公开(公告)号：US11965060B2

公开(公告)日：2024-04-23

申请号：US17533359

申请日：2021-11-23

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yoshito Tanaka ,  Tomohiro Yoshida

IPC: C08G59/30 ,  B32B27/38 ,  C08G59/24 ,  C08G59/50 ,  C08L63/00 ,  C09D163/00 ,  H05K1/03 ,  C09J163/00

CPC classification number: C08G59/308 ,  C08G59/245 ,  C08G59/5073 ,  H05K1/034

Abstract: A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being:




the formula (E1) being:





the formula (E2) being:





the formula (E3) being:





Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.

公开(公告)号：US20240109869A1

公开(公告)日：2024-04-04

申请号：US18262337

申请日：2022-01-25

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Yasuyuki MORI ,  Ippei OKANO ,  Ryo OGAWA ,  Junji UEYAMA

IPC: C07D403/06 ,  C08G59/50 ,  H01B1/12

CPC classification number: C07D403/06 ,  C08G59/5073 ,  H01B1/121

Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.

公开(公告)号：US10050224B2

公开(公告)日：2018-08-14

申请号：US15446887

申请日：2017-03-01

Applicant: MITSUI CHEMICALS, INC.

Inventor： Yugo Yamamoto ,  Setsuko Oike ,  Masatoshi Takagi

IPC: C08L63/00 ,  H01L51/52 ,  H01L27/32 ,  C09J163/00 ,  H01L51/56 ,  B32B15/08 ,  B32B15/20 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B27/40 ,  C08G59/24 ,  C08G59/50 ,  C08G59/56 ,  H01L51/00

CPC classification number: H01L51/5246 ,  B32B15/08 ,  B32B15/20 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2255/06 ,  B32B2274/00 ,  B32B2307/412 ,  B32B2307/51 ,  B32B2457/20 ,  C08G59/245 ,  C08G59/5073 ,  C08G59/56 ,  C08L63/00 ,  C08L2205/03 ,  C09J163/00 ,  H01L27/32 ,  H01L51/0035 ,  H01L51/56

Abstract: The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G′(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×103 and 2.0×106 Pa.

公开(公告)号：US09752066B2

公开(公告)日：2017-09-05

申请号：US15035787

申请日：2014-11-17

Applicant: Rohm and Haas Company ,  Dow Global Technologies LLC

Inventor： Joseph J. Zupancic ,  Amira A. Marine ,  David E. Vietti ,  Daniele Vinci

IPC: C09J167/02 ,  C08G59/12 ,  C08G59/40 ,  C08G59/50

CPC classification number: C09J167/025 ,  C08G59/04 ,  C08G59/12 ,  C08G59/40 ,  C08G59/50 ,  C08G59/5013 ,  C08G59/5073 ,  C09J163/00

Abstract: Provided is a two-part composition comprising A) An epoxy terminated polyester having the structure wherein R1— is G- is j is 0 to 5, —R2— is a divalent organic group, —R22— is a divalent alkyl group, and —R22— is a divalent alkyl group, and B) one or more epoxy curing agent, each molecule of which comprises two or more active hydrogen atoms that are each capable of reacting with an epoxy group.

公开(公告)号：US09738750B2

公开(公告)日：2017-08-22

申请号：US13857265

申请日：2013-04-05

Applicant: EVONIK DEGUSSA GMBH

Inventor： Gauri Sankar Lal ,  Gamini Ananda Vedage ,  Stephen Michael Boyce ,  Dilipkumar Nandlal Shah ,  Atteye Houssein Abdourazak

IPC: C08G59/50 ,  C08G59/56

CPC classification number: C08G59/56 ,  C08G59/02 ,  C08G59/42 ,  C08G59/506 ,  C08G59/5073 ,  C08G59/686

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

公开(公告)号：US09659883B2

公开(公告)日：2017-05-23

申请号：US15023501

申请日：2014-09-09

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke Morita ,  Tsuyoshi Ishizaka ,  Eiji Toyoda ,  Goji Shiga ,  Chie Iino ,  Jun Ishii

IPC: H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/29 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L23/562 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C09J163/00 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/147 ,  H01L23/295 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92125 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08K3/36

Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E′ [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30≦Ea≦120 [kJ/mol]  (1); and 10,000≦α×E′≦300,000 [Pa/K]  (2).

公开(公告)号：US09656977B2

公开(公告)日：2017-05-23

申请号：US14432870

申请日：2013-10-22

Applicant: Dow Global Technologies LLC

Inventor： Eric B. Ripplinger ,  Rajesh H. Turakhia

IPC: C07D233/24 ,  C07D295/13 ,  C08G59/14 ,  C08G59/50 ,  C08G69/34 ,  C08G73/02 ,  C08G73/06 ,  C09D163/00 ,  C09J163/00 ,  C08L63/00 ,  C08L77/08 ,  C08L79/02 ,  C08L79/04 ,  C08G59/44

CPC classification number: C07D295/13 ,  C07D233/24 ,  C08G59/1477 ,  C08G59/44 ,  C08G59/5073 ,  C08G69/34 ,  C08G73/0273 ,  C08G73/028 ,  C08G73/0633 ,  C08L63/00 ,  C08L77/08 ,  C08L79/02 ,  C08L79/04 ,  C09D163/00 ,  C09J163/00

Abstract: A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.

