公开(公告)号：US09999126B2

公开(公告)日：2018-06-12

申请号：US15525442

申请日：2016-01-29

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Takashi Kobayashi ,  Kentaro Takano

IPC分类号： B32B27/38 ,  B32B15/08 ,  H05K1/03 ,  B32B15/092 ,  C08J5/24 ,  C08G8/28 ,  C08G59/40 ,  C08K3/36

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  C08G8/28 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/04 ,  C08K3/36 ,  C08K5/315 ,  C08K5/3415 ,  C08L61/04 ,  C08L61/14 ,  C08L63/00

摘要： The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B).

公开(公告)号：US09822227B2

公开(公告)日：2017-11-21

申请号：US14743093

申请日：2015-06-18

申请人： Isola USA Corp.

发明人： David Bedner ,  Tarun Amla

IPC分类号： C08J5/24 ,  H05K1/03 ,  H05K3/00 ,  C09D163/00 ,  C09D7/12 ,  C09D163/04 ,  H05K1/18 ,  B32B15/092 ,  B32B15/20 ,  C08G59/32 ,  C08G59/50 ,  C08L63/00 ,  C08L63/04 ,  C09J163/00 ,  C09J163/04

CPC分类号： C08J5/24 ,  C08G59/5033 ,  C08G59/504 ,  C08J2363/04 ,  C08J2463/00 ,  C08L63/00 ,  C08L63/04 ,  C09D163/00 ,  C09D163/04 ,  C09J163/00 ,  C09J163/04 ,  H05K1/0326 ,  H05K1/0373 ,  H05K3/00

摘要： Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

公开(公告)号：US09738774B2

公开(公告)日：2017-08-22

申请号：US15040100

申请日：2016-02-10

申请人： ICL-IP America Inc.

发明人： Andrew M. Piotrowski ,  Mayank P. Singh ,  Kali A. Suryadevara ,  Mariya Kozytska ,  Yossi Zilberman

IPC分类号： B32B9/04 ,  C08K5/5313 ,  C07F9/6571 ,  C08J5/24 ,  C08G59/40 ,  B32B15/20 ,  H05K1/03 ,  B32B37/10 ,  C08G59/62 ,  C08G59/68 ,  C08L63/04 ,  B32B5/26 ,  B32B7/12 ,  B32B15/08 ,  B32B27/06 ,  B32B37/06

CPC分类号： C08K5/5313 ,  B32B5/26 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B37/06 ,  B32B37/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2309/125 ,  B32B2311/12 ,  B32B2457/08 ,  C07F9/657172 ,  C07F9/657181 ,  C08G59/4071 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/04 ,  C08K3/08 ,  C08K2003/085 ,  C08L63/04 ,  H05K1/0373 ,  H05K2201/012

摘要： There is provided herein a curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermoplastic and/or thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

公开(公告)号：US09738764B2

公开(公告)日：2017-08-22

申请号：US14987988

申请日：2016-01-05

申请人： THE BOEING COMPANY

发明人： Gwen M Gross ,  Michael P Thompson

IPC分类号： C08J5/24

CPC分类号： C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08J2363/06

摘要： Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.

公开(公告)号：US20170183366A1

公开(公告)日：2017-06-29

申请号：US15234014

申请日：2016-08-11

申请人： Guangdong Guangshan New Materials Co., Ltd.

发明人： Qingchong PAN

IPC分类号： C07F9/659 ,  C09K21/12 ,  C08J5/24

CPC分类号： C07F9/659 ,  C07F9/65815 ,  C08J5/24 ,  C08J2363/04 ,  C08J2467/00 ,  C08J2479/08 ,  C08K5/5399 ,  C08L2201/02 ,  C09K21/12

摘要： The present invention relates to a phosphazene compound and a composite metal laminate. The phosphazene compound with a partial structure of carboxylic esters has a structure as shown in Formula (I). The present invention obtains a phosphazene compound with a partial structure of carboxylic esters using an M group having specific components. The cured products of the phosphazene compound have good flame retardancy, heat resistance, mechanical properties, flame retardancy, and low dielectric constant, and are a low dielectric flame retardant material having great economic properties and being environmental friendly.

公开(公告)号：US09636867B2

公开(公告)日：2017-05-02

申请号：US14339905

申请日：2014-07-24

申请人： Cytec Industries Inc.

