公开(公告)号：US20240301128A1

公开(公告)日：2024-09-12

申请号：US18565337

申请日：2022-06-22

Applicant: ADEKA CORPORATION

Inventor： Sho SUZUKI ,  Ippei OKANO ,  Ken-ichi TAMASO

IPC: C08G59/22 ,  C08G59/24 ,  C08G59/50 ,  C08G59/66

CPC classification number: C08G59/223 ,  C08G59/245 ,  C08G59/50 ,  C08G59/66

Abstract: An epoxy material that provides a cured product having a reduced modulus of elasticity and thereby maintaining reliability even under conditions of wide environmental variation. The epoxy resin composition provided includes (A) an epoxy compound A of formula (1) below, (B) phenyl glycidyl ether substituted with a C6-20 hydrocarbon group, and (C) a curing agent. In formula (1), R1 and R2 each independently represent C2-4 alkylene; R3 represents methylene or —C(CH3)2—; and a and b each independently represent a number of 1 to 10.

公开(公告)号：US20240254374A1

公开(公告)日：2024-08-01

申请号：US18560433

申请日：2022-05-03

Applicant: HENKEL IP & HOLDING GMBH

Inventor： Zhongwei Liu ,  Christopher Verosky ,  Kevin Welch ,  Daniel Yi ,  Chih-Min Cheng

IPC: C09J163/00 ,  C08G59/32 ,  C08G59/50 ,  C08G59/66

CPC classification number: C09J163/00 ,  C08G59/32 ,  C08G59/50 ,  C08G59/66

Abstract: The present disclosure relates generally to two part adhesive compositions comprising a resin part including a curable resin selected from multifunctional, hydroxyl di-terminated polymer having alkene segments and epoxide segments in the polymer chain; an epoxy di-terminated block copolymer having siloxane moieties and bisphenol A moieties in the backbone and combination thereof and a hardener part including a curative for the curable resin. When mixed the compositions cure to a form that provides hardness but relatively low bond strength to a substrate and which can be removed from metal and other surfaces easily and simply with little residue.

公开(公告)号：US12024645B2

公开(公告)日：2024-07-02

申请号：US18456014

申请日：2023-08-25

Applicant: PRC-DeSoto International, Inc.

Inventor： Didier Labouche ,  Marie-Noelle Maillet ,  Siamanto Abrami

IPC: C09D5/00 ,  C08G59/40 ,  C08G59/50 ,  C08K3/22 ,  C08K5/548 ,  C09D5/08 ,  C09D7/40 ,  C09D7/61 ,  C09D163/00

CPC classification number: C09D5/002 ,  C08G59/4085 ,  C08G59/50 ,  C08K3/22 ,  C08K5/548 ,  C09D5/08 ,  C09D5/082 ,  C09D5/084 ,  C09D7/40 ,  C09D7/61 ,  C09D163/00 ,  C08G2150/90 ,  C08K2003/222 ,  C08K2201/019 ,  Y10T428/31529 ,  C09D163/00 ,  C08K3/22

Abstract: A coating comprising epoxy functional resin, corrosion resistant particles, and a multi-functional crosslinker are disclosed as are methods of using such a coating to coat at least a portion of a substrate and a substrate coated thereby.

公开(公告)号：US11884782B2

公开(公告)日：2024-01-30

申请号：US17440023

申请日：2020-03-18

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Hiroyuki Morita ,  Takeshi Wakiya

IPC: C08L101/12 ,  C08J3/12 ,  C08G59/50 ,  C08K3/08 ,  C08L63/00 ,  H01B1/22 ,  H01R11/01

CPC classification number: C08J3/12 ,  C08G59/50 ,  C08K3/08 ,  C08L63/00 ,  H01B1/22 ,  H01R11/01 ,  C08K2003/0862

Abstract: Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.

公开(公告)号：US11820858B2

公开(公告)日：2023-11-21

申请号：US16768407

申请日：2018-11-28

Applicant: TEIJIN LIMITED

Inventor： Akimichi Oda ,  Hiroaki Kuwahara ,  Hironori Kawamoto

IPC: C08G59/50 ,  C08J5/24

CPC classification number: C08G59/50 ,  C08J5/243 ,  C08J2363/00 ,  C08J2377/00 ,  C08J2381/06

Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.

公开(公告)号：US20230313001A1

公开(公告)日：2023-10-05

申请号：US17772436

申请日：2020-10-30

Applicant: CYTEC INDUSTRIES INC.