公开(公告)号：US20170114180A1

公开(公告)日：2017-04-27

申请号：US15308940

申请日：2015-07-14

Applicant: Dow Global Technologies LLC

Inventor： Sergio Grunder ,  Timothy A. Morley ,  Rainer Koeniger ,  Nebojsa Jelic

IPC: C08G59/68 ,  C08J5/04 ,  C08G59/14 ,  C08G59/50 ,  C08K7/02 ,  C08G59/24

CPC classification number: C08G59/685 ,  B62D29/04 ,  C08G59/1477 ,  C08G59/245 ,  C08G59/502 ,  C08G59/5073 ,  C08G59/68 ,  C08J5/04 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08K7/02 ,  C08L63/00

Abstract: The invention relates to curable epoxy resin systems comprising polyethylene tetraamine and a tin catalyst as hardening agents, and optionally comprising 1,4-diaza[2.2.2]bicyclo octane. The invention also relates to articles made therefrom, including composites such as carbon fiber reinforced composites. The curable epoxy resins have rapid demold times and/or high glass temperature.

公开(公告)号：US20170043580A1

公开(公告)日：2017-02-16

申请号：US15305723

申请日：2015-05-19

Applicant: Daisuke TAKAGI ,  Hisashi HABASHI ,  Tomoyuki ARATANI ,  Tatsuya SAMESHIMA ,  Ryo OGAWA ,  Takuya MATSUDA

Inventor： Daisuke TAKAGI ,  Hisashi HABASHI ,  Tomoyuki ARATANI ,  Tatsuya SAMESHIMA ,  Ryo OGAWA ,  Takuya MATSUDA

IPC: B41J2/14

CPC classification number: B41J2/1433 ,  B41J2/14274 ,  B41J2/1606 ,  B41J2202/03 ,  C08G59/245 ,  C08G59/5073 ,  C08G59/66

Abstract: Provided is a liquid jet head, including a flow path including a first member, a resin layer, and a second member, wherein the resin layer contains a cured product of a resin composition containing an epoxy compound represented by General Formula (1), a polythiol compound having 2 or more thiol groups in a molecule thereof, and a specific imidazole compound, where in General Formula (1), L is an integer of 0 or greater but less than 3, m is a positive number of 0.1 or greater but less than 50, R1 represents any one of a hydrogen atom, and an alkyl group having 1 to 4 carbon atoms, and R2 represents a substituent represented by a formula below where R3 and R4 each represent any one of hydrogen atom, and a non-substituted or fluorine-substituted methyl group, and n is an integer of 4 to 12.

Abstract translation: 提供一种液体喷射头，其包括具有第一部件，树脂层和第二部件的流路，其中，所述树脂层含有含有通式（1）表示的环氧化合物的树脂组合物的固化物， 分子中具有2个以上硫醇基的多硫醇化合物和特定的咪唑化合物，通式（1）中，L为0以上且小于3的整数，m为0.1以上的正数，但为0.1以上的正数 小于50，R 1表示氢原子和具有1〜4个碳原子的烷基中的任一个，R 2表示下式所示的取代基，其中，R 3和R 4各自表示氢原子， 取代或氟取代的甲基，n为4〜12的整数。

公开(公告)号：US20170029556A1

公开(公告)日：2017-02-02

申请号：US15106916

申请日：2013-12-23

Applicant: BLUE CUBE IP LLC

Inventor： Yue Shen ,  Fu Zhan ,  Yan Wu ,  Ray E. Drumright

IPC: C08G59/32 ,  C08G59/50 ,  C08G59/68 ,  C09D163/00

CPC classification number: C08G59/3218 ,  C08G59/066 ,  C08G59/50 ,  C08G59/5073 ,  C08G59/688 ,  C09D163/00

Abstract: An epoxy resin composition having desirable drying time and capable of providing coating films with satisfactory weathering resistance, good adhesion to an epoxy primer coat and good flexibility, and high impact strength; a process for preparing the epoxy resin composition; and a curable coating composition comprising the epoxy resin composition.

Abstract translation: 环氧树脂组合物具有理想的干燥时间并且能够提供具有令人满意的耐候性，对环氧底漆涂料的良好粘附性和良好的柔韧性以及高冲击强度的涂膜; 环氧树脂组合物的制备方法; 和包含环氧树脂组合物的可固化涂料组合物。