A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being:




the formula (E1) being:





the formula (E2) being:





the formula (E3) being:





Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.