发明人： Leonard MacAdams ,  Dalip Kohli

IPC分类号： B29C65/00 ,  B32B7/06 ,  B32B7/12 ,  B32B27/38 ,  B32B37/00 ,  B32B37/12 ,  B32B38/10 ,  C08J5/24 ,  C09J5/02 ,  B29C65/48 ,  B29C65/50 ,  B29C65/02 ,  C09J163/00 ,  B32B5/02 ,  B32B5/12 ,  B32B38/00 ,  B29C70/54

CPC分类号： B32B37/1207 ,  B29C65/02 ,  B29C65/4835 ,  B29C65/5057 ,  B29C66/0224 ,  B29C66/1122 ,  B29C66/30322 ,  B29C66/45 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/73161 ,  B29C66/73751 ,  B29C66/7394 ,  B29C66/73941 ,  B29C70/54 ,  B29L2031/30 ,  B32B5/02 ,  B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B27/20 ,  B32B27/38 ,  B32B37/0038 ,  B32B37/025 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2038/0076 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2305/188 ,  B32B2305/74 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2605/18 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2463/02 ,  C09J5/02 ,  C09J163/00 ,  C09J163/04 ,  C09J2463/003 ,  Y10T428/249921 ,  B29K2309/08 ,  B29K2307/04 ,  B29K2277/10 ,  B29K2223/06 ,  B29K2267/00 ,  B29K2063/00

摘要： Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.

公开(公告)号：US09603244B2

公开(公告)日：2017-03-21

申请号：US12443260

申请日：2007-09-10

申请人： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

发明人： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

IPC分类号： B32B15/08 ,  C08G59/40 ,  H05K1/03 ,  C08G59/50 ,  C08G73/12 ,  C08L63/00 ,  C08L79/08 ,  B32B15/092 ,  B32B15/14 ,  C08L25/08

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4021 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/5086 ,  C08G73/12 ,  C08G73/124 ,  C08J5/24 ,  C08J2363/04 ,  C08J2363/08 ,  C08J2423/22 ,  C08J2425/08 ,  C08L25/08 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31678 ,  C08L2666/04

摘要： The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

公开(公告)号：US09577985B2

公开(公告)日：2017-02-21

申请号：US14929027

申请日：2015-10-30

申请人： VMware, Inc.

发明人： Stephen Deasy ,  Craig Newell ,  Emil Sit ,  Paul Wisner ,  David Furodet ,  Viktor Gyuris ,  Robert Meyer ,  Fanny Strudel

IPC分类号： H04M3/00 ,  H04M1/66 ,  H04M1/68 ,  H04M3/16 ,  H04B1/38 ,  H04L29/06 ,  C09J7/04 ,  B32B37/16 ,  H04W12/06 ,  H04W12/08 ,  H04W4/00 ,  G06F9/445 ,  G06F9/455 ,  G06F3/0482 ,  G06F3/0484 ,  H04M1/725 ,  H04W76/02 ,  H04L12/24 ,  H04W68/12

CPC分类号： H04L63/108 ,  B32B5/024 ,  B32B27/12 ,  B32B27/38 ,  B32B37/025 ,  B32B37/12 ,  B32B37/16 ,  B32B2037/1253 ,  C08J5/128 ,  C08J5/24 ,  C08J2363/04 ,  C08J2367/00 ,  C09J7/21 ,  C09J7/30 ,  C09J163/04 ,  C09J2463/00 ,  C09J2467/006 ,  G06F3/0482 ,  G06F3/04842 ,  G06F9/445 ,  G06F9/455 ,  G06F9/45529 ,  G06F9/45558 ,  G06F21/6245 ,  G06F21/629 ,  G06F2009/45587 ,  G06F2009/45595 ,  H04L41/0853 ,  H04L63/0272 ,  H04L63/102 ,  H04L63/105 ,  H04L63/20 ,  H04L67/34 ,  H04M1/72522 ,  H04M1/72583 ,  H04W4/50 ,  H04W4/60 ,  H04W8/22 ,  H04W12/06 ,  H04W12/08 ,  H04W68/12 ,  H04W76/10 ,  Y10T428/14

摘要： A virtual business mobile device can be provisioned on a personal mobile device, by binding a mobile application for provisioning the business mobile device to a privileged component of a host operating system of the personal mobile device, wherein the binding enables a software virtualization layer and a management service component of the mobile application to execute in a privileged mode. The mobile application is then able to download a virtual phone image for the business mobile device and security-related policy settings relating to use of the business mobile device from a mobile management server, wherein the software virtualization layer is able to launch a virtual machine for the business mobile device based on the virtual phone image. Once the virtual phone image has been downloaded, the management service component initiates a periodic attempt to establish a connection with the mobile management server to comply with the downloaded security-related policy settings.

