—C(═O)—O—], X2 represents a cyclic carbonate group including a carbonate bond [—O—C(═O)—O—], and Y represents a bivalent group including a 9,9-bisaryl fluorene skeleton.

公开(公告)号：US20180215862A1

公开(公告)日：2018-08-02

申请号：US15910707

申请日：2018-03-02

申请人： MITSUBISHI CHEMICAL CORPORATION

发明人： Kazumasa OOTA

IPC分类号： C08G59/24 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  C07D303/27

CPC分类号： C08G59/245 ,  C07D301/28 ,  C07D303/27 ,  C07D303/28 ,  C08G59/063 ,  C08G59/40 ,  C08G59/621 ,  C08G59/688 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/025

摘要： The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.

公开(公告)号：US20180213635A1

公开(公告)日：2018-07-26

申请号：US15747714

申请日：2016-09-29

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Susumu Baba ,  Tatsushi Hayashi ,  Hiroshi Kouyanagi

IPC分类号： H05K1/02 ,  C08K3/013 ,  C08K3/36 ,  C08G59/40 ,  H05K1/03

CPC分类号： H05K1/024 ,  C08G59/40 ,  C08G59/4007 ,  C08K3/013 ,  C08K3/36 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  C09D163/00

摘要： Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa·s or less at 25° C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound.

公开(公告)号：US20180112029A1

公开(公告)日：2018-04-26

申请号：US15561851

申请日：2016-04-28

申请人： TDK CORPORATION

发明人： Takayoshi KUWAJIMA ,  Tsuyoshi SUGIYAMA

IPC分类号： C08G59/40 ,  C08K3/28 ,  C08K3/32 ,  C08K5/13 ,  C08K5/18 ,  C08L63/00

CPC分类号： C08G59/40 ,  C08G59/00 ,  C08G59/5033 ,  C08G59/621 ,  C08G65/00 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K3/28 ,  C08K3/32 ,  C08K5/13 ,  C08K5/18 ,  C08K2003/222 ,  C08K2003/282 ,  C08L63/00

摘要： A resin composition includes an epoxy compound, a triphenylbenzene compound, an inorganic particle including a magnesium oxide (MgO) or the like, and phosphorus (P). The triphenylbenzene compound is a compound that includes 1,3,5-triphenylbenzene as a skeleton, and that includes a reactive group introduced in the skeleton. A content (mass %) of the phosphorus expressed by (mass of the phosphorus/mass of nonvolatile content excluding the inorganic particle)×100 is from 0.5 mass % to 4.3 mass %.

公开(公告)号：US09955573B2

公开(公告)日：2018-04-24

申请号：US13980686

申请日：2012-01-18

申请人： Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi ,  Tetsuro Miyahira

发明人： Yoshihiro Kato ,  Takaaki Ogashiwa ,  Hiroshi Takahashi ,  Tetsuro Miyahira

IPC分类号： B32B27/38 ,  B32B15/08 ,  H05K1/03 ,  C08J5/24 ,  C08G59/40 ,  C08L63/00 ,  B32B5/02 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20

CPC分类号： H05K1/0373 ,  B32B5/024 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/05 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  C08G59/40 ,  C08J5/24 ,  C08K3/11 ,  C08L63/00 ,  H05K1/0366 ,  H05K2201/0209 ,  Y10T428/31529

摘要： It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

公开(公告)号：US09944760B2

公开(公告)日：2018-04-17

申请号：US15120482

申请日：2015-02-18

申请人： Shin-Etsu Chemical Co., Ltd. ,  Nippon Kayaku Kabushiki Kaisha

发明人： Toshio Shiobara ,  Junichi Sawada ,  Miyuki Wakao ,  Tsutomu Kashiwagi ,  Naofusa Miyagawa ,  Yoshihiro Kawada ,  Chie Sasaki ,  Naosuke Taniguchi

IPC分类号： C08G77/50 ,  C08G77/14 ,  C08G77/38 ,  C08G59/34 ,  C08G59/40 ,  C08G59/02 ,  C08G59/30 ,  C08G59/32 ,  C09J183/14 ,  C08G59/42 ,  C08G59/68 ,  C08G77/20

CPC分类号： C08G77/50 ,  C08G59/027 ,  C08G59/306 ,  C08G59/3281 ,  C08G59/34 ,  C08G59/40 ,  C08G59/4215 ,  C08G59/4276 ,  C08G59/4284 ,  C08G59/50 ,  C08G59/688 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C09J183/14 ,  C08K5/11 ,  C08K5/12 ,  C08K5/17

摘要： The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition.Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.