公开(公告)号：US11884773B2

公开(公告)日：2024-01-30

申请号：US17415141

申请日：2019-12-09

申请人： NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. ,  KUKDO CHEMICAL CO., LTD.

发明人： Masahiro Soh ,  Kazuo Ishihara ,  Jin Soo Lee ,  Jae Il Kim ,  Joong Hwi Jee ,  Ki Hwan Yu

IPC分类号： C08G61/02 ,  C08G59/02 ,  C08G59/62 ,  C08J5/24 ,  C08G59/06 ,  C08G59/32 ,  C08L65/00 ,  C08G59/08 ,  B32B27/20 ,  B32B27/38 ,  H05K1/03

CPC分类号： C08G61/02 ,  C08G59/02 ,  C08G59/62 ,  C08J5/244 ,  C08J5/249

摘要： Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below.




In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

公开(公告)号：US20230151139A1

公开(公告)日：2023-05-18

申请号：US17992971

申请日：2022-11-23

申请人： Huntsman Petrochemical LLC

发明人： Wei-Yang Su ,  Hui Zhou

IPC分类号： C08G59/56 ,  C08G59/24 ,  C08G59/50 ,  C08G59/62

CPC分类号： C08G59/56 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/5046 ,  C08G59/62

摘要： The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

公开(公告)号：US20180126701A1

公开(公告)日：2018-05-10

申请号：US15529335

申请日：2016-09-08

申请人： Shengyi Technology Co., Ltd.

发明人： Jiang YOU ,  Tianhui HUANG ,  Yongjing XU ,  Zhongqiang YANG

IPC分类号： B32B15/092 ,  C08L63/00 ,  B32B27/18 ,  C08K3/36 ,  C08K5/357 ,  C08G59/62 ,  C08G59/32

CPC分类号： B32B15/092 ,  B32B27/18 ,  B32B33/00 ,  C08G59/32 ,  C08G59/62 ,  C08J2300/24 ,  C08K3/36 ,  C08K5/357 ,  C08L63/00

摘要： The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.

公开(公告)号：US20180105674A1

公开(公告)日：2018-04-19

申请号：US15561741

申请日：2016-04-28

申请人： TDK CORPORATION

发明人： Hiroshi SHUTOH ,  Masaaki YAMASHITA ,  Tsuyoshi SUGIYAMA

IPC分类号： C08K5/13 ,  C08L63/00 ,  C08G59/62

CPC分类号： C08K5/13 ,  B32B27/38 ,  C07C39/15 ,  C08G59/62 ,  C08L63/00

摘要： A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)×100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.

公开(公告)号：US20180094176A1

公开(公告)日：2018-04-05

申请号：US15564890

申请日：2016-04-08

申请人： Kaneka Corporation

发明人： Toshihiko Okamoto ,  Shohei Nishimori

IPC分类号： C09J163/00 ,  C09J11/08 ,  C09J175/08 ,  C08L63/00 ,  C08L51/04 ,  C08G59/62 ,  C08G18/80 ,  C08G18/58

CPC分类号： C09J163/00 ,  C08G18/58 ,  C08G18/80 ,  C08G59/62 ,  C08L51/04 ,  C08L63/00 ,  C08L75/04 ,  C09J11/08 ,  C09J175/04 ,  C09J175/08

摘要： The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.

公开(公告)号：US20170158829A1

公开(公告)日：2017-06-08

申请号：US15327099

申请日：2015-07-03

申请人： Toray Industries, Inc.

发明人： Kazunori Hondo ,  Nobuyuki Tomioka

IPC分类号： C08J5/04 ,  C08G59/32 ,  C08G59/50 ,  C08J5/24

CPC分类号： C08J5/04 ,  C08G59/3227 ,  C08G59/5033 ,  C08G59/56 ,  C08G59/62 ,  C08G59/621 ,  C08J5/042 ,  C08J5/24 ,  C08J2363/00

摘要： A two-pack type epoxy resin composition for a fiber-reinforced composite material, includes the following components (A) to (C), the epoxy resin composition having: an epoxy base resin liquid containing 30 mass % or more and 100 mass % or less of a component (A) and a curing agent liquid containing a component (B). The component (A) is a glycidylamine type epoxy resin; the component (B) is an aromatic amine; and the component (C) is a compound having at least two aromatic rings each of which has a phenolic hydroxy group.

公开(公告)号：US09605192B2

公开(公告)日：2017-03-28

申请号：US14558087

申请日：2014-12-02

申请人： Auto Chemical Industry Co., Ltd.

