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公开(公告)号：US12098273B2
公开(公告)日：2024-09-24
申请号：US17262320
申请日：2019-07-19
发明人： Yasushi Yamanaka , Hidekazu Shoji , Rina Takeuchi
IPC分类号： C08L67/02 , B32B5/08 , B32B15/085 , B32B15/088 , B32B15/092 , B32B27/28 , B32B27/32 , B32B27/34 , B32B27/38 , C08G77/04 , C08J5/04 , C08L83/04 , B29C65/16 , C08J3/22
CPC分类号： C08L67/02 , B32B5/08 , B32B15/085 , B32B15/088 , B32B15/092 , B32B27/285 , B32B27/32 , B32B27/34 , B32B27/38 , C08J5/043 , C08L83/04 , B29C65/16 , B32B2264/108 , B32B2274/00 , C08G77/04 , C08J3/226 , C08L2205/025 , C08L2205/035 , C08L67/02 , C08K7/14 , C08L23/0869 , C08L63/00 , C08L67/02 , C08L83/04 , C08L67/02 , C08L67/02 , C08L23/0869 , C08L63/04 , C08L83/04 , C08K7/14 , C08L67/02 , C08L69/00 , C08L23/0869 , C08L63/00 , C08L83/04 , C08K7/14
摘要： A polybutylene terephthalate resin composition, comprising comprising a thermoplastic resin (A) containing a polybutylene terephthalate resin and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 30 parts by mass of an elastomer (B), from 0.3 to 4 parts by mass of an epoxy compound (C), from 15 to 80 parts by mass of a reinforcing filler (D), and from 1 to 15 parts by mass of a masterbatch (E) containing a silicone compound with a weight-average molecular weight of 10,000 to 80,000 and a thermoplastic resin.
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公开(公告)号：US20240218112A1
公开(公告)日：2024-07-04
申请号：US18286285
申请日：2022-04-21
申请人： DIC Corporation
发明人： Shinji Onda , Kunihiro Morinaga
摘要： Provided is a phenolic resin being a reaction product of a catechol compound and an ortho-xylylene skeleton-containing compound, and having a catechol skeleton derived from the catechol compound and an ortho-xylylene skeleton derived from the ortho-xylylene skeleton-containing compound. A cured product obtained by using an epoxy resin obtained by using this phenolic resin can exhibit high heat resistance and high bending properties (bending strength, bending elastic modulus, and the like) and is thus suitably used for fiber-reinforced composite materials and fiber-reinforced resin molded products.
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3.发明公开公开(公告)号：US20240199872A1
公开(公告)日：2024-06-20
申请号：US18592905
申请日：2024-03-01
申请人： Trinseo Europe GmbH
CPC分类号： C08L63/04 , C08J5/247 , C08L19/02 , D03D25/00 , D04H1/64 , D04H3/12 , C08J2319/02 , C08J2363/04 , C08L2201/52
摘要： Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.
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公开(公告)号：US20230416522A1
公开(公告)日：2023-12-28
申请号：US18198939
申请日：2023-05-18
发明人： KRISHNAN KARUNAKARAN
CPC分类号： C08L63/04 , C08K5/315 , C08G59/245 , C08K7/14 , C08K5/21
摘要： Curable acrylate-epoxy resin blends comprising an epoxy resin, a crosslinking accelerator, a latent hardener, an acrylate monomer component, and a free radical initiator are provided. Such curable acrylate-epoxy resin blends have a low viscosity and a long pot life. Such curable acrylate-epoxy resin blends are mixed with a fiber component and optionally fillers and then heated to polymerize the acrylate monomer component to form semi-solid molding compounds having a long shelf life. Such molding compounds are molded and further heated to crosslink the epoxy resin to form shaped articles of substantially rigid composite materials.
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公开(公告)号：US11840601B2
公开(公告)日：2023-12-12
申请号：US17088354
申请日：2020-11-03
发明人： Hyun Aee Chun , Sook Yeon Park , Su Jin Park , Yun Ju Kim
IPC分类号： C08G59/30 , C08G59/32 , C08L63/00 , C08F220/18 , C08F220/56 , C08G59/24 , C08G59/42 , C08G59/68 , C08K3/22 , C08K3/36 , C08L63/04
CPC分类号： C08G59/3281 , C08F220/1802 , C08F220/1804 , C08F220/56 , C08G59/245 , C08G59/306 , C08G59/4269 , C08G59/686 , C08K3/22 , C08K3/36 , C08L63/04 , C08K2003/2227 , C08K2201/005 , C08L2203/20 , C08L2203/30
摘要： An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.
