公开(公告)号：US10035874B2

公开(公告)日：2018-07-31

申请号：US14797378

申请日：2015-07-13

Applicant: EVONIK DEGUSSA GMBH

Inventor： Gauri Sankar Lal ,  Stephen Michael Boyce ,  Dilipkumar Nandlal Shah ,  Pritesh G. Patel

IPC: C08G59/50 ,  C08G59/42 ,  C08G59/22 ,  F16L55/162 ,  B05D3/02 ,  C09D163/00 ,  C08G59/24 ,  B05D7/22

CPC classification number: C08G59/506 ,  B05D3/0254 ,  B05D7/225 ,  C08G59/22 ,  C08G59/245 ,  C08G59/4207 ,  C08G59/5026 ,  C09D163/00 ,  F16L55/162

Abstract: An epoxide based composition that can be cured at a temperature of less than about 70 C is disclosed. The composition is a liquid at ambient conditions and, therefore, can be used to rehabilitate the interior surfaces of pipelines. The epoxide-based composition comprises at least one epoxide component (component A) and at least one curing agent component (component B) wherein (A) the epoxide component comprises a phenyl glycidyl ether polyepoxide; and (B) the curing agent component comprises a mixture of two salt compounds formed, respectively, from an N-alkanol piperidine and a carboxylic acid bearing 7-12 carbon atoms, and N-cyclohexyl-N,N-dialkyl amine and a carboxylic acid bearing 7-12 carbon atoms.

公开(公告)号：US09738750B2

公开(公告)日：2017-08-22

申请号：US13857265

申请日：2013-04-05

Applicant: EVONIK DEGUSSA GMBH

Inventor： Gauri Sankar Lal ,  Gamini Ananda Vedage ,  Stephen Michael Boyce ,  Dilipkumar Nandlal Shah ,  Atteye Houssein Abdourazak

IPC: C08G59/50 ,  C08G59/56

CPC classification number: C08G59/56 ,  C08G59/02 ,  C08G59/42 ,  C08G59/506 ,  C08G59/5073 ,  C08G59/686

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

公开(公告)号：US10017603B2

公开(公告)日：2018-07-10

申请号：US15682306

申请日：2017-08-21

Applicant: EVONIK DEGUSSA GMBH

Inventor： Gauri Sankar Lal ,  Gamini Ananda Vedage ,  Stephen Michael Boyce ,  Dilipkumar Nandlal Shah ,  Atteye Houssein Abdourazak

IPC: C08G59/56 ,  C08G59/50 ,  C08G59/02

CPC classification number: C08G59/56 ,  C08G59/02 ,  C08G59/42 ,  C08G59/506 ,  C08G59/5073 ,  C08G59/686

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

公开(公告)号：US20170342197A1

公开(公告)日：2017-11-30

申请号：US15682306

申请日：2017-08-21

Applicant: EVONIK DEGUSSA GMBH

Inventor： Gauri Sankar Lal ,  Gamini Ananda Vedage ,  Stephen Michael Boyce ,  Dilipkumar Nandlal Shah ,  Atteye Houssein Abdourazak

IPC: C08G59/56 ,  C08G59/50

CPC classification number: C08G59/56 ,  C08G59/02 ,  C08G59/42 ,  C08G59/506 ,  C08G59/5073 ,  C08G59/686

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.