Abstract:
The present disclosure belongs to polymercaptan compounds and application fields thereof, and particularly relates to a polymercaptan compound and a preparation method thereof, a curing agent, a resin composition, an adhesive and a sealant. The polymercaptan compound is represented by formula (I), wherein R1, R2, R3, R5, R7 and R8 are each independently selected from one of a hydrogen atom, an alkyl group with 1-5 carbon atoms and an alkoxy group with 1-5 carbon atoms, R4 and R6 are each independently selected from an alkylene group with 1-5 carbon atoms, and m and n are each independently 0, 1, 2 or 3.
Abstract:
Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.
Abstract:
Methods of additive manufacture using coreactive components are disclosed. Thermosetting compositions for additive manufacturing are also disclosed.
Abstract:
The present invention relates to a compound represented by the general formula (A), a base- and/or radical-generating agent comprising the compound, and so on. In the formula, four pieces of R1 each independently represents a hydrogen atom or a fluorine atom; four pieces of R2 each independently represent a fluorine atom or a trifluoromethyl group; R3, R6, R7 and R10 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R4 and R5 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, or R4 and R5 are bonded to each other to represent an alkylene group having 2 to 4 carbon atoms; and R8 and R9 each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aryl group having 6 to 14 carbon atoms and optionally having a substituent selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, an alkylthio group having 1 to 6 carbon atoms, a dialkylamino group having 2 to 12 carbon atoms, a halogen atom, and a nitro group, or R8 and R9 are bonded to each other to represent an alkylene group having 2 to 4 carbon atoms; provided that two or three of the eight groups R3 to R10 are each a hydrogen atom, and, in a case where two of the eight groups are each a hydrogen atom, then three to six of the remaining groups are each an alkyl group having 1 to 12 carbon atoms, and, in a case where three of the eight groups are each a hydrogen atom, then four or five of the remaining groups are each an alkyl group having 1 to 12 carbon atoms.
Abstract:
The present invention provides a resin composition that is thermally curable at a temperature of approximately 80° C., excellent in PCT tolerance, and, therefore, suitable as a one-component adhesive to be used during manufacture of image sensor modules or electronic components. The resin composition contains (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent. The compound of the (B) component has a content of 1:0.3 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 60 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.
Abstract:
A method of making a polymer network. The method includes providing a composition including a polythiol having more than one thiol group and a polyepoxide having more than one epoxide group, applying a solution including a photolatent base catalyst to a surface of the composition, and subsequently exposing the composition to light. Upon exposure to light, the photolatent base catalyst photochemically generates a first amine and at least partially cures at least the surface of the composition to form the polymer network.
Abstract:
A curable organopolysiloxane composition comprises: (A) an epoxy group-containing organopolysiloxane represented by the average composition formula: XaR1bSiO(4-a-b)/2 wherein X represents at least one type of epoxy group selected from a glycidoxyalky group, an epoxycycloalkyl alkyl group, and an epoxyalkyl group; R1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group,a hydroxyl group, or an alkoxy group; provided at least two X groups are present in a molecule; and “a” and “b” are numbers satisfying: 0
Abstract:
An adhesive composition for polarizing plates, a polarizing plate using the same, and an optical member including the same, the adhesive composition including an epoxy compound, a (meth)acrylic compound, and a polyfunctional thiol compound.
Abstract:
Provided is a liquid jet head, including a flow path including a first member, a resin layer, and a second member, wherein the resin layer contains a cured product of a resin composition containing an epoxy compound represented by General Formula (1), a polythiol compound having 2 or more thiol groups in a molecule thereof, and a specific imidazole compound, where in General Formula (1), L is an integer of 0 or greater but less than 3, m is a positive number of 0.1 or greater but less than 50, R1 represents any one of a hydrogen atom, and an alkyl group having 1 to 4 carbon atoms, and R2 represents a substituent represented by a formula below where R3 and R4 each represent any one of hydrogen atom, and a non-substituted or fluorine-substituted methyl group, and n is an integer of 4 to 12.
Abstract:
Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.