发明人： Sou Saitou ,  Shinichi Iwase ,  Atsuhiko Umezawa

IPC分类号： C09J187/00 ,  C08G81/02 ,  C08G18/48 ,  C08G18/75 ,  C09J163/00 ,  C09J175/04 ,  C09J123/00 ,  C08L23/08 ,  C08L75/04

CPC分类号： C09J187/005 ,  C08G18/4854 ,  C08G18/755 ,  C08G59/32 ,  C08G59/62 ,  C08G65/3331 ,  C08G81/024 ,  C08G2170/80 ,  C08L23/0869 ,  C08L75/04 ,  C08L2201/54 ,  C09J123/00 ,  C09J163/00 ,  C09J175/04 ,  C08G18/10 ,  C08G18/348 ,  C08G18/3234 ,  C08G18/3271 ,  C08L51/06

摘要： An adhesive composition contains a polyurethane-polyolefin complex composed of a polyurethane having a first functional group and a polyolefin having a second functional group that reacts with the first functional group. The polyurethane and the polyolefin is bound by a reaction between the first functional group and the second functional group.

公开(公告)号：US09527951B2

公开(公告)日：2016-12-27

申请号：US15162132

申请日：2016-05-23

申请人： Blue Cube IP LLC

发明人： Joseph Gan ,  Carola Rosenthal ,  Matthieu M. Eckert ,  Bernhard Kainz ,  Emile C. Trottier

IPC分类号： C09D5/03 ,  C08G65/26 ,  C08G59/62 ,  C08G59/18 ,  C08G59/00 ,  C09D163/00 ,  C08G18/64 ,  C08G59/64 ,  C08L63/00 ,  C08G59/14 ,  C08G59/24

CPC分类号： C08G59/62 ,  C08G18/643 ,  C08G59/00 ,  C08G59/1477 ,  C08G59/184 ,  C08G59/245 ,  C08G59/64 ,  C08L63/00 ,  C09D5/03 ,  C09D163/00

摘要： An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

公开(公告)号：US20160264719A1

公开(公告)日：2016-09-15

申请号：US15162132

申请日：2016-05-23

申请人： Blue Cube IP LLC

发明人： Joseph Gan ,  Carola Rosenthal ,  Matthieu M. Eckert ,  Bernhard Kainz ,  Emile C. Trottier

IPC分类号： C08G59/62 ,  C09D5/03 ,  C09D163/00 ,  C08G59/24

CPC分类号： C08G59/62 ,  C08G18/643 ,  C08G59/00 ,  C08G59/1477 ,  C08G59/184 ,  C08G59/245 ,  C08G59/64 ,  C08L63/00 ,  C09D5/03 ,  C09D163/00

摘要： An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

公开(公告)号：US20150337077A1

公开(公告)日：2015-11-26

申请号：US14655161

申请日：2013-12-25

申请人： CENTRAL GLASS COMPANY, LIMITED

发明人： Junya NAKATSUJI ,  Kazuhiro YAMANAKA

IPC分类号： C08G61/12 ,  C09D163/00

CPC分类号： C08G61/128 ,  C08G8/14 ,  C08G16/0225 ,  C08G59/3218 ,  C08G59/62 ,  C08G59/621 ,  C08L61/00 ,  C08L61/06 ,  C09D161/00 ,  C09D161/06 ,  C09D163/00 ,  G03F7/0046 ,  G03F7/038 ,  H05K3/287 ,  C08L63/00

摘要： Disclosed is a novolak resin containing a repeating unit represented by the general formula (1). R1is a hydrogen atom or an alkyl group which is C1-4 straight-chain or C3-4 branched-chain, and some or all hydrogen atoms in the alkyl group may be replaced with a fluorine atom; R2 is a hydrogen atom, a phenyl group, an alkyl group which is C1-10 straight-chain or C3-10 branched-chain, or an alkyl group having a C3-10 cyclic structure, and some or all hydrogen atoms in the phenyl group and the alkyl group may be replaced with fluorine atoms; each of a and b is independently an integer of 1-3, and these are defined as 2≦a+b≦4; and d is an integer of 0-2. This novolak resin has high dissolution rate in the alkaline development solution in addition to the heat resisting property which is a property of phenolic resin.

摘要翻译： 公开了含有由通式（1）表示的重复单元的酚醛清漆树脂。 R1为氢原子或碳原子数为1-4的直链或支链的烷基，烷基中的一部分或全部氢原子可被氟原子取代; R 2是氢原子，苯基，C 1-10直链或支链C 3-10的烷基或具有C 3-10环状结构的烷基，苯基中的一些或全部氢原子 烷基可以被氟原子取代; a和b中的每一个独立地为1-3的整数，并且它们被定义为2＆nlE; a + b＆nlE; 4; d为0-2的整数。 该酚醛清漆树脂除了作为酚醛树脂的性能的耐热性以外，在碱性显影液中的溶解速度高。