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公开(公告)号：US11725125B2
公开(公告)日：2023-08-15
申请号：US17561335
申请日：2021-12-23
发明人： Toshiyuki Takeda , Nagako Takahashi
IPC分类号： C09J123/12 , C09J11/06 , B32B37/15 , B32B15/08 , B32B27/18 , B32B27/32 , B32B27/38 , B32B7/12 , C09J163/04 , C09J151/06 , C09J123/14 , C09J7/10 , B32B38/10 , B32B37/06 , B32B37/10 , B32B37/02 , B32B37/24
CPC分类号： C09J123/12 , B32B7/12 , B32B15/08 , B32B27/18 , B32B27/32 , B32B27/38 , B32B37/06 , B32B37/153 , B32B38/10 , C09J7/10 , C09J11/06 , C09J123/14 , C09J151/06 , C09J163/04 , B32B37/02 , B32B37/10 , B32B2037/243 , B32B2309/02 , B32B2323/10 , B32B2363/00 , B32B2367/00 , B32B2377/00 , B32B2405/00 , C09J2301/208 , C09J2301/304 , C09J2400/20 , C09J2423/10 , C09J2451/00 , C09J2453/003 , C09J2463/00 , Y10T428/287 , Y10T428/2848 , C09J2451/00 , C09J2463/00 , C09J163/04 , C08L51/06 , C09J151/06 , C08L63/04
摘要： Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.
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公开(公告)号：US11674035B2
公开(公告)日：2023-06-13
申请号：US16956961
申请日：2018-12-07
发明人： Gael Pataut , Thibault Derouineau , Laura Luiz , David Doisneau
CPC分类号： C08L63/04 , B60C9/005 , B60C9/1807 , C08G59/08 , C08G59/50 , C08G59/621 , C08L2205/02
摘要： A composition of epoxide-functionalized resins comprises at least a first epoxide-functionalized novolac resin, a second epoxide-functionalized novolac resin, and a curing agent selected from phenolic or amine-type curing agents, the average molar mass of the group consisting of the entirety of the epoxidized novolac resins in the said composition being between 550 and 650 g/mol, the average epoxide functionality of the said group being between 3 and 3.5 eq epoxide/mol, and the said composition having a glass transition temperature Tg of at least 160° C.
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公开(公告)号：US20180319930A1
公开(公告)日：2018-11-08
申请号：US15775110
申请日：2016-10-12
发明人： Edward Norman Peters , Ying Na , Shuailei Ma , Jian Yang
CPC分类号： C08G59/4238 , B32B15/092 , C08G59/4246 , C08G59/4269 , C08G65/485 , C08L63/00 , C08L63/04 , C08L71/126 , H01B1/02 , H01B17/56
摘要： A method of forming a cured epoxy material includes pre-reacting a phenylene ether oligomer with an anhydride hardener before adding an epoxy resin and a curing promoter, then curing the resulting composition. The method provides an improved balance of heat resistance and toughness relative to corresponding methods in which the phenylene ether oligomer is pre-reacted with the epoxy resin prior to addition of hardener, and in which all components are mixed simultaneously. The cured epoxy material can be used in the composite core of an aluminum conductor composite core reinforced cable.
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公开(公告)号：US20180230345A1
公开(公告)日：2018-08-16
申请号：US15891636
申请日：2018-02-08
发明人： Toshiyuki TAKEDA , Nagako TAKAHASHI
IPC分类号： C09J163/04 , C09J123/14
CPC分类号： C09J163/04 , B32B7/12 , B32B27/08 , C08L2312/04 , C09J7/10 , C09J123/14 , C09J151/06 , C09J163/00 , C09J2201/134 , C09J2201/36 , C09J2423/105 , C09J2451/00 , C09J2463/00 , C09J2463/005 , C08L23/14 , C08L51/06 , C08L63/04
摘要： Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and the first adhesive layer has a viscoelastic modulus measurement value E (150) at 150° C. of 1.0×104 Pa or more and 1.0×108 Pa or less.
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公开(公告)号：US09997968B2
公开(公告)日：2018-06-12
申请号：US14361193
申请日：2012-10-02
发明人： Tetsuya Kitada
CPC分类号： H02K1/276 , C08G59/621 , C08G59/688 , C08L63/00 , C08L63/04 , H02K1/2766 , H02K5/02 , H02K15/03 , H02K2201/09 , Y10T29/49012
摘要： A solid fixing resin composition, which has excellent filling properties, and a rotor using the same are provided. The fixing resin composition is used to form a fixing member constituting a rotor which includes a rotor core (110) which has a laminate formed by lamination of a plurality of plate members, is fixed and installed on a rotating shaft, and has a plurality of hole portions (150) arranged along the peripheral portion of the rotating shaft, provided in the laminate; a magnet (120) inserted in the hole portion (150); and a fixing member (130) formed by curing a fixing resin composition, filled in the separation portion between the hole portion (150) and the magnet (120), the resin composition including a thermosetting resin (A) containing an epoxy resin; a curing agent (B); and an inorganic filler (C), in which the ICI viscosity at 150° C. of the epoxy resin is equal to or less than 3 poises.
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