Abstract:
An epoxy resin composition excellent in storage stability and curability is provided. Particularly, a compound of general formula (I) and an epoxy resin composition containing the compound as a curing agent are provided. In formula (I), R1 is a hydrocarbon group optionally containing a nitrogen atom and capable of forming a cyclic structure optionally having a substituent; R2 is a hydrogen atom, an alkyl group, or an aryl group or is taken together with R1 to form an unsaturated bond; R3 is a hydrogen atom, an alkyl group, or an aryl group; and X is a dicyanamide ion or a thiocyanate ion.
Abstract:
A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.
Abstract:
A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.
Abstract:
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.
Abstract:
Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R1, R2, R3, and R4 are each hydrogen, alkyl, or aryl; R5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.
Abstract:
The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; R1 and R2 independently represent a hydrogen atom, an alkyl group or an aryl group; R3 represents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or —NR4—; and R4 represents a hydrogen atom, an alkyl group or an aryl group.)
Abstract:
Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.