Inventor： Yiqiang ZHAO ,  Dalip K. KOHLI

IPC: C09J163/00 ,  C09J5/02 ,  C08G59/50 ,  C09J7/50

CPC classification number: C09J163/00 ,  C09J5/02 ,  C08G59/50 ,  C09J7/50 ,  C09J2400/166 ,  C09J2463/003 ,  C09J2400/163

Abstract: Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer size, submicron or micron size. Also disclosed is a method of applying the solvent-based bonding primer composition onto a metallic surface of a first substrate prior to bonding the metallic surface to a second substrate via a curable adhesive.

公开(公告)号：US11702516B2

公开(公告)日：2023-07-18

申请号：US16769762

申请日：2018-12-20

Applicant: HEXCEL COMPOSITES LIMITED

Inventor： David Allan Tilbrook ,  Christopher Robert Mason ,  Martin Richard Simmons

IPC: C08J3/24 ,  C08G59/50 ,  C08K9/10 ,  C08L63/00 ,  C08J5/24 ,  C08K5/3445 ,  C08K5/13 ,  C08K5/09

CPC classification number: C08J3/241 ,  C08G59/50 ,  C08J5/243 ,  C08K5/09 ,  C08K5/13 ,  C08K5/3445 ,  C08K9/10 ,  C08L63/00 ,  C08J2363/00

Abstract: This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

公开(公告)号：US20230183415A1

公开(公告)日：2023-06-15

申请号：US17925014

申请日：2021-05-13

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Ning TANG ,  Shingo TANAKA ,  Yoshitaka TAKEZAWA

IPC: C08G59/24 ,  C08G59/62 ,  C09K19/30 ,  C08G59/50 ,  H01L23/373

CPC classification number: C08G59/245 ,  C08G59/62 ,  C09K19/3068 ,  C08G59/50 ,  H01L23/3737 ,  C09K2019/3075

Abstract: A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.

公开(公告)号：US20230159694A1

公开(公告)日：2023-05-25

申请号：US17614515

申请日：2021-09-17

Applicant: State Grid Liaoning Shenyang Electric Power Supply Company ,  State Grid Corporation of China

Inventor： Changlong Yang ,  Mingjie Ju ,  Bo Hu ,  Shuwen Zheng ,  Yuansheng Ma ,  Yang Zheng ,  Dazhong Wang ,  Junlong Duo ,  Rongzhen Xia

IPC: C08G59/22 ,  C08G59/14 ,  C08G59/50 ,  C09D5/08 ,  C09D163/00

CPC classification number: C08G59/22 ,  C08G59/1477 ,  C08G59/50 ,  C09D5/08 ,  C09D163/00 ,  C08G2150/90

Abstract: The present disclosure discloses a waterborne epoxy resin for an anti-corrosion coating, and a preparation method and use thereof. In the preparation method, a strongly-hydrophilic polyethylene glycol (PEG) branch is introduced into a molecular chain of epoxy resin to realize the self-emulsification function of epoxy resin. Moreover, due to the short molecular chain, a solid content can reach up to 66.7% under the action of PEG. In addition, the waterborne emulsion can be prepared without adding any additional alcohol-soluble solvents and other high-boiling-point organic solvents, and a production process and a product use process both are very environmentally friendly. The waterborne epoxy resin can be mixed with a waterborne ammonia curing agent to form a film for corrosion protection.

公开(公告)号：US20190233633A1

公开(公告)日：2019-08-01

申请号：US16339161

申请日：2017-10-12

Applicant: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.

Inventor： Yuichi TANIGUCHI ,  Kyohei KANO

IPC: C08L33/08 ,  C08K5/13 ,  C08K5/17 ,  C08L33/10 ,  C08L63/00 ,  B29C70/48

CPC classification number: C08L33/08 ,  B29C39/10 ,  B29C70/48 ,  C08G59/50 ,  C08K5/103 ,  C08K5/13 ,  C08K5/17 ,  C08L33/10 ,  C08L63/00 ,  C08L2312/00

Abstract: Provided is a resin composition that exhibits satisfactory impregnability into reinforcing fibers, while having rapid curability, and that is suitable for fiber-reinforced composite materials producing molded articles having high heat resistance. A two-pack resin composition for fiber-reinforced composite materials is configured of a base material including an epoxy resin (A) and a (meth)acrylate compound (B) having three or more (meth) acryloyl groups in a molecule, and a curing agent including an amine compound (C) represented by the following general formula (1), a mass ratio of the base material to the curing agent being within the range of from 35:15 to 65:35, Wherein the epoxy resin (A) includes 75% by mass to 100% by mass of a bisphenol A epoxy resin; the base material has a viscosity of 10,000 mPa·s or less; and the curing agent has a viscosity of 800 mPa·s or less. X—(CH2NH2)n (1) (In the formula, X represents an n-valent organic group having 1 to 16 carbon atom; and n represents 2 or 3).