摘要翻译： 虚拟商业移动设备可以通过将用于将业务移动设备配置的移动应用绑定到个人移动设备的主机操作系统的特权组件来配置在个人移动设备上，其中绑定启用软件虚拟化层和 移动应用的管理服务组件以特权模式执行。 移动应用然后能够从移动管理服务器下载业务移动设备的虚拟电话图像和与业务移动设备的使用相关的安全相关策略设置，其中软件虚拟化层能够启动用于 基于虚拟手机图像的商业移动设备。 一旦虚拟电话图像被下载，管理服务组件发起定期尝试建立与移动管理服务器的连接以符合下载的安全相关策略设置。

公开(公告)号：US20160340468A1

公开(公告)日：2016-11-24

申请号：US15107131

申请日：2014-12-17

申请人： Blue Cube IP LLC

发明人： Jaclyn MURPHY ,  Joey W. STORER

IPC分类号： C08G59/40 ,  H05K1/03 ,  C08L63/04 ,  C08J5/24 ,  C08G59/42 ,  C08G59/08

CPC分类号： C08G59/4071 ,  C08G59/08 ,  C08G59/4261 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/04 ,  C08K5/51 ,  C08L35/06 ,  C08L61/04 ,  C08L63/04 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0326

摘要： A formulation comprising a) an epoxy component comprising an epoxy novolac and optionally an epoxy compound selected from the group consisting of an oxazolidone-modified epoxy, a phosphorus-containing epoxy, and combinations thereof; and b) a hardener component comprising i) a phosphorus-containing compound selected from the group consisting of an oligomeric compound comprising a phosphorus composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, a phosphorus-containing filler and combinations thereof and ii) a polymeric anhydride compound selected from the group consisting of a styrene-maleic anhydride compound having a ratio of styrene to maleic anhydride of from 5:1 to 10:1, a modified styrene-maleic anhydride maleimide terpolymer, and combinations thereof, is disclosed.

摘要翻译： 一种制剂，其包含a）包含环氧酚醛清漆和任选的选自恶唑烷酮改性的环氧树脂，含磷环氧树脂及其组合的环氧化合物的环氧组分; 和b）硬化剂组分，其包含i）含磷化合物，其选自包含磷组合物的低聚化合物，所述磷组分是醚化的甲阶酚醛与9,10-二氢-9-氧杂-10-磷杂菲的反应产物 -10-氧化物，含磷填料及其组合，和ii）选自苯乙烯与马来酸酐的比例为5:1至10:1的苯乙烯 - 马来酸酐化合物的聚合酐化合物， 公开了改性苯乙烯 - 马来酸酐马来酰亚胺三元共聚物及其组合。

公开(公告)号：US09499692B2

公开(公告)日：2016-11-22

申请号：US14275093

申请日：2014-05-12

申请人： Momentive Specialty Chemicals Inc.

发明人： Larry Steven Corley ,  Robert Dale Farris ,  Carlton E. Ash

IPC分类号： B32B27/04 ,  B32B27/38 ,  C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  C08G59/06 ,  C08G59/62 ,  C08J5/04 ,  C08J5/24

CPC分类号： C08J5/042 ,  B32B27/04 ,  B32B27/38 ,  C08G59/063 ,  C08G59/245 ,  C08G59/621 ,  C08J5/04 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08L63/00 ,  C08L63/04

摘要： Compositions and methods for forming epoxy resin are provided, and compositions and methods for forming epoxy resin composites are provided. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component comprising a glycidyl ether of an aryl substituted phenolic compound, a curing agent component, and a substrate. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component and a curing agent component comprising an aryl substituted phenolic compound, and a substrate.

摘要翻译： 提供了用于形成环氧树脂的组合物和方法，并且提供了用于形成环氧树脂复合材料的组合物和方法。 在一个实施方案中，复合材料包含环氧树脂组合物，其包含环氧树脂组分，其包含芳基取代的酚类化合物的缩水甘油醚，固化剂组分和底物。 在一个实施方案中，复合材料包含环氧树脂组合物，其包含环氧树脂组分和包含芳基取代的酚类化合物的固化剂组分和底物。